JP4131724B2 - 回路基板への端子の取付構造 - Google Patents
回路基板への端子の取付構造 Download PDFInfo
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- JP4131724B2 JP4131724B2 JP2004303410A JP2004303410A JP4131724B2 JP 4131724 B2 JP4131724 B2 JP 4131724B2 JP 2004303410 A JP2004303410 A JP 2004303410A JP 2004303410 A JP2004303410 A JP 2004303410A JP 4131724 B2 JP4131724 B2 JP 4131724B2
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- circuit board
- terminal
- electrode
- vertical
- concave
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- 239000007767 bonding agent Substances 0.000 claims description 5
- 238000005452 bending Methods 0.000 claims description 3
- 230000000149 penetrating effect Effects 0.000 claims description 3
- 239000000758 substrate Substances 0.000 description 30
- 229910000679 solder Inorganic materials 0.000 description 17
- 239000000463 material Substances 0.000 description 13
- 239000004020 conductor Substances 0.000 description 10
- 238000005476 soldering Methods 0.000 description 6
- 238000003780 insertion Methods 0.000 description 4
- 230000037431 insertion Effects 0.000 description 4
- 238000007689 inspection Methods 0.000 description 4
- 238000005304 joining Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000004080 punching Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3405—Edge mounted components, e.g. terminals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/51—Fixed connections for rigid printed circuits or like structures
- H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
- H01R12/57—Fixed connections for rigid printed circuits or like structures characterised by the terminals surface mounting terminals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/51—Fixed connections for rigid printed circuits or like structures
- H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
- H01R12/58—Fixed connections for rigid printed circuits or like structures characterised by the terminals terminals for insertion into holes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
- H01R12/72—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
- H01R12/721—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures cooperating directly with the edge of the rigid printed circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/02—Soldered or welded connections
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09145—Edge details
- H05K2201/09181—Notches in edge pads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09854—Hole or via having special cross-section, e.g. elliptical
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/1034—Edge terminals, i.e. separate pieces of metal attached to the edge of the PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3447—Lead-in-hole components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/403—Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Combinations Of Printed Boards (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
Description
前記回路基板の前記凹状電極の近傍に、外部接続用端子を設ける為の中空の貫通電極を、端子対応に1つ有し、
端子の前記回路基板への取付部は、前記端子の主幹部より広幅に形成されると共に、この広幅部から上方に延出しかつ前記2つの凹状電極に対応して形成された2つの第1の垂直部と、前記主幹部の上部において前記2つの第1の垂直部の間より分岐して水平に折り曲げて形成された水平部と、この水平部の先端を上方に折り曲げて形成された第2の垂直部とを有し、
前記2つの第1の垂直部を前記回路基板の前記2つの凹状電極にそれぞれ嵌めて回路基板の表面より突出しないかあるいはわずかに突出させ、導電性接合剤により接合するとともに、前記第2の垂直部を前記貫通電極に挿着して回路基板の表面より突出しないかあるいはわずかに突出させて導電性接合剤により接合した
