JPS5783038A - Method for die pick-up - Google Patents

Method for die pick-up

Info

Publication number
JPS5783038A
JPS5783038A JP15835880A JP15835880A JPS5783038A JP S5783038 A JPS5783038 A JP S5783038A JP 15835880 A JP15835880 A JP 15835880A JP 15835880 A JP15835880 A JP 15835880A JP S5783038 A JPS5783038 A JP S5783038A
Authority
JP
Japan
Prior art keywords
die
needle
sheet
holder
lifted
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP15835880A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6410935B2 (enFirst
Inventor
Masayuki Shimura
Yoshimitsu Kushima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinkawa Ltd
Original Assignee
Shinkawa Ltd
Shinkawa Seisakusho Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Ltd, Shinkawa Seisakusho Co Ltd filed Critical Shinkawa Ltd
Priority to JP15835880A priority Critical patent/JPS5783038A/ja
Publication of JPS5783038A publication Critical patent/JPS5783038A/ja
Publication of JPS6410935B2 publication Critical patent/JPS6410935B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7412—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support the auxiliary support including means facilitating the separation of a device or wafer from the auxiliary support
    • H10P72/7414—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support the auxiliary support including means facilitating the separation of a device or wafer from the auxiliary support the auxiliary support including means facilitating the selective separation of some of a plurality of devices from the auxiliary support
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7416—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • H10P72/742—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support used during dicing or grinding involving stretching of the auxiliary support post dicing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07337—Connecting techniques using a polymer adhesive, e.g. an adhesive based on silicone or epoxy

Landscapes

  • Die Bonding (AREA)
  • Dicing (AREA)
JP15835880A 1980-11-11 1980-11-11 Method for die pick-up Granted JPS5783038A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15835880A JPS5783038A (en) 1980-11-11 1980-11-11 Method for die pick-up

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15835880A JPS5783038A (en) 1980-11-11 1980-11-11 Method for die pick-up

Publications (2)

Publication Number Publication Date
JPS5783038A true JPS5783038A (en) 1982-05-24
JPS6410935B2 JPS6410935B2 (enFirst) 1989-02-22

Family

ID=15669918

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15835880A Granted JPS5783038A (en) 1980-11-11 1980-11-11 Method for die pick-up

Country Status (1)

Country Link
JP (1) JPS5783038A (enFirst)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5974733U (ja) * 1982-11-12 1984-05-21 株式会社日立製作所 チツプ分離機構
JPS6127239U (ja) * 1984-07-20 1986-02-18 日本電気株式会社 マウント装置
JPH01157549A (ja) * 1987-12-14 1989-06-20 Rohm Co Ltd ペレットのピックアップ方法
KR100346482B1 (ko) * 1994-12-03 2002-11-23 앰코 테크놀로지 코리아 주식회사 다이본딩의이젝팅장치

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5974733U (ja) * 1982-11-12 1984-05-21 株式会社日立製作所 チツプ分離機構
JPS6127239U (ja) * 1984-07-20 1986-02-18 日本電気株式会社 マウント装置
JPH01157549A (ja) * 1987-12-14 1989-06-20 Rohm Co Ltd ペレットのピックアップ方法
KR100346482B1 (ko) * 1994-12-03 2002-11-23 앰코 테크놀로지 코리아 주식회사 다이본딩의이젝팅장치

Also Published As

Publication number Publication date
JPS6410935B2 (enFirst) 1989-02-22

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