JPS5793555A - Lead material for semiconductor - Google Patents

Lead material for semiconductor

Info

Publication number
JPS5793555A
JPS5793555A JP16994480A JP16994480A JPS5793555A JP S5793555 A JPS5793555 A JP S5793555A JP 16994480 A JP16994480 A JP 16994480A JP 16994480 A JP16994480 A JP 16994480A JP S5793555 A JPS5793555 A JP S5793555A
Authority
JP
Japan
Prior art keywords
lead
semiconductor
heat resistance
thermal conductivity
bending property
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP16994480A
Other languages
Japanese (ja)
Other versions
JPS6242018B2 (en
Inventor
Rensei Futatsuka
Tadao Sakakibara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Shindoh Co Ltd
Original Assignee
Mitsubishi Shindoh Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Shindoh Co Ltd filed Critical Mitsubishi Shindoh Co Ltd
Priority to JP16994480A priority Critical patent/JPS5793555A/en
Publication of JPS5793555A publication Critical patent/JPS5793555A/en
Publication of JPS6242018B2 publication Critical patent/JPS6242018B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49579—Lead-frames or other flat leads characterised by the materials of the lead frames or layers thereon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE:To improve the strength, bending property, thermal conductivity and heat resistance of a semiconductor lead by forming the lead of a material mixed with Sn, Ni, Zn, P and Cu at the prescribed ratio. CONSTITUTION:A semiconductor lead is formed of a material having a composition of 0.1-1.0wt% of Sn, 0.5-2.5wt% of Ni, 0.005-0.50wt% of Zn, 0.004- 0.20wt% of P and the residue of Cu and inevitable impurities. Thus, a lead frame having high mechanical strength, excellent bending property, thermal conductivity and heat resistance capable of sufficiently following the improvement of an IC power can be obtained.
JP16994480A 1980-12-02 1980-12-02 Lead material for semiconductor Granted JPS5793555A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16994480A JPS5793555A (en) 1980-12-02 1980-12-02 Lead material for semiconductor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16994480A JPS5793555A (en) 1980-12-02 1980-12-02 Lead material for semiconductor

Publications (2)

Publication Number Publication Date
JPS5793555A true JPS5793555A (en) 1982-06-10
JPS6242018B2 JPS6242018B2 (en) 1987-09-05

Family

ID=15895780

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16994480A Granted JPS5793555A (en) 1980-12-02 1980-12-02 Lead material for semiconductor

Country Status (1)

Country Link
JP (1) JPS5793555A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59153853A (en) * 1983-02-21 1984-09-01 Hitachi Metals Ltd Matrial for lead frame
JPS605550A (en) * 1983-06-24 1985-01-12 Toshiba Corp Electronic parts
JPS6039142A (en) * 1983-08-11 1985-02-28 Mitsubishi Electric Corp Copper alloy

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS575836A (en) * 1980-06-16 1982-01-12 Nippon Mining Co Ltd High strength copper alloy having excellent heat resistance for use as conductive material
JPS5727051A (en) * 1980-07-25 1982-02-13 Nippon Telegr & Teleph Corp <Ntt> Copper nickel tin alloy for integrated circuit conductor and its manufacture

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS575836A (en) * 1980-06-16 1982-01-12 Nippon Mining Co Ltd High strength copper alloy having excellent heat resistance for use as conductive material
JPS5727051A (en) * 1980-07-25 1982-02-13 Nippon Telegr & Teleph Corp <Ntt> Copper nickel tin alloy for integrated circuit conductor and its manufacture

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59153853A (en) * 1983-02-21 1984-09-01 Hitachi Metals Ltd Matrial for lead frame
JPS6140290B2 (en) * 1983-02-21 1986-09-08 Hitachi Metals Ltd
JPS605550A (en) * 1983-06-24 1985-01-12 Toshiba Corp Electronic parts
JPS6349380B2 (en) * 1983-06-24 1988-10-04 Tokyo Shibaura Electric Co
JPS6039142A (en) * 1983-08-11 1985-02-28 Mitsubishi Electric Corp Copper alloy

Also Published As

Publication number Publication date
JPS6242018B2 (en) 1987-09-05

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