JPS6410093B2 - - Google Patents
Info
- Publication number
- JPS6410093B2 JPS6410093B2 JP56202814A JP20281481A JPS6410093B2 JP S6410093 B2 JPS6410093 B2 JP S6410093B2 JP 56202814 A JP56202814 A JP 56202814A JP 20281481 A JP20281481 A JP 20281481A JP S6410093 B2 JPS6410093 B2 JP S6410093B2
- Authority
- JP
- Japan
- Prior art keywords
- arm
- capillary
- position detector
- speed
- swinging arm
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/0711—Apparatus therefor
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/0711—Apparatus therefor
- H10W72/07141—Means for applying energy, e.g. ovens or lasers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/551—Materials of bond wires
- H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
- H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56202814A JPS58103148A (ja) | 1981-12-16 | 1981-12-16 | ワイヤボンディング装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56202814A JPS58103148A (ja) | 1981-12-16 | 1981-12-16 | ワイヤボンディング装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58103148A JPS58103148A (ja) | 1983-06-20 |
| JPS6410093B2 true JPS6410093B2 (https=) | 1989-02-21 |
Family
ID=16463638
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP56202814A Granted JPS58103148A (ja) | 1981-12-16 | 1981-12-16 | ワイヤボンディング装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58103148A (https=) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0744197B2 (ja) * | 1985-03-19 | 1995-05-15 | 株式会社東芝 | ボンデイング装置 |
| JPS62150838A (ja) * | 1985-12-25 | 1987-07-04 | Hitachi Ltd | 検出方法および装置 |
| JPH04332145A (ja) * | 1991-05-07 | 1992-11-19 | Shinkawa Ltd | ワイヤボンデイング装置 |
-
1981
- 1981-12-16 JP JP56202814A patent/JPS58103148A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS58103148A (ja) | 1983-06-20 |
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