JPS60110135A - Wafer sheet expanding mechanism - Google Patents
Wafer sheet expanding mechanismInfo
- Publication number
- JPS60110135A JPS60110135A JP58217581A JP21758183A JPS60110135A JP S60110135 A JPS60110135 A JP S60110135A JP 58217581 A JP58217581 A JP 58217581A JP 21758183 A JP21758183 A JP 21758183A JP S60110135 A JPS60110135 A JP S60110135A
- Authority
- JP
- Japan
- Prior art keywords
- wafer sheet
- wafer
- pellets
- sheet
- ring portion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000008188 pellet Substances 0.000 claims abstract description 41
- 230000002093 peripheral effect Effects 0.000 claims description 2
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 abstract 2
- 235000012431 wafers Nutrition 0.000 description 60
- 239000000853 adhesive Substances 0.000 description 7
- 230000001070 adhesive effect Effects 0.000 description 7
- 238000000034 method Methods 0.000 description 6
- 241000257465 Echinoidea Species 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- SGTNSNPWRIOYBX-UHFFFAOYSA-N 2-(3,4-dimethoxyphenyl)-5-{[2-(3,4-dimethoxyphenyl)ethyl](methyl)amino}-2-(propan-2-yl)pentanenitrile Chemical compound C1=C(OC)C(OC)=CC=C1CCN(C)CCCC(C#N)(C(C)C)C1=CC=C(OC)C(OC)=C1 SGTNSNPWRIOYBX-UHFFFAOYSA-N 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000011900 installation process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68318—Auxiliary support including means facilitating the separation of a device or wafer from the auxiliary support
- H01L2221/68322—Auxiliary support including means facilitating the selective separation of some of a plurality of devices from the auxiliary support
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Dicing (AREA)
Abstract
Description
【発明の詳細な説明】
［全１９１の利用分野］
未発ＩＪ＋はダイシング済みのウェハーが貼付けられた
ウェハーシートの延伸機構に関する。DETAILED DESCRIPTION OF THE INVENTION [191 Fields of Application] Undeveloped IJ+ relates to a stretching mechanism for a wafer sheet to which diced wafers are attached.
〔発明の前置］
一般に、回路パターン形成が終ったウェハーは、検査締
了後、グイボンダーに供給されるまでに次の工程を経て
行われる。まず第１」−程で個々のペレットに分割すべ
く粘着シートに貼られ、ウェハー引伸のｌ／２〜ｌ／３
位残して溝が入れられダイシングされる（ダイシング上
程）。次に第２工程で粘着力のほとんどないシートにウ
ェハーを移し換え、ウェハーのパターンを傷付けること
なくローラを押し付け１個々のペレットに分割する（ブ
レーキング工程）、その後、第３工程でペレットの裏面
よりシートを暖めながら引伸す（ウェハー引伸し工程）
。次に第４工程でウェハーリングにシートを取付ける（
ウェハーシート取付上程）。最後に第５工程でウェハー
リンクをダイボンダーのベレット供給治具に取付ける（
ペレット供給冶其取付工程）作業が行われている。この
ように、非宮に多くのｒ程を経なければならない。[Preface to the Invention] Generally, a wafer on which a circuit pattern has been formed is subjected to the following steps after inspection and before being supplied to a Gui bonder. First, in the first step, the pellets are pasted on an adhesive sheet to be divided into individual pellets, and the wafer is stretched from l/2 to l/3.
Grooves are made leaving a certain amount of space left behind, and the product is diced (upper stage of dicing). Next, in the second step, the wafer is transferred to a sheet with almost no adhesive strength, and a roller is pressed to divide the wafer into individual pellets without damaging the wafer pattern (braking step).Then, in the third step, the back side of the pellet is Enlarge the sheet while heating it up (wafer enlarging process)
. Next, in the fourth step, the sheet is attached to the wafer ring (
Wafer sheet installation step). Finally, in the fifth step, the wafer link is attached to the pellet supply jig of the die bonder (
Pellet supply equipment (installation process) work is being carried out. In this way, you have to go through many stages in your life.
