JPH0144018B2 - - Google Patents
Info
- Publication number
- JPH0144018B2 JPH0144018B2 JP21758183A JP21758183A JPH0144018B2 JP H0144018 B2 JPH0144018 B2 JP H0144018B2 JP 21758183 A JP21758183 A JP 21758183A JP 21758183 A JP21758183 A JP 21758183A JP H0144018 B2 JPH0144018 B2 JP H0144018B2
- Authority
- JP
- Japan
- Prior art keywords
- wafer sheet
- wafer
- pellet
- sheet
- annular portion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000008188 pellet Substances 0.000 claims description 43
- 230000002093 peripheral effect Effects 0.000 claims description 4
- 239000000853 adhesive Substances 0.000 description 6
- 230000001070 adhesive effect Effects 0.000 description 6
- 238000000034 method Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 2
- 238000012856 packing Methods 0.000 description 2
- 238000001179 sorption measurement Methods 0.000 description 2
- 238000005336 cracking Methods 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68318—Auxiliary support including means facilitating the separation of a device or wafer from the auxiliary support
- H01L2221/68322—Auxiliary support including means facilitating the selective separation of some of a plurality of devices from the auxiliary support
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Dicing (AREA)
Description
【発明の詳細な説明】
［発明の利用分野］
本発明は、ウエハーシート上に貼付けられたペ
レツトを下方より突上げ針で突上げ、この突上げ
られたペレツトをコレツトで吸着してピツクアツ
プするペレツトピツクアツプ装置に関する。[Detailed Description of the Invention] [Field of Application of the Invention] The present invention is directed to a pellet sticking to a wafer sheet that is pushed up from below with a push-up needle, and the pushed-up pellet is attracted by a collet to be picked up. This invention relates to a pickup device.
［発明の背景］
一般に、回路パターン形成が終つたウエハー
は、検査終了後、ダイボンダーに供給されるまで
に次の工程を経て行われる。まず第１工程で個々
のペレツトに分割すべく粘着シートに貼られ、ウ
エハー厚の1/2〜1/3位残して溝が入れられダイシ
ングされる（ダイシング工程）。次に第２工程で
粘着力のほとんどないシートにウエハーを移し換
え、ウエハーのパターンを傷付けることなくロー
ラを押し付け、個々のペレツトに分割する（ブレ
ーキング工程）。その後、第３工程でペレツトの
裏面よりシートを暖めながら引伸す（ウエハー引
伸し工程）。次に第４工程でウエハーリングにシ
ートを取付ける（ウエハーシート取付工程）。最
後に第５工程でウエハーリングをダイボンダーの
ペレツト供給治具に取付ける（ペレツト供給治具
取付工程）作業が行われている。このように、非
常に多くの工程を経なければならない。[Background of the Invention] Generally, a wafer on which a circuit pattern has been formed is subjected to the following steps after inspection and before being supplied to a die bonder. First, in the first step, the wafer is pasted on an adhesive sheet to be divided into individual pellets, grooves are made leaving about 1/2 to 1/3 of the wafer thickness, and the wafer is diced (dicing step). Next, in the second step, the wafer is transferred to a sheet with almost no adhesive strength, and a roller is pressed against it without damaging the wafer pattern, dividing it into individual pellets (breaking step). Thereafter, in the third step, the sheet is stretched from the back side of the pellet while being warmed (wafer stretching step). Next, in the fourth step, the sheet is attached to the wafer ring (wafer sheet attaching step). Finally, in the fifth step, the wafer ring is attached to the pellet supply jig of the die bonder (pellet supply jig attachment step). In this way, a large number of steps have to be completed.
そこで最近、前記多くの工程を減らすべく、次
のような方法がとられている。粘着シートに貼付
けられた回路パターン検査済ウエハーを個々のペ
レツトに分割する際、ペレツト厚全部切断し、そ
れを直接ダイボンダーのペレツト供給治具に取付
ける。この方法は前記第２、３、４工程がなくな
り合理化できる。しかしながら、この方法は、ペ
レツトの突上げ針で突上げて粘着シートよりはが
す時、粘着シートが持ち上げられないようにシー
ト吸着を強くしなければならない。またペレツト
間隔が狭いため、ペレツトを突上げると、突上げ
られたペレツトが傾き、隣りのペレツトに接触
し、隣りのペレツトが割れ、欠けを起す。 Therefore, recently, the following methods have been adopted in order to reduce the number of steps mentioned above. When dividing a circuit pattern tested wafer pasted onto an adhesive sheet into individual pellets, the entire thickness of the pellet is cut and the cut is directly attached to the pellet supply jig of the die bonder. This method can be streamlined by eliminating the second, third, and fourth steps. However, in this method, when the pellet is pushed up with a push-up needle and peeled off from the adhesive sheet, the sheet adsorption must be strong so that the adhesive sheet is not lifted. Furthermore, since the intervals between the pellets are narrow, when the pellets are pushed up, the pushed up pellets tilt and come into contact with neighboring pellets, causing the neighboring pellets to crack and chip.
