JPS6033176B2 - Conductive copper alloy - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a conductive copper alloy containing 5 to 100 PPm of magnesium, and is intended to improve the softening properties of copper by adding magnesium.

Methods for softening conductor copper wire include a continuous slow softening method and a batch slow softening method that is carried out for each batch.

In the Renzutsu annealing and softening method, one copper wire is continuously heated with electricity, so it does not cause so-called inter-wire fusion, in which the copper wires stick together during hammering.

However, when copper wire is wound in line on a steel reel and subjected to batchwise softening in a vacuum condition, as in the case of Kouki competitive steel wires, conventional tough pitch steel or oxygen-free steel wires do not meet the dulling conditions. Since there is no width, it may cause fusion between the lines. If an attempt is made to unwind the copper wire from the reel in such a state, there is a problem in that a so-called kink phenomenon occurs in which the wires are bent due to the fusion between the wires, making it impossible to obtain a straight annealed copper wire.

Of course, when performing batch annealing softening, there is a method to prevent green welding by adjusting the way the copper wire is wound around the reel, but this method also has problems with reproducibility in preventing welding. , there was a problem of lack of certainty.

Therefore, the present inventors have found that as a means to solve this problem, if copper, which has a lower recrystallization temperature than conventional tough pitch steel or oxygen-free steel, is used as the wire material, it is possible to lower the sintering anchor temperature, and as a result, the wire Based on the finding that it is possible to prevent interlocking and also save the thermal energy required for sintering an anchor, we have conducted extensive studies and found that it is possible to improve electrical and mechanical properties only when a certain amount of magnesium is added to copper. The present invention has been completed by discovering a new fact that the above objects can be achieved without impairing the properties of the wires, and at the same time, it is possible to provide a material that is less likely to cause fusion between wires.

That is, in the present invention, 5 to 100 PPm of magnesium and the remainder are unavoidable impurity elements (Fe, Ph, Sn,
It is characterized by being made of ordinary copper containing (Bi, Ni, Ag, Sb, As, Si, Zn, P, etc.).

In the present invention, the magnesium content is set at 5 to 10 Pm.
The reason for this stipulation is that when the magnesium content is Pm, the effect of lowering the recrystallization temperature or the reduction of fusion is not observed compared to conventional tough pitch steel or oxygen-free copper, and This is because when the amount exceeds 100 PPm, there is no benefit from adding it, and the recrystallization temperature increases or the conductivity decreases.

Furthermore, in the present invention, if the amount of oxygen content is too large, M
Since there is a risk of forming g0 and significantly reducing the yield of Mg, it is preferable that the concentration is 500 PPm or less.

It goes without saying that the scope of application of the present invention is also applicable to copper wire manufactured by a deep forming process or other continuous casting and rolling equipment, as long as the above-mentioned conditions are satisfied.

Hereinafter, the present invention will be explained in detail based on examples. Examples Conventional tough pitch steel, oxygen-free copper and commercially available 99.9%
A Cu-Mg master alloy is produced from pure magnesium,
Next, using the obtained master alloy, a copper alloy having the composition shown in Table 1 was melted.

This was poured into a mold of 22 squares x 7 mills long at 115,000 mm, and after cooling, the surface scale was removed and rolled to form a rough drawing line on the 6th side, followed by temper annealing at 9,000 mm for 2 hours. In order to obtain the rough wire, in the case of an oxygen-free steel alloy, melt casting was performed in an argon atmosphere.

These roughly drawn wires were drawn to a length of 0.4 ribs, heated and held in a 300 oo oil bath for 1 hour, then rapidly cooled with water, stretched at room temperature, and measured for tensile strength and electrical conductivity. .

The conductivity was measured using the bridge method based on the International Sintered Anchor Copper Standard (IACS).

The semi-softening temperature was determined by a conventionally known method.

These results are shown in Table 2.

Incidentally, regarding the conventional examples and comparative examples shown in Table 1, samples were prepared in the same manner as in the examples, and tests corresponding to the examples of the present invention were conducted, respectively.

As is clear from the results in Table 2, Cu-
Mg alloy has a recrystallization temperature of 50 to 65% while maintaining electrical and mechanical properties comparable to conventional tough pitch copper and oxygen-free steel.
It can be seen that 0:00 is also decreasing.

Next, in order to examine the state of fusion between adjacent wires, the hard copper wire cold-drawn to 0.4 ◇ was placed on a steel bobbin with a diameter of 2, and a load of 2k9 was applied. 200 turns in 7 layers, 250oo, 300℃, 350℃.
After the blank sintered anchor was softened for 2 hours at a temperature of 400 qo and 400 qo, the degree of fusion between the drawn wires when pulled out from the bobbin was measured. The degree of fusion was determined by determining the resistance value when the bobbins were continuously drawn from the center of the third row of seven stacked bobbins using an autograph. The results are shown in FIG. 1 and Table 3.

The results show that the subordinate tough pitch copper and oxygen-free steel are
It can be seen that after annealing for about q02 hours, fusion of the drawn wires occurred, albeit slightly.

On the other hand, the copper alloy for guiding force of the present invention has a temperature of 350°C and 2
Even under time annealing and softening conditions, there was no fusion at all, indicating that the improvement was well achieved. As mentioned above, the copper alloy of the present invention has a lower recrystallization temperature than conventional tough pitch steel or oxygen-free copper, and is a material that is less likely to cause wire welding. A much wider range of shogun conditions can be adopted.

As a result, the copper alloy of the present invention can more easily prevent wire fusion in the batch annealing method, and can also be softened with less thermal energy than conventional copper due to its low recrystallization temperature in the Rentsugi annealing softening method. Since it is possible, there is also an advantage in terms of energy saving.

As mentioned above, the steel alloy of the present invention has excellent softening properties and electrical and mechanical properties comparable to conventional tough pitch copper and oxygen-free copper. Suitable for use in winding wires that require high performance.

Table 1 Table 2 Table 3

[Brief explanation of the drawing]

FIG. 1 is a chart showing the degree of fusion between drawn wires during annealing. Figure 1 Figure 1 Kuno

Claims (1)

[Claims] A conductive copper alloy characterized by comprising 15 to 100 PPm of magnesium and the balance ordinary copper. 2. The conductive copper alloy according to claim 1, wherein the remaining oxygen content is 500 PPm or less.