JPS6355796B2 - - Google Patents

Info

Publication number
JPS6355796B2
JPS6355796B2 JP56107425A JP10742581A JPS6355796B2 JP S6355796 B2 JPS6355796 B2 JP S6355796B2 JP 56107425 A JP56107425 A JP 56107425A JP 10742581 A JP10742581 A JP 10742581A JP S6355796 B2 JPS6355796 B2 JP S6355796B2
Authority
JP
Japan
Prior art keywords
polyimide
resistor
wiring
adhesive layer
printed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP56107425A
Other languages
English (en)
Japanese (ja)
Other versions
JPS589394A (ja
Inventor
Shoichi Muramoto
Nobuyoshi Tanaka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sony Corp
Original Assignee
Sony Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Corp filed Critical Sony Corp
Priority to JP56107425A priority Critical patent/JPS589394A/ja
Publication of JPS589394A publication Critical patent/JPS589394A/ja
Publication of JPS6355796B2 publication Critical patent/JPS6355796B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Parts Printed On Printed Circuit Boards (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP56107425A 1981-07-09 1981-07-09 薄型回路基板の製法 Granted JPS589394A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56107425A JPS589394A (ja) 1981-07-09 1981-07-09 薄型回路基板の製法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56107425A JPS589394A (ja) 1981-07-09 1981-07-09 薄型回路基板の製法

Publications (2)

Publication Number Publication Date
JPS589394A JPS589394A (ja) 1983-01-19
JPS6355796B2 true JPS6355796B2 (en, 2012) 1988-11-04

Family

ID=14458814

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56107425A Granted JPS589394A (ja) 1981-07-09 1981-07-09 薄型回路基板の製法

Country Status (1)

Country Link
JP (1) JPS589394A (en, 2012)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61136285A (ja) * 1984-12-07 1986-06-24 松下電器産業株式会社 高周波用プリント配線回路
JPH04171902A (ja) * 1990-11-06 1992-06-19 Matsushita Electric Ind Co Ltd 角形チップ抵抗器の製造方法
JP6022963B2 (ja) * 2013-02-13 2016-11-09 株式会社フジクラ 伸縮性配線板及びその製造方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51107458A (ja) * 1975-03-17 1976-09-24 Matsushita Electric Ind Co Ltd Insatsuteikotai
JPS5439873A (en) * 1977-09-06 1979-03-27 Nippon Denso Co Incombustible ypet flexible printed wiring board

Also Published As

Publication number Publication date
JPS589394A (ja) 1983-01-19

Similar Documents

Publication Publication Date Title
JP3094481B2 (ja) 電子回路装置とその製造方法
JPS6355796B2 (en, 2012)
JPH0265194A (ja) 厚膜素子を有するプリント配線板の製造方法
JP4671511B2 (ja) 配線基板の製造方法
JP2000133943A (ja) 多層基板の製造方法
JPS5998597A (ja) 多層プリント配線板
JP2002299826A (ja) 多層プリント配線基板、半導体装置、及び、これらの製造方法
JPS6347157B2 (en, 2012)
JPH09181453A (ja) 多層配線基板及びその製造方法
JPH0224395B2 (en, 2012)
JPS5857920B2 (ja) 印刷回路板
JP2000294905A (ja) パッケージ用配線板の製造方法
JPS63257258A (ja) 低抵抗付回路基板およびその製造法
JPH0410753B2 (en, 2012)
JPS5814760B2 (ja) インサツカイロバン
JPS6235692A (ja) 印刷配線基板
JPH0137877B2 (en, 2012)
JPS60187047A (ja) 厚膜回路基板の製造方法
JPS62242390A (ja) 印刷配線板の製造方法
JPH0348483A (ja) フレキシブルプリント配線板
JPS63272097A (ja) 多層回路基板の製造法
JPS6346592B2 (en, 2012)
JPH03255691A (ja) プリント配線板
JPH03196693A (ja) プリント配線板の抵抗体導体の転写法による製造方法
JPS6392090A (ja) 多層回路基板の製造法