このような欠点は、例えば特公昭58−46859号
公報に示すように、粘着シートに貼り付けられた
回路パターン検査済ウエハーをペレツト厚全部切
断して個々のペレツトに分割し、それをウエハー
シートの延伸機構に取付けてウエハシートを引伸
し、その後ウエハーシートをダイボンダーのペレ
ツト供給治具に取付ける方法によつて解消され
る。即ち、ウエハーシートが引伸され張力が増す
ため、ウエハーシート吸着が不用になる。またウ
エハーシートを引伸すことによりペレツト間隔が
広がり、ペレツトの割れ、欠けがなくなる。 These drawbacks can be overcome by cutting a wafer with a circuit pattern inspected pasted onto an adhesive sheet into individual pellets by cutting the entire thickness of the wafer, and dividing the wafer into individual pellets, as shown in Japanese Patent Publication No. 58-46859. This problem can be solved by attaching the wafer sheet to a stretching mechanism to stretch the wafer sheet, and then attaching the wafer sheet to a pellet supply jig of a die bonder. That is, since the wafer sheet is stretched and the tension is increased, wafer sheet adsorption becomes unnecessary. Furthermore, by stretching the wafer sheet, the distance between the pellets increases, eliminating cracking and chipping of the pellets.
しかしながら、このウエハーシートの延伸機構
はペレツトの裏面側に上下動可能に円筒状のピス
トンが配設されており、このピストンの上下動に
よつてウエハーシートが引伸されるので、ウエハ
ーシートの延伸機構よりウエハシートを取外し、
その後ウエハーシートをダイボンダー又はダイ詰
装置のペレツト供給治具におけるペレツトピツク
アツプ装置に取付けなければならない。 However, this wafer sheet stretching mechanism has a cylindrical piston that is movable up and down on the back side of the pellet, and the wafer sheet is stretched by the vertical movement of this piston. Remove the wafer sheet from
The wafer sheet must then be attached to a pellet pick-up device in a pellet supply jig of a die bonder or die packing device.
［発明の目的］
本発明の目的は、ウエハーシートの延伸機構を
備えたペレツトピツクアツプ装置を提供すること
にある。[Object of the Invention] An object of the present invention is to provide a pellet pickup device equipped with a wafer sheet stretching mechanism.
［発明の実施例］
以下、本発明の一実施例を第１図により説明す
る。ウエハーフレーム１に外周部が固定されたウ
エハーシート２には切断済のペレツト３，３…が
貼付けられている。前記ウエハーシート２を固定
するウエハーシート固定台４はXY方向に駆動さ
れる図示しないXYテーブルに固定されている。
またウエハーシート固定台４には穴４ａが形成さ
れており、この穴４ａの上端外周部分は上方に突
出して円環部４ｂが形成されている。ウエハーシ
ート固定台４には複動型エアーシリンダ５が固定
されており、このエアーシリンダ５のシリンダシ
ヤフト５ａはウエハーシート固定台４の上面より
突出している。エアーシリンダ５のエアー接続口
５ｂ，５ｃにはパイプ６，７の一端が接続されて
おり、パイプ６，７の他端は図示しない電磁切替
弁を介してエアーコンプレツサに接続されてい
る。前記シリンダシヤフト５ａの上端には、引伸
し板８が固定されており、この引伸し板８には前
記ウエハーシート固定台４の円環部４ｂにほぼウ
エハーシート２の厚さの隙間を有する穴８ａが形
成されている。引伸し板８の穴８ａの下端外周部
分は下方に突出して円環部８ｂが形成されてい
る。[Embodiment of the Invention] An embodiment of the present invention will be described below with reference to FIG. Cut pellets 3, 3, . . . are attached to a wafer sheet 2 whose outer peripheral portion is fixed to a wafer frame 1. A wafer sheet fixing table 4 for fixing the wafer sheet 2 is fixed to an XY table (not shown) that is driven in the XY directions.
Further, a hole 4a is formed in the wafer sheet fixing table 4, and the outer peripheral portion of the upper end of the hole 4a protrudes upward to form an annular portion 4b. A double-acting air cylinder 5 is fixed to the wafer sheet fixing table 4, and a cylinder shaft 5a of the air cylinder 5 protrudes from the upper surface of the wafer sheet fixing table 4. One ends of pipes 6, 7 are connected to the air connection ports 5b, 5c of the air cylinder 5, and the other ends of the pipes 6, 7 are connected to an air compressor via an electromagnetic switching valve (not shown). An enlarger plate 8 is fixed to the upper end of the cylinder shaft 5a, and a hole 8a having a gap approximately the thickness of the wafer sheet 2 is formed in the annular portion 4b of the wafer sheet fixing base 4 in the enlarger plate 8. It is formed. The outer peripheral portion of the lower end of the hole 8a of the enlarging plate 8 protrudes downward to form an annular portion 8b.