そこで最近、前記多くの工程を・減らすべく、次のよう
な方法がとられている。粘着シートに貼付けられた回路
パターン検査済ウニ／＼−を個々のペレットに分割する
際、ペレット厚全部切断し、それを直接グイボンダーの
ペレット供給治具に取＋１ける。この方法は前記第２．
３．４工程がなくなり合理化できる。しかしながら、こ
の方法１よ、ペレットを突」二げ針で突りげて粘着シー
トよりＣ出力１すｌｌｌト 粘着シートが持ち１げられ
なし１ようにシート吸ｒ１を強くしなければならない。Recently, the following methods have been adopted to reduce the number of steps mentioned above. When dividing the circuit pattern-tested sea urchin/\- attached to the adhesive sheet into individual pellets, cut the entire thickness of the pellet and place it directly into the pellet supply jig of the Gui Bonder. This method is described in the second section above.
3.4 steps can be eliminated and streamlined. However, in this method 1, when the pellet is pricked with a double needle, the C output must be increased from the adhesive sheet.The sheet suction force must be increased so that the adhesive sheet is not lifted.
またペレット間隔が狭いため、ペレットを突」二げると
、突上１ｆられたペレットが傾き、隣りのベレットに接
触し、隣りのペレットが割れ、欠けを起す。In addition, since the interval between the pellets is narrow, when the pellets are pushed up, the pellets pushed up 1f tilt and come into contact with the neighboring pellets, causing the neighboring pellets to crack and chip.
このような欠点は、例えば特公昭５８−４６８５９号〜
公報に示すように、粘着シー）ｉこ貼り付（すられた回
路パターン検査済つエノ＼−をペレット厚全部切断して
個々のペレットに分割し、それをつｘ バー ン−ｌ・
の延伸機構に取付けてウェハシートを引伸し、その後ウ
ェハ−シートをグイポンターのペレット供給冶具に取付
ける方法によって解消される。即ち、ウニ／Ｘ−シート
が・引伸され張力力く増すため、ウェハ−シート吸着が
不用になる。またウェハーシートを引伸すことによりペ
レット間隔が広がり、ペレットの割れ、欠けがなくなる
。Such drawbacks can be seen, for example, in Japanese Patent Publication No. 58-46859~
As shown in the publication, the adhesive sheet (adhesive sheet) pasted (smooth circuit pattern inspected) is cut through the entire thickness of the pellet, divided into individual pellets, and then cut into individual pellets.
This problem can be solved by attaching the wafer sheet to a stretching mechanism of the above to stretch the wafer sheet, and then attaching the wafer sheet to a Guiponter's pellet supply jig. That is, since the sea urchin/X-sheet is stretched and the tension increases, wafer-sheet suction becomes unnecessary. In addition, by stretching the wafer sheet, the distance between the pellets increases, eliminating cracking and chipping of the pellets.
しかしながら、このウェハ−シートの延伸機構はペレッ
トの裏面側に上下動可能に円筒状のピストンが配設され
ており、このピストンの上下動によってウェハーシート
が引伸されるので、ウェハーシートの延伸機構よりウェ
ハシートを取外し、その後ウェハーシートをグイボンダ
ー又はグイ詰装置のペレット供給治具に取付けなければ
ならない。However, this wafer sheet stretching mechanism is equipped with a cylindrical piston that can move up and down on the back side of the pellet, and the wafer sheet is stretched by the vertical movement of this piston. The wafer sheet must be removed, and then the wafer sheet must be attached to the pellet supply jig of the glue bonder or gluing device.
［発明の目的］
本発明の目的は、ウニ／Ｘ−シートを引伸した後、その
ままの状態でペレットをダイボンダーに供給することが
できるウェハーシートの延伸４１橋を提供することにあ
る。[Object of the Invention] An object of the present invention is to provide a stretched wafer sheet 41 bridge that can feed the pellets as they are to a die bonder after stretching the sea urchin/X-sheet.
