JPS6360533B2 - - Google Patents

Info

Publication number
JPS6360533B2
JPS6360533B2 JP56152632A JP15263281A JPS6360533B2 JP S6360533 B2 JPS6360533 B2 JP S6360533B2 JP 56152632 A JP56152632 A JP 56152632A JP 15263281 A JP15263281 A JP 15263281A JP S6360533 B2 JPS6360533 B2 JP S6360533B2
Authority
JP
Japan
Prior art keywords
substrate
semiconductor element
supporter
semiconductor
convex electrode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP56152632A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5853838A (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP56152632A priority Critical patent/JPS5853838A/ja
Publication of JPS5853838A publication Critical patent/JPS5853838A/ja
Publication of JPS6360533B2 publication Critical patent/JPS6360533B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/818—Bonding techniques
    • H01L2224/81801—Soldering or alloying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15312—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a pin array, e.g. PGA
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/35—Mechanical effects
    • H01L2924/351—Thermal stress

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
JP56152632A 1981-09-26 1981-09-26 半導体装置 Granted JPS5853838A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56152632A JPS5853838A (ja) 1981-09-26 1981-09-26 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56152632A JPS5853838A (ja) 1981-09-26 1981-09-26 半導体装置

Publications (2)

Publication Number Publication Date
JPS5853838A JPS5853838A (ja) 1983-03-30
JPS6360533B2 true JPS6360533B2 (en:Method) 1988-11-24

Family

ID=15544626

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56152632A Granted JPS5853838A (ja) 1981-09-26 1981-09-26 半導体装置

Country Status (1)

Country Link
JP (1) JPS5853838A (en:Method)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04122460U (ja) * 1991-04-15 1992-11-04 三菱自動車工業株式会社 工作物固定装置
JP2002270634A (ja) * 2001-03-08 2002-09-20 Rohm Co Ltd 半導体装置
JP2007318182A (ja) * 2007-09-03 2007-12-06 Rohm Co Ltd 半導体装置
JP2011044755A (ja) * 2010-12-03 2011-03-03 Rohm Co Ltd 半導体装置

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5427714B2 (en:Method) * 1972-03-31 1979-09-11

Also Published As

Publication number Publication date
JPS5853838A (ja) 1983-03-30

Similar Documents

Publication Publication Date Title
JP3219043B2 (ja) 半導体装置のパッケージ方法および半導体装置
JPS6360533B2 (en:Method)
JPS5821850A (ja) 樹脂封止型半導体装置
JP2646989B2 (ja) チップキャリア
JPH1126634A (ja) 半導体装置
JPH11204692A (ja) 半導体装置
JP2558574B2 (ja) 半導体装置
JPS60100443A (ja) 半導体装置の実装構造
JPS59117250A (ja) 半導体装置
JPH06216194A (ja) 半導体チップの実装構造
JPS62256472A (ja) 密着型イメ−ジセンサ−の組み立て方法
JPH09232366A (ja) 半導体チップの実装装置及びその実装方法
JP2841822B2 (ja) 混成集積回路の製造方法
JPS62195137A (ja) 半導体装置
JPH11150155A (ja) 半導体装置の製造方法および当該方法に用いる回路基板保持具
JP2785722B2 (ja) 樹脂封止型半導体装置
JP2712967B2 (ja) 半導体装置
JPH0936119A (ja) 半導体装置及びその製造方法並びにその半導体装置を用いた半導体ユニット
JPH06232199A (ja) フリップチップｉｃの実装構造
JPS62265734A (ja) 混成集積回路装置
JPH04335540A (ja) 半導体装置の製造方法
JPH09275161A (ja) 半導体装置
JPS63150931A (ja) 半導体装置
JPH0543485Y2 (en:Method)
JPH09298254A (ja) 半導体装置及びその製造方法