JPS6367358B2 - - Google Patents
Info
- Publication number
- JPS6367358B2 JPS6367358B2 JP54106367A JP10636779A JPS6367358B2 JP S6367358 B2 JPS6367358 B2 JP S6367358B2 JP 54106367 A JP54106367 A JP 54106367A JP 10636779 A JP10636779 A JP 10636779A JP S6367358 B2 JPS6367358 B2 JP S6367358B2
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- resin film
- hole
- circuit device
- metal frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H10W70/60—
-
- H10W70/09—
-
- H10W70/093—
-
- H10W72/073—
-
- H10W72/874—
-
- H10W90/00—
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10636779A JPS5630782A (en) | 1979-08-20 | 1979-08-20 | Electronic circuit device and method of manufacturing same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10636779A JPS5630782A (en) | 1979-08-20 | 1979-08-20 | Electronic circuit device and method of manufacturing same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5630782A JPS5630782A (en) | 1981-03-27 |
| JPS6367358B2 true JPS6367358B2 (cg-RX-API-DMAC10.html) | 1988-12-26 |
Family
ID=14431747
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10636779A Granted JPS5630782A (en) | 1979-08-20 | 1979-08-20 | Electronic circuit device and method of manufacturing same |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5630782A (cg-RX-API-DMAC10.html) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2677842B2 (ja) * | 1988-11-17 | 1997-11-17 | ソニー株式会社 | 電子回路構造体の製造方法及び電子回路構造体 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5216166A (en) * | 1975-07-29 | 1977-02-07 | Matsushita Electric Ind Co Ltd | Semiconductor device |
| JPS586951B2 (ja) * | 1977-09-28 | 1983-02-07 | 松下電器産業株式会社 | 電子回路装置 |
-
1979
- 1979-08-20 JP JP10636779A patent/JPS5630782A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5630782A (en) | 1981-03-27 |
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