JPS6352780B2 - - Google Patents
Info
- Publication number
- JPS6352780B2 JPS6352780B2 JP56211161A JP21116181A JPS6352780B2 JP S6352780 B2 JPS6352780 B2 JP S6352780B2 JP 56211161 A JP56211161 A JP 56211161A JP 21116181 A JP21116181 A JP 21116181A JP S6352780 B2 JPS6352780 B2 JP S6352780B2
- Authority
- JP
- Japan
- Prior art keywords
- lead frame
- terminal
- terminal pin
- jig
- pitch
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3405—Edge mounted components, e.g. terminals
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56211161A JPS58115841A (ja) | 1981-12-28 | 1981-12-28 | 混成集積回路の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56211161A JPS58115841A (ja) | 1981-12-28 | 1981-12-28 | 混成集積回路の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58115841A JPS58115841A (ja) | 1983-07-09 |
| JPS6352780B2 true JPS6352780B2 (enExample) | 1988-10-20 |
Family
ID=16601402
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP56211161A Granted JPS58115841A (ja) | 1981-12-28 | 1981-12-28 | 混成集積回路の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58115841A (enExample) |
-
1981
- 1981-12-28 JP JP56211161A patent/JPS58115841A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS58115841A (ja) | 1983-07-09 |
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