JPH0442730U - - Google Patents
Info
- Publication number
- JPH0442730U JPH0442730U JP1990083515U JP8351590U JPH0442730U JP H0442730 U JPH0442730 U JP H0442730U JP 1990083515 U JP1990083515 U JP 1990083515U JP 8351590 U JP8351590 U JP 8351590U JP H0442730 U JPH0442730 U JP H0442730U
- Authority
- JP
- Japan
- Prior art keywords
- power semiconductor
- die
- bonded
- semiconductor element
- heat spreader
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H10W90/754—
Landscapes
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990083515U JP2505195Y2 (ja) | 1990-08-06 | 1990-08-06 | 電力半導体装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990083515U JP2505195Y2 (ja) | 1990-08-06 | 1990-08-06 | 電力半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0442730U true JPH0442730U (enExample) | 1992-04-10 |
| JP2505195Y2 JP2505195Y2 (ja) | 1996-07-24 |
Family
ID=31631246
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990083515U Expired - Fee Related JP2505195Y2 (ja) | 1990-08-06 | 1990-08-06 | 電力半導体装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2505195Y2 (enExample) |
-
1990
- 1990-08-06 JP JP1990083515U patent/JP2505195Y2/ja not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JP2505195Y2 (ja) | 1996-07-24 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |