JPS6453555A - Resin molding apparatus for semiconductor device - Google Patents

Resin molding apparatus for semiconductor device

Info

Publication number
JPS6453555A
JPS6453555A JP21058587A JP21058587A JPS6453555A JP S6453555 A JPS6453555 A JP S6453555A JP 21058587 A JP21058587 A JP 21058587A JP 21058587 A JP21058587 A JP 21058587A JP S6453555 A JPS6453555 A JP S6453555A
Authority
JP
Japan
Prior art keywords
exhaust gas
gas passage
pin
pot
cope
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP21058587A
Other languages
Japanese (ja)
Other versions
JPH0687470B2 (en
Inventor
Suekichi Tanaka
Koji Tsutsumi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP21058587A priority Critical patent/JPH0687470B2/en
Publication of JPS6453555A publication Critical patent/JPS6453555A/en
Publication of JPH0687470B2 publication Critical patent/JPH0687470B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/26—Moulds
    • B29C45/34—Moulds having venting means

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

PURPOSE:To enable a package including no voids to be molded, and to enhance the quality of products, by mounting a vacuum shut-off pin which has an exhaust gas passage communicating with the inside of cavity blocks and of a pot, with being capable of advancing and retreating, in the cull section of a die. CONSTITUTION:An exhaust gas passage 15a is formed in the center section of a vacuum shut-off pin 15 which is so mounted in the cull section 16 of a cope block 9 as to be capable of sliding up and down. The cope cavity block 9 is provided with an exhaust gas passage 17, and ring seal blocks 19 and 20 are respectively mounted to upper and lower stools 3 and 2. Now, the seal blocks 19, 20, and the cope and drag cavity blocks 9, 8 form together a ring exhaust gas passage 18. The mating faces among the upper and lower stools 3, 2, and the upper and lower seal blocks 19, 20 are sealed with sealing members 21, 22, 23, further a pot 10 and a plunger 11 are respectively provided with sealing members 24 and 25. Moreover, the vacuum shut-off pin 15 is provided with both a spring 26 for returning to the original position thereof, and a rod 27 which transfers the force of an air cylinder for lowering the vacuum shut-off pin 15 downward. An exhaust gas passage 28, which leads the ring exhaust gas passage 18 to the external of a die 1, is formed in the vacuum exhauster. Accordingly, during pressure being applied to the resin, the air within the pot 10, cavities 6, 7, and the resin 14 is sufficiently prevented from intruding into the resin. a runner and the cavities, whereby the void formation in the surface and inside of a package 5 can be effectively avoided.
JP21058587A 1987-08-25 1987-08-25 Resin encapsulation equipment for semiconductor devices Expired - Lifetime JPH0687470B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP21058587A JPH0687470B2 (en) 1987-08-25 1987-08-25 Resin encapsulation equipment for semiconductor devices

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP21058587A JPH0687470B2 (en) 1987-08-25 1987-08-25 Resin encapsulation equipment for semiconductor devices

Publications (2)

Publication Number Publication Date
JPS6453555A true JPS6453555A (en) 1989-03-01
JPH0687470B2 JPH0687470B2 (en) 1994-11-02

Family

ID=16591755

Family Applications (1)

Application Number Title Priority Date Filing Date
JP21058587A Expired - Lifetime JPH0687470B2 (en) 1987-08-25 1987-08-25 Resin encapsulation equipment for semiconductor devices

Country Status (1)

Country Link
JP (1) JPH0687470B2 (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61262787A (en) * 1985-05-17 1986-11-20 松下電子工業株式会社 Large-scale integrated circuit for crt display
JPH058250A (en) * 1991-06-10 1993-01-19 Toowa Kk Method and device for resin encapsulation of electronic part
JPH055418U (en) * 1991-07-02 1993-01-26 東光電気株式会社 Mold for molding
US5366364A (en) * 1992-09-01 1994-11-22 Mitsubishi Denki Kabushiki Kaisha Plastic molding apparatus
JPH0745651A (en) * 1991-01-17 1995-02-14 Towa Kk Method for sealing electronic parts with resin
EP1134064A2 (en) * 1995-10-30 2001-09-19 Towa Corporation Resin sealing/molding apparatus for electronic parts

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61262787A (en) * 1985-05-17 1986-11-20 松下電子工業株式会社 Large-scale integrated circuit for crt display
JPH0745651A (en) * 1991-01-17 1995-02-14 Towa Kk Method for sealing electronic parts with resin
JPH058250A (en) * 1991-06-10 1993-01-19 Toowa Kk Method and device for resin encapsulation of electronic part
JPH055418U (en) * 1991-07-02 1993-01-26 東光電気株式会社 Mold for molding
US5366364A (en) * 1992-09-01 1994-11-22 Mitsubishi Denki Kabushiki Kaisha Plastic molding apparatus
US5662848A (en) * 1992-09-01 1997-09-02 Mitsubishi Denki Kabushiki Kaisha Plastic molding method for semiconductor devices
EP1134064A2 (en) * 1995-10-30 2001-09-19 Towa Corporation Resin sealing/molding apparatus for electronic parts

Also Published As

Publication number Publication date
JPH0687470B2 (en) 1994-11-02

Similar Documents

Publication Publication Date Title
CA2262975A1 (en) Process and apparatus for making a leak proof cap and body assembly
MY112442A (en) Method of sealing electronic parts with molded resin and mold employed therefor
JPS6440162A (en) Metal casting method and device opposing gravity by removing air
JPS6453555A (en) Resin molding apparatus for semiconductor device
JP2570541B2 (en) Casting equipment
EP0826477A3 (en) Method for molding thermoplastic resin
JPH03202333A (en) Injection molding device
GB8902841D0 (en) Method and apparatus for moulding a fluid settable material
JPS6140167B2 (en)
JPS57197136A (en) Mold apparatus of injection molding machine
CN111702937A (en) Precast concrete member forming process and forming device thereof
JPS57160560A (en) Pressure casting device
CN220331835U (en) Sealed effectual three-colour mould
JPS6414014A (en) Mold exterior airtightness variable pressure molding device
CN107553813A (en) A kind of mould being directly molded for sealing ring on part
JPS59139633A (en) Resin seal method of electronic part
KR900004231Y1 (en) Air controlling device for blow moulding apparatus
JPS57167210A (en) Vacuum molding machine
JP2694293B2 (en) High compression molding resin tablet molding method
JPS5668575A (en) Metal mold unit for molten metal forging
JPS57170734A (en) Method and apparatus for molding rim urethane in center injection system
JPS6459925A (en) Method and device for resin-sealed formation of semiconductor element
JPS6127163A (en) Vacuum casting device
ES8400269A1 (en) Pressure die casting machine
JPS5525359A (en) Continuous injection molding machine