JPS6349380B2 - - Google Patents

Info

Publication number
JPS6349380B2
JPS6349380B2 JP58112813A JP11281383A JPS6349380B2 JP S6349380 B2 JPS6349380 B2 JP S6349380B2 JP 58112813 A JP58112813 A JP 58112813A JP 11281383 A JP11281383 A JP 11281383A JP S6349380 B2 JPS6349380 B2 JP S6349380B2
Authority
JP
Japan
Prior art keywords
solder
weight
layer
lead frame
alloy
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP58112813A
Other languages
English (en)
Japanese (ja)
Other versions
JPS605550A (ja
Inventor
Michihiko Inaba
Koichi Tejima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Shibaura Electric Co Ltd filed Critical Tokyo Shibaura Electric Co Ltd
Priority to JP58112813A priority Critical patent/JPS605550A/ja
Publication of JPS605550A publication Critical patent/JPS605550A/ja
Publication of JPS6349380B2 publication Critical patent/JPS6349380B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49579—Lead-frames or other flat leads characterised by the materials of the lead frames or layers thereon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)
  • Conductive Materials (AREA)
JP58112813A 1983-06-24 1983-06-24 電子部品 Granted JPS605550A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58112813A JPS605550A (ja) 1983-06-24 1983-06-24 電子部品

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58112813A JPS605550A (ja) 1983-06-24 1983-06-24 電子部品

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP31226487A Division JPS63158859A (ja) 1987-12-11 1987-12-11 電子部品

Publications (2)

Publication Number Publication Date
JPS605550A JPS605550A (ja) 1985-01-12
JPS6349380B2 true JPS6349380B2 (enExample) 1988-10-04

Family

ID=14596170

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58112813A Granted JPS605550A (ja) 1983-06-24 1983-06-24 電子部品

Country Status (1)

Country Link
JP (1) JPS605550A (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6299429A (ja) * 1985-10-25 1987-05-08 Kobe Steel Ltd 剪断加工性に優れるリ−ドフレ−ム材
JPS63158859A (ja) * 1987-12-11 1988-07-01 Toshiba Corp 電子部品
JP2013258355A (ja) * 2012-06-14 2013-12-26 Denso Corp 電子装置
JP5594324B2 (ja) * 2012-06-22 2014-09-24 株式会社村田製作所 電子部品モジュールの製造方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5654376A (en) * 1979-10-11 1981-05-14 Hitachi Medical Corp Scanning type scintillation camera
JPS5834537B2 (ja) * 1980-06-16 1983-07-27 日本鉱業株式会社 耐熱性の良好な高力導電用銅合金
JPS5768061A (en) * 1980-10-15 1982-04-26 Furukawa Electric Co Ltd:The Lead material for semiconductor device
JPS5793555A (en) * 1980-12-02 1982-06-10 Tamagawa Kikai Kinzoku Kk Lead material for semiconductor
JPS59153853A (ja) * 1983-02-21 1984-09-01 Hitachi Metals Ltd リ−ドフレ−ム材

Also Published As

Publication number Publication date
JPS605550A (ja) 1985-01-12

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