［発明の実施例］
以下、本発明の一実施例を第１図により説明する。ウェ
ハーフレームｌに外周部が固定されたウェハーシート２
には切断済のペレット３，３・・・か貼伺けられている
。前記ウェハーシート２を固定するウェハーシート固定
台４はＸＹ方向に駆動される１図示しないＸＹテーブル
に固定されている。またウェハーシート固定台４には穴
４ａが形成されており、この穴４ａの１．端外周部分は
上方に突出して円環部４ｂが形成されている。ウェハー
シート固定台４には複動型エアーシリンダ５が固定され
ており、このエアーシリンダ５のシリンダシャフト５ａ
はウェハーシート固定台４の」二面より突出している。[Embodiment of the Invention] An embodiment of the present invention will be described below with reference to FIG. Wafer sheet 2 whose outer periphery is fixed to wafer frame l
There are cut pellets 3, 3... pasted on them. A wafer sheet fixing table 4 for fixing the wafer sheet 2 is fixed to an XY table (not shown) that is driven in the XY directions. Further, a hole 4a is formed in the wafer sheet fixing base 4, and 1. The outer circumferential portion of the end protrudes upward to form an annular portion 4b. A double-acting air cylinder 5 is fixed to the wafer sheet fixing base 4, and the cylinder shaft 5a of this air cylinder 5
protrudes from the two sides of the wafer sheet fixing base 4.
エアーシリンダ５のエアー接続１１５ｂ、５ｃにはバイ
ブロ、７の一端が接続されており、バイブロ、７の他端
は図示しない電磁ν［ブｔを介してエアーコンプレッサ
に接続されていル、前記シリンダシャフト５ａの」二鎖
には、引伸し板８が丙寅されており、この引伸し板８に
は前記ウェハーシート固定台４の円環部４ｂにほぼウェ
ハーシート２の厚さの隙間を有する穴８ａが形成されて
いる。引伸し板８の穴８ａの下端外周部分は下方に突出
して円環８１！、８ｂが形成されている。One end of a vibro, 7 is connected to the air connections 115b, 5c of the air cylinder 5, and the other end of the vibro, 7 is connected to an air compressor via an electromagnetic ν (not shown). An enlarger plate 8 is attached to the second chain of 5a, and this enlarger plate 8 has a hole 8a having a gap approximately the thickness of the wafer sheet 2 in the annular portion 4b of the wafer sheet fixing base 4. It is formed. The outer peripheral portion of the lower end of the hole 8a of the enlarger plate 8 protrudes downward to form a ring 81! , 8b are formed.
なお１図中、１０はｉす記つェハーソート固に台４の穴
４ａに配設されてペレット３を下方より突上げる突上げ
針で１図示しない上下駆動１段で」。In Figure 1, numeral 10 denotes a push-up needle which is disposed in the hole 4a of the wafer sorting table 4 and pushes up the pellet 3 from below.
下動させられる。１ｌｔｆ、ペレット３のＬ力に配設さ
れペレット３を真空吸着するコレットで１図示しない上
下駆動手段及びＸＹ方向駆動手段で移動させられ、ペレ
ット３を吸着してグイポンターのホンディング位置又は
グイ位置決め部に移送する。be moved down. 1ltf, a collet disposed in the L force of the pellet 3 and vacuum-adsorbing the pellet 3 is moved by a vertical driving means (not shown) and an XY-direction driving means, and adsorbs the pellet 3 to the honding position of the Gui ponter or the Gui positioning part. Transfer to.
