JPS6364052B2 - - Google Patents

Info

Publication number
JPS6364052B2
JPS6364052B2 JP57048541A JP4854182A JPS6364052B2 JP S6364052 B2 JPS6364052 B2 JP S6364052B2 JP 57048541 A JP57048541 A JP 57048541A JP 4854182 A JP4854182 A JP 4854182A JP S6364052 B2 JPS6364052 B2 JP S6364052B2
Authority
JP
Japan
Prior art keywords
bonding
lead
semiconductor element
bonding wire
wire
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP57048541A
Other languages
English (en)
Japanese (ja)
Other versions
JPS58165359A (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP57048541A priority Critical patent/JPS58165359A/ja
Publication of JPS58165359A publication Critical patent/JPS58165359A/ja
Publication of JPS6364052B2 publication Critical patent/JPS6364052B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W20/40—
    • H10W70/417—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H10W72/01515—
    • H10W72/01551—
    • H10W72/075—
    • H10W72/07551—
    • H10W72/325—
    • H10W72/352—
    • H10W72/50—
    • H10W72/536—
    • H10W72/5363—
    • H10W72/5522—
    • H10W72/583—
    • H10W72/59—
    • H10W72/884—
    • H10W90/736—
    • H10W90/756—

Landscapes

  • Wire Bonding (AREA)
JP57048541A 1982-03-26 1982-03-26 半導体装置 Granted JPS58165359A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57048541A JPS58165359A (ja) 1982-03-26 1982-03-26 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57048541A JPS58165359A (ja) 1982-03-26 1982-03-26 半導体装置

Publications (2)

Publication Number Publication Date
JPS58165359A JPS58165359A (ja) 1983-09-30
JPS6364052B2 true JPS6364052B2 (index.php) 1988-12-09

Family

ID=12806223

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57048541A Granted JPS58165359A (ja) 1982-03-26 1982-03-26 半導体装置

Country Status (1)

Country Link
JP (1) JPS58165359A (index.php)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7278948B2 (en) 2005-04-25 2007-10-09 American Axle & Manufacturing, Inc. “Zero” lash spherical differential assembly using spring washers
JP5299575B1 (ja) * 2011-11-04 2013-09-25 トヨタ自動車株式会社 車両用デファレンシャル装置

Also Published As

Publication number Publication date
JPS58165359A (ja) 1983-09-30

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