なお、図中、１０は前記ウエハーシート固定台
４の穴４ａに配設されてペレツト３を下方より突
上げる突上げ針で、図示しない上下駆動手段で上
下動させられる。１１はペレツト３の上方に配設
されペレツト３を真空吸着するコレツトで、図示
しない上下駆動手段及びXY方向駆動手段で移動
させられ、ペレツト３を吸着してダイボンダーの
ボンデイング位置又はダイ位置決め部に移送す
る。 In the figure, reference numeral 10 denotes a push-up needle that is disposed in the hole 4a of the wafer sheet fixing table 4 and pushes up the pellet 3 from below, and is moved up and down by a vertical drive means (not shown). A collet 11 is arranged above the pellet 3 and vacuum-suctions the pellet 3. The collet 11 is moved by a vertical drive means and an XY-direction drive means (not shown), and attracts the pellet 3 and transfers it to the bonding position or die positioning part of the die bonder. do.
次に作用について説明する。まず第１図ａに示
すように、ウエハーシート固定台４の円環部４ｂ
上にウエハーシート２を載置する。次にエアー接
続口５ｂよりエアーがエアーシリンダ５に供給さ
れると、シリンダシヤフト５ａは引込む。これに
より、同図ｂに示すように引伸し板８の円環部８
ｂがウエハーシート２を押しながらウエハーシー
ト２がウエハーシート固定台４に当るまで引伸し
板８は下降する。この時、ウエハーシート２は引
伸され、ペレツト３間の間隔は広げられる。その
後は突上げ針１０が上昇してペレツト３を突上
げ、コレツト１１が下降して突上げられたペレツ
ト３を吸着して上昇する。そして、ダイボンダー
のボンデイング位置又はダイ位置決め位置にダイ
３を移送する。 Next, the effect will be explained. First, as shown in FIG. 1a, the annular portion 4b of the wafer sheet fixing table 4
A wafer sheet 2 is placed on top. Next, when air is supplied to the air cylinder 5 from the air connection port 5b, the cylinder shaft 5a is retracted. As a result, as shown in FIG.
The enlarging plate 8 is lowered while pushing the wafer sheet 2 until the wafer sheet 2 hits the wafer sheet fixing table 4. At this time, the wafer sheet 2 is stretched and the intervals between the pellets 3 are widened. Thereafter, the push-up needle 10 rises to push up the pellet 3, and the collet 11 descends to attract the pushed-up pellet 3 and rise. Then, the die 3 is transferred to the bonding position or die positioning position of the die bonder.
このように、ウエハーシート２の上下から円環
部４ｂと円環部８ｂとでウエハーシート２を引伸
すので、ウエハーシートの延伸機構はダイボンダ
ー装置又はダイ治具詰め装置の中に組込むことが
できる。従つて、ウエハーシートの延伸機構より
ウエハーシート２を取外してダイボンダーのペレ
ツト供給治具に取付ける作業が不用となり、工程
の簡素化による合理化が計れる。 In this way, since the wafer sheet 2 is stretched by the annular portion 4b and the annular portion 8b from above and below the wafer sheet 2, the wafer sheet stretching mechanism can be incorporated into a die bonder device or a die jig packing device. . Therefore, there is no need to remove the wafer sheet 2 from the wafer sheet stretching mechanism and attach it to the pellet supply jig of the die bonder, and the process can be simplified and streamlined.
［発明の効果］
以上の説明から明らかなように、本発明によれ
ば、ペレツトピツクアツプ装置においてウエハー
シートを引伸すことができるので、従来のように
ウエハーシートの延伸機構よりウエハーシートを
取外してペレツトピツクアツプ装置に取付ける作
業が不要となり、工程の簡単化による合理化が図
れる。[Effects of the Invention] As is clear from the above description, according to the present invention, a wafer sheet can be stretched in a pellet pick-up device. There is no need to attach the pellet to the pellet pickup device, and the process can be simplified and streamlined.