次に作用について説明する。まず第１図（ａ）に示すよ
うに、ウェハーシート固定台４の円環部４ｂ上にウェハ
ーシート２を＆置する０次にエアー接続［１５ｂよりエ
アーがエアーシリンダ５に供給されると、シリンダシャ
フト５ａは引込む、これにより、同図（ｂ）に示すよう
に引伸し板８の円環部８ｂがウェハーシート２を押しな
がらウェハーシート２がウェハーシート固定台４に当る
まで引伸し板８は下降する。この時、ウェハーシート２
は引伸され、ペレット３間の間隔は広げられる。その後
は突上げ針ｌＯが上昇してペレット３を突Ｉこげ、コレ
ット１１か下降して突上げられたペレット３を吸着して
」二昇する。そして、グイポングーのホンディング位置
又はダイ位置決め位置にグイ３を移送する。Next, the effect will be explained. First, as shown in FIG. 1(a), the wafer sheet 2 is placed on the annular portion 4b of the wafer sheet fixing table 4, and the air is connected to the next air connection [15b] When air is supplied to the air cylinder 5, The cylinder shaft 5a is retracted, and as a result, the enlarging plate 8 is lowered until the wafer sheet 2 hits the wafer sheet fixing base 4 while the annular portion 8b of the enlarging plate 8 pushes the wafer sheet 2, as shown in FIG. do. At this time, wafer sheet 2
is stretched and the spacing between the pellets 3 is widened. Thereafter, the push-up needle 10 rises to strike the pellet 3, and the collet 11 descends to adsorb the pushed-up pellet 3 and lift it up. Then, the gui 3 is transferred to the honding position or die positioning position of the gui pongoo.
このように、ウェハーシート２の上下から円環部４ｂと
円環部８ｂとでウェハ−シート２を引伸すので、ウニ／
＼−シートの延伸機構はグイボンダー装置又はダイ冶其
詰め装置の中に組込むことができる。従って、ウェハ−
シートの延伸機構よりウェハーシート２を取外してグイ
ポンターのペレット供給治具に取付ける作業が不用とな
り、工程は引伸し板８を手で押し下げ、ねじ２０をウェ
ハ−シート固定台４に螺合させ、引伸し板８をウニバー
シート固定台４に固定してなる。このように構成しても
前記実施例と同様の効果が１１）られ施例はウェハーシ
ート固定台４の穴４Ｃを前記実施例の穴４ａより大きく
形成し、前記実施例の円環部４ｂを別部材よりなる円環
部材２１によって構成してなる。また前記実施例の引伸
し板８も前記実施例の円環部８ｂを別部材よりなる円環
部材２２によって構成してなる。In this way, since the wafer sheet 2 is stretched by the annular part 4b and the annular part 8b from above and below, the sea urchin/
- The sheet stretching mechanism can be integrated into the bonder or die-filling device. Therefore, the wafer
There is no need to remove the wafer sheet 2 from the sheet stretching mechanism and attach it to the pellet supply jig of the Gui Ponter, and the process consists of pushing down the enlarger plate 8 by hand, screwing the screws 20 into the wafer sheet fixing base 4, and removing the enlarger plate. 8 is fixed to the Univer seat fixing base 4. Even with this configuration, the same effects as in the above embodiment can be obtained (11). In this embodiment, the hole 4C of the wafer sheet fixing table 4 is formed larger than the hole 4a in the above embodiment, and the annular portion 4b in the above embodiment is It is constituted by an annular member 21 made of a separate member. Further, the enlarging plate 8 of the embodiment described above also has the annular portion 8b of the embodiment described above constituted by an annular member 22 made of a separate member.
そこで、ウェハーシート２の引伸しは、まずウェハーシ
ート２をウェハシート固定台４に・載置し、ねじ２３で
ウェハーフレームｌをウェハーシート固定台４に固定す
る。次に円環部材２２をウェハーシート２の上面に当て
、ウェハーシート２の下面より円環部材２１を押上げ、
円環部材２１を円環部材２２に遊合させる。これにより
、ウェハーシート２は引伸され、ペレット３間の間隔は
広げられる。Therefore, in order to enlarge the wafer sheet 2, the wafer sheet 2 is first placed on the wafer sheet fixing table 4, and the wafer frame l is fixed to the wafer sheet fixing table 4 with screws 23. Next, the annular member 22 is placed on the upper surface of the wafer sheet 2, and the annular member 21 is pushed up from the lower surface of the wafer sheet 2.
The annular member 21 is loosely engaged with the annular member 22. As a result, the wafer sheet 2 is stretched, and the intervals between the pellets 3 are widened.
