JPS6395634A - 半導体装置の樹脂封止装置 - Google Patents

半導体装置の樹脂封止装置

Info

Publication number
JPS6395634A
JPS6395634A JP24167786A JP24167786A JPS6395634A JP S6395634 A JPS6395634 A JP S6395634A JP 24167786 A JP24167786 A JP 24167786A JP 24167786 A JP24167786 A JP 24167786A JP S6395634 A JPS6395634 A JP S6395634A
Authority
JP
Japan
Prior art keywords
ejector
pins
sealing
forth
chase
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP24167786A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0432537B2 (cg-RX-API-DMAC7.html
Inventor
Suekichi Tanaka
田中　末吉
Koji Tsutsumi
康次 堤
Yutaka Morita
豊 森田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP24167786A priority Critical patent/JPS6395634A/ja
Publication of JPS6395634A publication Critical patent/JPS6395634A/ja
Publication of JPH0432537B2 publication Critical patent/JPH0432537B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/40—Removing or ejecting moulded articles

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP24167786A 1986-10-09 1986-10-09 半導体装置の樹脂封止装置 Granted JPS6395634A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP24167786A JPS6395634A (ja) 1986-10-09 1986-10-09 半導体装置の樹脂封止装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP24167786A JPS6395634A (ja) 1986-10-09 1986-10-09 半導体装置の樹脂封止装置

Publications (2)

Publication Number Publication Date
JPS6395634A true JPS6395634A (ja) 1988-04-26
JPH0432537B2 JPH0432537B2 (cg-RX-API-DMAC7.html) 1992-05-29

Family

ID=17077875

Family Applications (1)

Application Number Title Priority Date Filing Date
JP24167786A Granted JPS6395634A (ja) 1986-10-09 1986-10-09 半導体装置の樹脂封止装置

Country Status (1)

Country Link
JP (1) JPS6395634A (cg-RX-API-DMAC7.html)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0448639A (ja) * 1990-06-14 1992-02-18 Toshiba Corp 半導体製造装置及び製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0448639A (ja) * 1990-06-14 1992-02-18 Toshiba Corp 半導体製造装置及び製造方法

Also Published As

Publication number Publication date
JPH0432537B2 (cg-RX-API-DMAC7.html) 1992-05-29

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