JPS6370155U - - Google Patents
Info
- Publication number
- JPS6370155U JPS6370155U JP16306486U JP16306486U JPS6370155U JP S6370155 U JPS6370155 U JP S6370155U JP 16306486 U JP16306486 U JP 16306486U JP 16306486 U JP16306486 U JP 16306486U JP S6370155 U JPS6370155 U JP S6370155U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor chip
- semiconductor package
- semiconductor
- chip
- attached
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16306486U JPS6370155U (enExample) | 1986-10-24 | 1986-10-24 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16306486U JPS6370155U (enExample) | 1986-10-24 | 1986-10-24 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6370155U true JPS6370155U (enExample) | 1988-05-11 |
Family
ID=31090913
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16306486U Pending JPS6370155U (enExample) | 1986-10-24 | 1986-10-24 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6370155U (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02278856A (ja) * | 1989-04-20 | 1990-11-15 | Nec Corp | 半導体集積回路装置 |
-
1986
- 1986-10-24 JP JP16306486U patent/JPS6370155U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02278856A (ja) * | 1989-04-20 | 1990-11-15 | Nec Corp | 半導体集積回路装置 |