第４図は本発明の第４実施例を示す。本実施例は前記第
１実施例（第１図）、第２実施例（第２図）の変形例を
示す。即ち、第１、第２実施例は引伸し板８に円環部８
ｂを設けたが、本実施例は引伸し板８に円環部８ｂを設
けてない。このように構成しても前記実施例と同様の効
果が得られる。FIG. 4 shows a fourth embodiment of the invention. This embodiment shows a modification of the first embodiment (FIG. 1) and the second embodiment (FIG. 2). That is, in the first and second embodiments, the annular portion 8 is provided on the enlarger plate 8.
b is provided, but in this embodiment, the enlarging plate 8 is not provided with the annular portion 8b. Even with this configuration, the same effects as in the embodiment described above can be obtained.
第５図は本発明の第５実施例を示す。本実施例！±ウェ
ハーシート固定台４に前記第１実施例、第２実施例に示
す円環部４ｂを設けてなく、かつ穴４ａを引伸し板８に
円環部８ｂより大きく形成してなる。このように構成し
ても前記実施例と同様の効果が得られる。FIG. 5 shows a fifth embodiment of the invention. This example! The annular portion 4b shown in the first and second embodiments is not provided on the wafer sheet fixing table 4, and the hole 4a is formed in the enlarger plate 8 to be larger than the annular portion 8b. Even with this configuration, the same effects as in the embodiment described above can be obtained.
なお、第１図の実施例においては、引伸し板８をド降さ
せたが、引伸し板８は固定で、ウニ／＼−シーＩ・固定
台４を七シＩさせてもよい。In the embodiment shown in FIG. 1, the enlarging plate 8 is lowered, but the enlarging plate 8 may be fixed and the fixed base 4 may be lowered.
［発明の効果］
以１．の説明から明らかな如く、本発明になるつ、エバ
ーシー１・の延伸機構によれば、ウニ／＼−シートを載
置又は固定する穴が形成されたウェハ−シート固定台と
、このウェハ−シート固定台に形成され前記穴の外周上
面が突出した円環部又は前記ウェハーシート固定台の穴
を通して配設される円環部材と、前記円環部又は円環部
材の上方に配設され１１１ｊ記円環部又は円環部材と協
同して前記ウェハーシートを引伸すように前記円環部又
は円環部材に遊嵌される円環部を有する引伸し板とを備
えているので、グイボンダー装置又はダイ冶具詰装；δ
の中に組込むことができ、ウェハーシートの延伸機構よ
りウェハーシートを取外してタイボンダーのペレット供
給治具に取付ける作業が不用となり、工程の簡素化によ
る合理化が計れる。[Effects of the invention] Below 1. As is clear from the description, according to the present invention, the stretching mechanism of Eversea 1 has a wafer sheet fixing table in which a hole is formed for placing or fixing the sea urchin sheet, and this wafer sheet. an annular part formed on the fixing base and with the upper surface of the outer periphery of the hole protruding, or an annular member disposed through the hole of the wafer sheet fixing base, and an annular member disposed above the annular part or the annular member, and an enlarger plate having an annular portion that is loosely fitted into the annular portion or the annular member so as to enlarge the wafer sheet in cooperation with the annular member or the annular member. Jig packing; δ
This eliminates the need to remove the wafer sheet from the wafer sheet stretching mechanism and attach it to the pellet supply jig of the tie bonder, streamlining the process by simplifying it.
