JPS6361794B2 - - Google Patents
Info
- Publication number
- JPS6361794B2 JPS6361794B2 JP58196507A JP19650783A JPS6361794B2 JP S6361794 B2 JPS6361794 B2 JP S6361794B2 JP 58196507 A JP58196507 A JP 58196507A JP 19650783 A JP19650783 A JP 19650783A JP S6361794 B2 JPS6361794 B2 JP S6361794B2
- Authority
- JP
- Japan
- Prior art keywords
- ink
- substrate
- holes
- hole
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000758 substrate Substances 0.000 claims description 25
- 238000000034 method Methods 0.000 claims description 13
- 238000004519 manufacturing process Methods 0.000 claims description 10
- 238000007650 screen-printing Methods 0.000 claims description 3
- 238000005530 etching Methods 0.000 description 8
- 238000001723 curing Methods 0.000 description 5
- 230000001681 protective effect Effects 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 230000001678 irradiating effect Effects 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 238000005429 filling process Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 1
- 229910021578 Iron(III) chloride Inorganic materials 0.000 description 1
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 238000009499 grossing Methods 0.000 description 1
- RBTARNINKXHZNM-UHFFFAOYSA-K iron trichloride Chemical compound Cl[Fe](Cl)Cl RBTARNINKXHZNM-UHFFFAOYSA-K 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 229910001507 metal halide Inorganic materials 0.000 description 1
- 150000005309 metal halides Chemical class 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000012188 paraffin wax Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 238000000016 photochemical curing Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 239000003505 polymerization initiator Substances 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- YWPOLRBWRRKLMW-UHFFFAOYSA-N sodium;naphthalene-2-sulfonic acid Chemical compound [Na+].C1=CC=CC2=CC(S(=O)(=O)O)=CC=C21 YWPOLRBWRRKLMW-UHFFFAOYSA-N 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19650783A JPS6088494A (ja) | 1983-10-20 | 1983-10-20 | 回路基板の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19650783A JPS6088494A (ja) | 1983-10-20 | 1983-10-20 | 回路基板の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6088494A JPS6088494A (ja) | 1985-05-18 |
| JPS6361794B2 true JPS6361794B2 (nl) | 1988-11-30 |
Family
ID=16358900
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19650783A Granted JPS6088494A (ja) | 1983-10-20 | 1983-10-20 | 回路基板の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6088494A (nl) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0614586B2 (ja) * | 1986-07-14 | 1994-02-23 | 喜平 大津 | プリント基板の導電膜保護部の生成装置 |
| JPS63120498A (ja) * | 1986-11-08 | 1988-05-24 | イビデン株式会社 | 高密度プリント配線板 |
| JPH01187996A (ja) * | 1988-01-22 | 1989-07-27 | Ibiden Co Ltd | フォトソルダーレジスト被膜の形成方法 |
| JPH01248592A (ja) * | 1988-03-30 | 1989-10-04 | Hitachi Ltd | スルーホールへの導体ペースト充填方法 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5595395A (en) * | 1979-01-13 | 1980-07-19 | Sony Corp | Method of fabricating printed circuit board |
-
1983
- 1983-10-20 JP JP19650783A patent/JPS6088494A/ja active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5595395A (en) * | 1979-01-13 | 1980-07-19 | Sony Corp | Method of fabricating printed circuit board |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6088494A (ja) | 1985-05-18 |
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