また引伸し板を上下駆動手段によつて上下動さ
せてウエハーシートを引伸すので、ウエハーシー
トを自動的に引伸すことができる。更にウエハー
シートが載置されるウエハーシート固定台は上下
動させなく、前記のように引伸し板を上下動させ
るので、ウエハーシートの上下位置は不動であ
り、突上げ針の上下動量は少なくてすみ、生産性
に優れている。 Furthermore, since the wafer sheet is enlarged by moving the enlarging plate up and down by the vertical drive means, the wafer sheet can be automatically enlarged. Furthermore, the wafer sheet fixing table on which the wafer sheet is placed does not move up and down, but the enlarger plate moves up and down as described above, so the up and down position of the wafer sheet does not move, and the amount of up and down movement of the push-up needle is small. , excellent productivity.
第１図は本発明の第１実施例を示し、ａはウエ
ハーシート引伸し前の断面図、ｂはウエハーシー
ト引伸し後の断面図である。
２……ウエハーシート、３……ペレツト、４…
…ウエハーシート固定台、４ａ……穴、４ｂ……
円環部、５……エアーシリンダ、８……引伸し
板、８ａ……穴、８ｂ……円環部、１０……突上
げ針、１１……コレツト。
FIG. 1 shows a first embodiment of the present invention, in which a is a sectional view before the wafer sheet is enlarged, and b is a sectional view after the wafer sheet is enlarged. 2...Wafer sheet, 3...Pellet, 4...
...Wafer sheet fixing stand, 4a...hole, 4b...
Annular part, 5... Air cylinder, 8... Enlarger plate, 8a... Hole, 8b... Annular part, 10... Push-up needle, 11... Collection.
Claims (1)
下方より突上げ針で突上げ、この突上げられたペ
レツトをコレツトで吸着してピツクアツプするペ
レツトピツクアツプ装置において、中央に穴が形
成され、かつ該穴の上端外周部分に上方に突出し
て円環部が形成され、ウエハー切断後のペレツト
が貼付けられたウエハーシートが載置固定される
ウエハーシート固定台と、このウエハーシート固
定台の上方に配設され、該ウエハーシート固定台
の円環部と協同して前記ウエハーシートを引伸す
ように前記円環部に遊嵌される円環部を有する引
伸し板と、この引伸し板を上下動させる上下駆動
手段とを備えたことを特徴とするペレツトピツク
アツプ装置。1. In a pellet pick-up device in which a pellet stuck on a wafer sheet is pushed up from below with a push-up needle and the pushed-up pellet is picked up by a collect, a hole is formed in the center, and a hole is formed in the center. A wafer sheet fixing table having an annular portion projecting upwardly on the outer peripheral portion of the upper end, on which a wafer sheet with pellets pasted after cutting the wafer is placed and fixed, and arranged above the wafer sheet fixing table, an enlarging plate having an annular portion loosely fitted into the annular portion so as to cooperate with the annular portion of the wafer sheet fixing base to enlarge the wafer sheet; and a vertical drive means for vertically moving the enlarging plate. A pellet pick-up device characterized by comprising:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58217581A JPS60110135A (en) | 1983-11-18 | 1983-11-18 | Wafer sheet expanding mechanism |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58217581A JPS60110135A (en) | 1983-11-18 | 1983-11-18 | Wafer sheet expanding mechanism |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60110135A JPS60110135A (en) | 1985-06-15 |
| JPH0144018B2 true JPH0144018B2 (en) | 1989-09-25 |
Family
ID=16706519
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58217581A Granted JPS60110135A (en) | 1983-11-18 | 1983-11-18 | Wafer sheet expanding mechanism |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60110135A (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61179751U (en) * | 1985-04-26 | 1986-11-10 | ||
| JPS63102237U (en) * | 1986-12-23 | 1988-07-02 | ||
| JPH069219B2 (en) * | 1987-12-28 | 1994-02-02 | 株式会社新川 | Wafer supply device |
| JP4515041B2 (en) * | 2003-04-24 | 2010-07-28 | キヤノンマシナリー株式会社 | Wafer sheet expander |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS504543A (en) * | 1973-05-16 | 1975-01-17 | ||
| JPS544062A (en) * | 1977-06-13 | 1979-01-12 | Hitachi Ltd | Wafer extender |
| JPS5728949A (en) * | 1980-07-30 | 1982-02-16 | Saburo Kano | Finishing hot water or shower apparatus annexed to external furnace type bathtub |
-
1983
- 1983-11-18 JP JP58217581A patent/JPS60110135A/en active Granted
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS504543A (en) * | 1973-05-16 | 1975-01-17 | ||
| JPS544062A (en) * | 1977-06-13 | 1979-01-12 | Hitachi Ltd | Wafer extender |
| JPS5728949A (en) * | 1980-07-30 | 1982-02-16 | Saburo Kano | Finishing hot water or shower apparatus annexed to external furnace type bathtub |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS60110135A (en) | 1985-06-15 |
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| Date | Code | Title | Description |
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| LAPS | Cancellation because of no payment of annual fees |