JPS6351616A - 積層コンデンサの製造方法 - Google Patents
積層コンデンサの製造方法Info
- Publication number
- JPS6351616A JPS6351616A JP19622086A JP19622086A JPS6351616A JP S6351616 A JPS6351616 A JP S6351616A JP 19622086 A JP19622086 A JP 19622086A JP 19622086 A JP19622086 A JP 19622086A JP S6351616 A JPS6351616 A JP S6351616A
- Authority
- JP
- Japan
- Prior art keywords
- green sheet
- electrodes
- electrode
- film
- printing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Ceramic Capacitors (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19622086A JPS6351616A (ja) | 1986-08-20 | 1986-08-20 | 積層コンデンサの製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19622086A JPS6351616A (ja) | 1986-08-20 | 1986-08-20 | 積層コンデンサの製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6351616A true JPS6351616A (ja) | 1988-03-04 |
| JPH0525381B2 JPH0525381B2 (cs) | 1993-04-12 |
Family
ID=16354198
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19622086A Granted JPS6351616A (ja) | 1986-08-20 | 1986-08-20 | 積層コンデンサの製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6351616A (cs) |
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03108307A (ja) * | 1989-09-21 | 1991-05-08 | Murata Mfg Co Ltd | セラミック電子部品の製造方法 |
| JPH03229407A (ja) * | 1990-02-03 | 1991-10-11 | Taiyo Yuden Co Ltd | 積層電子部品の製造方法 |
| US6485591B1 (en) | 1988-03-07 | 2002-11-26 | Matsushita Electric Industrial Co., Ltd. | Method for manufacturing laminated-ceramic electronic components |
| JP2006310805A (ja) * | 2005-03-29 | 2006-11-09 | Kyocera Corp | 電子部品の製造方法 |
| WO2006126271A1 (ja) * | 2005-05-26 | 2006-11-30 | Tdk Corporation | 内部電極を持つ電子部品の製造方法 |
| US7396425B2 (en) | 2004-08-20 | 2008-07-08 | Tdk Corporation | Method of production of peeling layer paste and method of production of multilayer type electronic device |
| US7402220B2 (en) | 2003-04-18 | 2008-07-22 | Tdk Corporation | Method for manufacturing multi-layered unit for multi-layered ceramic electronic component |
| US7491283B2 (en) | 2002-12-27 | 2009-02-17 | Tdk Corporation | Production method of multilayer electronic device |
| US7517418B2 (en) | 2002-12-27 | 2009-04-14 | Tdk Corporation | Production method of electronic device having internal electrode |
| US7604858B2 (en) | 2004-08-10 | 2009-10-20 | Tdk Corporation | Release layer paste and method of production of a multilayer type electronic device |
| US7651764B2 (en) | 2006-02-10 | 2010-01-26 | Tdk Corporation | Release layer paste and method of production of a multilayer type electronic device |
| US7653973B2 (en) | 2004-06-28 | 2010-02-02 | Tdk Corporation | Production method of multilayer electronic device |
| CN112277493A (zh) * | 2020-10-28 | 2021-01-29 | 中科传感技术(青岛)研究院 | 一种多层压电陶瓷片底面电极转印方法 |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6487774B1 (en) | 1998-01-22 | 2002-12-03 | Matsushita Electric Industrial Co., Ltd. | Method of forming an electronic component using ink |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60160691A (ja) * | 1984-01-31 | 1985-08-22 | 富士通株式会社 | 厚膜パタ−ン形成方法 |
| JPS6156489A (ja) * | 1984-08-28 | 1986-03-22 | 東洋紡績株式会社 | 厚膜導体回路の製造方法 |
-
1986
- 1986-08-20 JP JP19622086A patent/JPS6351616A/ja active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60160691A (ja) * | 1984-01-31 | 1985-08-22 | 富士通株式会社 | 厚膜パタ−ン形成方法 |
| JPS6156489A (ja) * | 1984-08-28 | 1986-03-22 | 東洋紡績株式会社 | 厚膜導体回路の製造方法 |
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6485591B1 (en) | 1988-03-07 | 2002-11-26 | Matsushita Electric Industrial Co., Ltd. | Method for manufacturing laminated-ceramic electronic components |
| JPH03108307A (ja) * | 1989-09-21 | 1991-05-08 | Murata Mfg Co Ltd | セラミック電子部品の製造方法 |
| JPH03229407A (ja) * | 1990-02-03 | 1991-10-11 | Taiyo Yuden Co Ltd | 積層電子部品の製造方法 |
| US7491283B2 (en) | 2002-12-27 | 2009-02-17 | Tdk Corporation | Production method of multilayer electronic device |
| US7517418B2 (en) | 2002-12-27 | 2009-04-14 | Tdk Corporation | Production method of electronic device having internal electrode |
| US7402220B2 (en) | 2003-04-18 | 2008-07-22 | Tdk Corporation | Method for manufacturing multi-layered unit for multi-layered ceramic electronic component |
| US7653973B2 (en) | 2004-06-28 | 2010-02-02 | Tdk Corporation | Production method of multilayer electronic device |
| US7604858B2 (en) | 2004-08-10 | 2009-10-20 | Tdk Corporation | Release layer paste and method of production of a multilayer type electronic device |
| US7396425B2 (en) | 2004-08-20 | 2008-07-08 | Tdk Corporation | Method of production of peeling layer paste and method of production of multilayer type electronic device |
| JP2006310805A (ja) * | 2005-03-29 | 2006-11-09 | Kyocera Corp | 電子部品の製造方法 |
| WO2006126271A1 (ja) * | 2005-05-26 | 2006-11-30 | Tdk Corporation | 内部電極を持つ電子部品の製造方法 |
| US7651764B2 (en) | 2006-02-10 | 2010-01-26 | Tdk Corporation | Release layer paste and method of production of a multilayer type electronic device |
| CN112277493A (zh) * | 2020-10-28 | 2021-01-29 | 中科传感技术(青岛)研究院 | 一种多层压电陶瓷片底面电极转印方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0525381B2 (cs) | 1993-04-12 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |