JPS5789448A - Copper alloy for conducting electricity - Google Patents

Copper alloy for conducting electricity

Info

Publication number
JPS5789448A
JPS5789448A JP16517880A JP16517880A JPS5789448A JP S5789448 A JPS5789448 A JP S5789448A JP 16517880 A JP16517880 A JP 16517880A JP 16517880 A JP16517880 A JP 16517880A JP S5789448 A JPS5789448 A JP S5789448A
Authority
JP
Japan
Prior art keywords
copper alloy
lowering
alloy
fusion
bonding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP16517880A
Other languages
Japanese (ja)
Other versions
JPS6033176B2 (en
Inventor
Takatoki Fukuda
Masanori Hirai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tatsuta Electric Wire and Cable Co Ltd
Original Assignee
Tatsuta Electric Wire and Cable Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tatsuta Electric Wire and Cable Co Ltd filed Critical Tatsuta Electric Wire and Cable Co Ltd
Priority to JP16517880A priority Critical patent/JPS6033176B2/en
Publication of JPS5789448A publication Critical patent/JPS5789448A/en
Publication of JPS6033176B2 publication Critical patent/JPS6033176B2/en
Expired legal-status Critical Current

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  • Conductive Materials (AREA)

Abstract

PURPOSE: To obtain an copper alloy enabling a lowering of the annealing temperature and prevention of the fusion-bonding between copper wires at the time of batch annealing of the wires, while retaining electrical and mechanical properties, by adding Mg to Cu.
CONSTITUTION: The copper alloy consists of 5W100ppm of Mg and the balance of ordinary Cu. When Mg is less than the lower limit, the effect to lower the recrystallization temperature of the alloy thereby enabling to lower the annealing temperature and the effect to alleviate the fusion-bonding can not be recognized. On the other hand, when Mg is more than the upper limit, the merit of the addition of Mg is not attained, and the results are a rise in the recrystallization temperature and a lowering of electrical conductivity. Furthermore, if the oxygen content of the alloy is high, the added Mg may react with oxygen to form MgO, resulting in a considerable lowering of the yield of Mg.
COPYRIGHT: (C)1982,JPO&Japio
JP16517880A 1980-11-21 1980-11-21 Conductive copper alloy Expired JPS6033176B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16517880A JPS6033176B2 (en) 1980-11-21 1980-11-21 Conductive copper alloy

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16517880A JPS6033176B2 (en) 1980-11-21 1980-11-21 Conductive copper alloy

Publications (2)

Publication Number Publication Date
JPS5789448A true JPS5789448A (en) 1982-06-03
JPS6033176B2 JPS6033176B2 (en) 1985-08-01

Family

ID=15807327

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16517880A Expired JPS6033176B2 (en) 1980-11-21 1980-11-21 Conductive copper alloy

Country Status (1)

Country Link
JP (1) JPS6033176B2 (en)

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4591484A (en) * 1984-04-07 1986-05-27 Kabushiki Kaisha Kobe Seiko Sho Lead materials for semiconductor devices
EP0866883A4 (en) * 1996-02-09 1998-12-23 Brush Wellman Alloy c11004
JP2006274384A (en) * 2005-03-30 2006-10-12 Hitachi Cable Ltd Method for producing copper material and the copper material
JP2009280898A (en) * 2008-04-25 2009-12-03 Mitsubishi Materials Corp Interconnector material for solar cell, method for producing the same, and interconnector for solar cell
DE102017006970A1 (en) 2017-07-22 2019-01-24 Wieland-Werke Ag Copper casting alloy and casting process
WO2022004789A1 (en) * 2020-06-30 2022-01-06 三菱マテリアル株式会社 Plastic copper alloy working material, copper alloy wire material, component for electronic and electrical equipment, and terminal
WO2022004803A1 (en) * 2020-06-30 2022-01-06 三菱マテリアル株式会社 Copper alloy plastic working material, copper alloy rod material, component for electronic/electrical devices, and terminal
EP3854895A4 (en) * 2019-02-28 2022-03-09 JX Nippon Mining & Metals Corporation Copper electrode material
JP2022183715A (en) * 2021-05-31 2022-12-13 三菱マテリアル株式会社 Plastic processed material of copper alloy, copper alloy bar, component for electronic or electrical device, and terminal
JP2022183714A (en) * 2021-05-31 2022-12-13 三菱マテリアル株式会社 Plastic processed material of copper alloy, copper alloy wire, component for electronic or electrical device, and terminal

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4591484A (en) * 1984-04-07 1986-05-27 Kabushiki Kaisha Kobe Seiko Sho Lead materials for semiconductor devices
EP0866883A4 (en) * 1996-02-09 1998-12-23 Brush Wellman Alloy c11004
JP2006274384A (en) * 2005-03-30 2006-10-12 Hitachi Cable Ltd Method for producing copper material and the copper material
JP4674483B2 (en) * 2005-03-30 2011-04-20 日立電線株式会社 Copper material manufacturing method and copper material
JP2009280898A (en) * 2008-04-25 2009-12-03 Mitsubishi Materials Corp Interconnector material for solar cell, method for producing the same, and interconnector for solar cell
DE102017006970A1 (en) 2017-07-22 2019-01-24 Wieland-Werke Ag Copper casting alloy and casting process
EP3854895A4 (en) * 2019-02-28 2022-03-09 JX Nippon Mining & Metals Corporation Copper electrode material
WO2022004789A1 (en) * 2020-06-30 2022-01-06 三菱マテリアル株式会社 Plastic copper alloy working material, copper alloy wire material, component for electronic and electrical equipment, and terminal
WO2022004803A1 (en) * 2020-06-30 2022-01-06 三菱マテリアル株式会社 Copper alloy plastic working material, copper alloy rod material, component for electronic/electrical devices, and terminal
CN115735013A (en) * 2020-06-30 2023-03-03 三菱综合材料株式会社 Copper alloy plastic working material, copper alloy wire, electronic/electrical device module, and terminal
CN115735013B (en) * 2020-06-30 2024-01-26 三菱综合材料株式会社 Copper alloy plastic working material, copper alloy wire material, component for electronic and electrical equipment, and terminal
JP2022183715A (en) * 2021-05-31 2022-12-13 三菱マテリアル株式会社 Plastic processed material of copper alloy, copper alloy bar, component for electronic or electrical device, and terminal
JP2022183714A (en) * 2021-05-31 2022-12-13 三菱マテリアル株式会社 Plastic processed material of copper alloy, copper alloy wire, component for electronic or electrical device, and terminal

Also Published As

Publication number Publication date
JPS6033176B2 (en) 1985-08-01

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