ことを特徴とする。
Claims (1)
- 回路基板の端部に、外部接続用端子を設ける為の凹状電極を、端子対応に2つ有し、
前記回路基板の前記凹状電極の近傍に、外部接続用端子を設ける為の中空の貫通電極を、端子対応に1つ有し、
端子の前記回路基板への取付部は、前記端子の主幹部より広幅に形成されると共に、この広幅部から上方に延出しかつ前記2つの凹状電極に対応して形成された2つの第1の垂直部と、前記主幹部の上部において前記2つの第1の垂直部の間より分岐して水平に折り曲げて形成された水平部と、この水平部の先端を上方に折り曲げて形成された第2の垂直部とを有し、
前記2つの第1の垂直部を前記回路基板の前記2つの凹状電極にそれぞれ嵌めて回路基板の表面より突出しないかあるいはわずかに突出させ、導電性接合剤により接合するとともに、前記第2の垂直部を前記貫通電極に挿着して回路基板の表面より突出しないかあるいはわずかに突出させて導電性接合剤により接合した
ことを特徴とする回路基板への端子の取付構造。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004303410A JP4131724B2 (ja) | 2004-10-18 | 2004-10-18 | 回路基板への端子の取付構造 |
US11/246,167 US7196269B2 (en) | 2004-10-18 | 2005-10-11 | Mounting structure for circuit board terminal |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004303410A JP4131724B2 (ja) | 2004-10-18 | 2004-10-18 | 回路基板への端子の取付構造 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2006114851A JP2006114851A (ja) | 2006-04-27 |
JP4131724B2 true JP4131724B2 (ja) | 2008-08-13 |
Family
ID=36181343
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004303410A Active JP4131724B2 (ja) | 2004-10-18 | 2004-10-18 | 回路基板への端子の取付構造 |
Country Status (2)
Country | Link |
---|---|
US (1) | US7196269B2 (ja) |
JP (1) | JP4131724B2 (ja) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4995527B2 (ja) * | 2006-09-28 | 2012-08-08 | 日本電波工業株式会社 | 表面実装用の圧電発振器 |
EP2018091A3 (de) * | 2007-07-17 | 2010-05-19 | Siemens Aktiengesellschaft | Bauteil mit Lötpin |
US20100221930A1 (en) * | 2007-10-02 | 2010-09-02 | Osram Gesellschaft Mit Beschraenkter Haftung | Plug device, plug connector, and method for producing the plug connector |
EP2330865B1 (de) * | 2009-12-03 | 2015-10-21 | Eberspächer catem GmbH & Co. KG | Elektrische Heizvorrichtung |
CN102983432A (zh) * | 2012-11-20 | 2013-03-20 | 芜湖通和汽车管路系统有限公司 | 一种电路板端子结构 |
CN106298713A (zh) * | 2015-06-09 | 2017-01-04 | 台达电子工业股份有限公司 | 一种垂直连接的功率模块及其堆叠连接的引脚 |
JP6727937B2 (ja) * | 2016-06-10 | 2020-07-22 | 日本電波工業株式会社 | 電子デバイス |
WO2021256407A1 (ja) * | 2020-06-19 | 2021-12-23 | ファナック株式会社 | モータ駆動装置 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
NL8802678A (nl) * | 1988-11-01 | 1990-06-01 | Du Pont Nederland | Contactelement en contactelementsamenstel van elektrisch geleidend materiaal, in het bijzonder voor oppervlaktemontagetechniek. |
US5548486A (en) * | 1994-01-21 | 1996-08-20 | International Business Machines Corporation | Pinned module |
JPH09259950A (ja) * | 1996-03-22 | 1997-10-03 | Yazaki Corp | 端子及び回路体への端子の取付構造 |
JPH09289329A (ja) | 1996-04-22 | 1997-11-04 | Fujitsu Ltd | 電子回路モジュール |
US6672886B2 (en) * | 2000-12-21 | 2004-01-06 | Hon Hai Precision Ind. Co., Ltd. | Electrical connector having improved contacts |
JP3468227B2 (ja) | 2001-04-18 | 2003-11-17 | 株式会社村田製作所 | スイッチング電源モジュール |
JP2004222486A (ja) | 2002-12-27 | 2004-08-05 | Murata Mfg Co Ltd | スイッチング電源モジュール |
JP3808050B2 (ja) | 2003-03-17 | 2006-08-09 | Tdk株式会社 | 表面実装パッケージおよびそれを用いた電子部品 |
-
2004
- 2004-10-18 JP JP2004303410A patent/JP4131724B2/ja active Active
-
2005
- 2005-10-11 US US11/246,167 patent/US7196269B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
US20060084291A1 (en) | 2006-04-20 |
JP2006114851A (ja) | 2006-04-27 |
US7196269B2 (en) | 2007-03-27 |
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