JPS636154B2 - - Google Patents

Info

Publication number
JPS636154B2
JPS636154B2 JP57046682A JP4668282A JPS636154B2 JP S636154 B2 JPS636154 B2 JP S636154B2 JP 57046682 A JP57046682 A JP 57046682A JP 4668282 A JP4668282 A JP 4668282A JP S636154 B2 JPS636154 B2 JP S636154B2
Authority
JP
Japan
Prior art keywords
case
jumper
lead wire
dip type
view
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP57046682A
Other languages
English (en)
Japanese (ja)
Other versions
JPS58164253A (ja
Inventor
Masaoki Ishiwatari
Norihiko Shimada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP4668282A priority Critical patent/JPS58164253A/ja
Publication of JPS58164253A publication Critical patent/JPS58164253A/ja
Publication of JPS636154B2 publication Critical patent/JPS636154B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H01L23/49548—Cross section geometry
    • H01L23/49551—Cross section geometry characterised by bent parts
    • H01L23/49555—Cross section geometry characterised by bent parts the bent parts being the outer leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/225—Correcting or repairing of printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/306—Lead-in-hole components, e.g. affixing or retention before soldering, spacing means
    • H05K3/308—Adaptations of leads

Landscapes

  • Physics & Mathematics (AREA)
  • Geometry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP4668282A 1982-03-23 1982-03-23 Ｄｉｐ型ｉｃケ−ス Granted JPS58164253A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4668282A JPS58164253A (ja) 1982-03-23 1982-03-23 Ｄｉｐ型ｉｃケ−ス

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4668282A JPS58164253A (ja) 1982-03-23 1982-03-23 Ｄｉｐ型ｉｃケ−ス

Publications (2)

Publication Number Publication Date
JPS58164253A JPS58164253A (ja) 1983-09-29
JPS636154B2 true JPS636154B2 (enrdf_load_stackoverflow) 1988-02-08

Family

ID=12754145

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4668282A Granted JPS58164253A (ja) 1982-03-23 1982-03-23 Ｄｉｐ型ｉｃケ−ス

Country Status (1)

Country Link
JP (1) JPS58164253A (enrdf_load_stackoverflow)

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51151562U (enrdf_load_stackoverflow) * 1975-05-28 1976-12-03

Also Published As

Publication number Publication date
JPS58164253A (ja) 1983-09-29

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