第１図は本発明の第１実施例を示し、（ａ）はウェハー
シート引伸し前の断面図、（ｂ）はウェハーシート引伸
し後の断面図、第２図、第３図。
第４図、第５図は本発明の第２、第３、第４、第５実施
例を示す断面図である。
２１１ａ・ウェハーシート、３・拳−ペレット、４・−
・ウェハーシート固定台、４ａ＊−・穴、４ｂφ・拳固
環部、 ８・・・引伸し板、８ａ−φ・穴、 ８ｂ・争
赤円環部、
２１．２２・・・円環部材。
第２図
第３図
第４図
第５因FIG. 1 shows a first embodiment of the present invention, in which (a) is a cross-sectional view before the wafer sheet is expanded, (b) is a cross-sectional view after the wafer sheet is expanded, FIGS. 2 and 3. FIGS. 4 and 5 are sectional views showing second, third, fourth, and fifth embodiments of the present invention. 211a・Wafer sheet, 3・Fist-pellet, 4・-
・Wafer sheet fixing base, 4a*-・hole, 4bφ・fist ring part, 8...enlarger plate, 8a-φ・hole, 8b・red ring part, 21.22... circular member. Figure 2 Figure 3 Figure 4 Figure 5
Claims (1)
トを引伸すウェハーシートの延伸４１４％ｉにおいて、
ウェハーシートを載置又は固定する穴が形成されたウェ
ハーシート固定台と、このウエハーンートｊａｉｌ定台
に形成され前記穴の外周上面が突出した円環部×は前記
ウェハーシート固定台の穴を通して配設される円環部材
と、前記円環部又は１’ｌ ｌ；部材のｌ力に配設され
前記円環部又は円環部材と協同して＋ｉｉｊ記ウェハー
シートを引伸すように＋ｉｉ＋記円環部又は円環部材に
遊嵌される円環部を看する引伸し板とを備えたことを特
徴とするウェハーシートの延伸機構。At 414% i of stretching the wafer sheet, which stretches the wafer sheet to which pellets are attached after cutting the wafer,
A wafer sheet fixing base in which a hole for placing or fixing a wafer sheet is formed, and an annular portion x formed on the wafer sheet fixing base with the outer peripheral upper surface of the hole protruding are arranged through the holes in the wafer sheet fixing base. an annular member disposed in the annular member; A wafer sheet stretching mechanism characterized by comprising an enlarger plate for viewing an annular portion or an annular portion loosely fitted into an annular member.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58217581A JPS60110135A (en) | 1983-11-18 | 1983-11-18 | Wafer sheet expanding mechanism |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58217581A JPS60110135A (en) | 1983-11-18 | 1983-11-18 | Wafer sheet expanding mechanism |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60110135A true JPS60110135A (en) | 1985-06-15 |
| JPH0144018B2 JPH0144018B2 (en) | 1989-09-25 |
Family
ID=16706519
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58217581A Granted JPS60110135A (en) | 1983-11-18 | 1983-11-18 | Wafer sheet expanding mechanism |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60110135A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61179751U (en) * | 1985-04-26 | 1986-11-10 | ||
| JPS63102237U (en) * | 1986-12-23 | 1988-07-02 | ||
| JPH01173737A (en) * | 1987-12-28 | 1989-07-10 | Shinkawa Ltd | Wafer feeder |
| JP2004327714A (en) * | 2003-04-24 | 2004-11-18 | Nec Machinery Corp | Expanding device for wafer sheet |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS504543A (en) * | 1973-05-16 | 1975-01-17 | ||
| JPS544062A (en) * | 1977-06-13 | 1979-01-12 | Hitachi Ltd | Wafer extender |
| JPS5728949A (en) * | 1980-07-30 | 1982-02-16 | Saburo Kano | Finishing hot water or shower apparatus annexed to external furnace type bathtub |
-
1983
- 1983-11-18 JP JP58217581A patent/JPS60110135A/en active Granted
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS504543A (en) * | 1973-05-16 | 1975-01-17 | ||
| JPS544062A (en) * | 1977-06-13 | 1979-01-12 | Hitachi Ltd | Wafer extender |
| JPS5728949A (en) * | 1980-07-30 | 1982-02-16 | Saburo Kano | Finishing hot water or shower apparatus annexed to external furnace type bathtub |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61179751U (en) * | 1985-04-26 | 1986-11-10 | ||
| JPS63102237U (en) * | 1986-12-23 | 1988-07-02 | ||
| JPH01173737A (en) * | 1987-12-28 | 1989-07-10 | Shinkawa Ltd | Wafer feeder |
| JPH069219B2 (en) * | 1987-12-28 | 1994-02-02 | 株式会社新川 | Wafer supply device |
| JP2004327714A (en) * | 2003-04-24 | 2004-11-18 | Nec Machinery Corp | Expanding device for wafer sheet |
| JP4515041B2 (en) * | 2003-04-24 | 2010-07-28 | キヤノンマシナリー株式会社 | Wafer sheet expander |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0144018B2 (en) | 1989-09-25 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |