JPS6354300B2 - - Google Patents

Info

Publication number
JPS6354300B2
JPS6354300B2 JP60074708A JP7470885A JPS6354300B2 JP S6354300 B2 JPS6354300 B2 JP S6354300B2 JP 60074708 A JP60074708 A JP 60074708A JP 7470885 A JP7470885 A JP 7470885A JP S6354300 B2 JPS6354300 B2 JP S6354300B2
Authority
JP
Japan
Prior art keywords
group
methylimidazole
ethyl
weight
parts
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP60074708A
Other languages
English (en)
Japanese (ja)
Other versions
JPS61233013A (ja
Inventor
Kazuo Kamagata
Toshiaki Yamada
Natsuo Sawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shikoku Chemicals Corp
Original Assignee
Shikoku Chemicals Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shikoku Chemicals Corp filed Critical Shikoku Chemicals Corp
Priority to JP7470885A priority Critical patent/JPS61233013A/ja
Publication of JPS61233013A publication Critical patent/JPS61233013A/ja
Publication of JPS6354300B2 publication Critical patent/JPS6354300B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Epoxy Resins (AREA)
  • Paints Or Removers (AREA)
JP7470885A 1985-04-08 1985-04-08 ポリエポキシ樹脂の硬化方法 Granted JPS61233013A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7470885A JPS61233013A (ja) 1985-04-08 1985-04-08 ポリエポキシ樹脂の硬化方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7470885A JPS61233013A (ja) 1985-04-08 1985-04-08 ポリエポキシ樹脂の硬化方法

Publications (2)

Publication Number Publication Date
JPS61233013A JPS61233013A (ja) 1986-10-17
JPS6354300B2 true JPS6354300B2 (cs) 1988-10-27

Family

ID=13554993

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7470885A Granted JPS61233013A (ja) 1985-04-08 1985-04-08 ポリエポキシ樹脂の硬化方法

Country Status (1)

Country Link
JP (1) JPS61233013A (cs)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6214468B1 (en) 1998-01-29 2001-04-10 Hitachi Chemical Company, Ltd. Flame retardant epoxy resin composition for printed board, and prepreg and metal foil clad laminate using the same

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6124381A (en) * 1995-06-15 2000-09-26 Nissan Chemical Industries, Ltd. Expoxy/acid anhydride composition
JP4900631B2 (ja) * 2001-02-07 2012-03-21 Ｄｉｃ株式会社 エポキシ樹脂組成物
JP2004210640A (ja) * 2002-12-26 2004-07-29 Polyplastics Co グアナミン化合物及びその難燃性樹脂組成物
US9458116B2 (en) 2013-08-05 2016-10-04 Mitsubishi Gas Chemical Company, Inc. Benzoguanamine compound having aminomethyl group, or salt thereof, and method for manufacturing the same
JP6254902B2 (ja) * 2014-05-21 2017-12-27 四国化成工業株式会社 トリアジン化合物、該化合物の合成方法およびエポキシ樹脂組成物
JP6300680B2 (ja) * 2014-08-01 2018-03-28 四国化成工業株式会社 トリアジン化合物、該化合物の合成方法およびエポキシ樹脂組成物
KR101762102B1 (ko) * 2015-02-03 2017-08-04 미츠비시 가스 가가쿠 가부시키가이샤 수지 조성물, 프리프레그, 금속박 피복 적층판, 수지 복합 시트, 및 프린트 배선판

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57137318A (en) * 1981-02-20 1982-08-24 Ajinomoto Co Inc One-can type epoxy resin composition

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6214468B1 (en) 1998-01-29 2001-04-10 Hitachi Chemical Company, Ltd. Flame retardant epoxy resin composition for printed board, and prepreg and metal foil clad laminate using the same

Also Published As

Publication number Publication date
JPS61233013A (ja) 1986-10-17

Similar Documents

Publication Publication Date Title
CN105238314B (zh) 一种耐湿热高可靠性环氧导电银胶及其制备方法与应用
EP1597332B1 (en) Conductive adhesive compositions with electrical stability and good impact resistance for use in electronics devices
EP1593701B1 (en) Curable resin composition
JPH0611842B2 (ja) 導電性樹脂ペースト
JPS6354300B2 (cs)
US5679730A (en) Epoxy resin composition and epoxy resin-based adhesive
US20080261049A1 (en) Electroconductive Paste and Substrate Using the Same for Mounting Electronic Parts
JPH05331355A (ja) 導電性ペースト
JP2000080153A (ja) 硬化性樹脂組成物
JPH0511365B2 (cs)
JP2002201448A (ja) 導電性接着剤
KR20180095410A (ko) 도전성 접착제 조성물
JPS61210076A (ja) 新規な２−置換−４，６−ジアミノ−ｓ−トリアジン・イソシアヌル酸付加物、該付加物の合成方法及び該付加物を用いるポリエポキシ樹脂の硬化方法
JP3695226B2 (ja) 一液熱硬化型樹脂組成物
EP0166588A1 (en) Epoxy resin composition
JPH0669257A (ja) 半導体素子用接着剤および半導体装置
JPS6079079A (ja) 接着剤組成物
JP3462664B2 (ja) エポキシ樹脂組成物及びエポキシ系接着剤
JP2005317491A (ja) 導電ペーストおよびそれを用いた電子部品搭載基板
JPS6330578A (ja) エポキシ樹脂系レジストインク組成物
JPS61286369A (ja) ２―フェニル―４，５―ジベンジルイミダゾール及び該化合物の合成方法
JPH0250128B2 (cs)
JP2836710B2 (ja) 半導体用導電性樹脂ペースト
JP3018685B2 (ja) 半導体素子用接着剤および半導体装置
JP2596663B2 (ja) 半導体用導電性樹脂ペースト