JPS6373678A - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JPS6373678A
JPS6373678A JP61220235A JP22023586A JPS6373678A JP S6373678 A JPS6373678 A JP S6373678A JP 61220235 A JP61220235 A JP 61220235A JP 22023586 A JP22023586 A JP 22023586A JP S6373678 A JPS6373678 A JP S6373678A
Authority
JP
Japan
Prior art keywords
laser diode
led
photodiode
resin
leads
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP61220235A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0551192B2 (show.php
Inventor
Masahide Yamauchi
山内　眞英
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP61220235A priority Critical patent/JPS6373678A/ja
Publication of JPS6373678A publication Critical patent/JPS6373678A/ja
Publication of JPH0551192B2 publication Critical patent/JPH0551192B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)
  • Semiconductor Lasers (AREA)
  • Photo Coupler, Interrupter, Optical-To-Optical Conversion Devices (AREA)
JP61220235A 1986-09-17 1986-09-17 半導体装置 Granted JPS6373678A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP61220235A JPS6373678A (ja) 1986-09-17 1986-09-17 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61220235A JPS6373678A (ja) 1986-09-17 1986-09-17 半導体装置

Publications (2)

Publication Number Publication Date
JPS6373678A true JPS6373678A (ja) 1988-04-04
JPH0551192B2 JPH0551192B2 (show.php) 1993-07-30

Family

ID=16748006

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61220235A Granted JPS6373678A (ja) 1986-09-17 1986-09-17 半導体装置

Country Status (1)

Country Link
JP (1) JPS6373678A (show.php)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02125688A (ja) * 1988-11-04 1990-05-14 Sony Corp 半導体レーザ装置
JPH02125687A (ja) * 1988-11-04 1990-05-14 Sony Corp 半導体レーザ装置
JPH02191389A (ja) * 1988-10-28 1990-07-27 Matsushita Electric Ind Co Ltd 半導体レーザ装置
JPH0523563U (ja) * 1991-07-17 1993-03-26 ソニー株式会社 半導体レーザ装置
EP1020933A1 (en) * 1999-01-13 2000-07-19 Sharp Kabushiki Kaisha Photocoupler device, method for fabricating the same, and lead frame for photocoupler device

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5827952U (ja) * 1981-08-18 1983-02-23 株式会社東芝 光結合半導体装置
JPS59119774A (ja) * 1982-12-25 1984-07-11 Toshiba Corp 光結合半導体装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5827952U (ja) * 1981-08-18 1983-02-23 株式会社東芝 光結合半導体装置
JPS59119774A (ja) * 1982-12-25 1984-07-11 Toshiba Corp 光結合半導体装置

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02191389A (ja) * 1988-10-28 1990-07-27 Matsushita Electric Ind Co Ltd 半導体レーザ装置
JPH02125688A (ja) * 1988-11-04 1990-05-14 Sony Corp 半導体レーザ装置
JPH02125687A (ja) * 1988-11-04 1990-05-14 Sony Corp 半導体レーザ装置
JPH0523563U (ja) * 1991-07-17 1993-03-26 ソニー株式会社 半導体レーザ装置
EP1020933A1 (en) * 1999-01-13 2000-07-19 Sharp Kabushiki Kaisha Photocoupler device, method for fabricating the same, and lead frame for photocoupler device
US6507035B1 (en) 1999-01-13 2003-01-14 Sharp Kabushiki Kaisha Photocoupler device, method for fabricating the same, and lead frame for photocoupler device

Also Published As

Publication number Publication date
JPH0551192B2 (show.php) 1993-07-30

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term