JPS5596664A - Copper alloy for lead frame of semiconductor element - Google Patents

Copper alloy for lead frame of semiconductor element

Info

Publication number
JPS5596664A
JPS5596664A JP372979A JP372979A JPS5596664A JP S5596664 A JPS5596664 A JP S5596664A JP 372979 A JP372979 A JP 372979A JP 372979 A JP372979 A JP 372979A JP S5596664 A JPS5596664 A JP S5596664A
Authority
JP
Japan
Prior art keywords
plate
lead frame
cold rolled
semiconductor element
billet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP372979A
Other languages
Japanese (ja)
Other versions
JPS6218614B2 (en
Inventor
Shoji Shiga
Norihiko Kamiyama
Hisao Orimo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
FURUKAWA KINZOKU KOGYO KK
Furukawa Metals Co Ltd
Furukawa Electric Co Ltd
Original Assignee
FURUKAWA KINZOKU KOGYO KK
Furukawa Metals Co Ltd
Furukawa Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by FURUKAWA KINZOKU KOGYO KK, Furukawa Metals Co Ltd, Furukawa Electric Co Ltd filed Critical FURUKAWA KINZOKU KOGYO KK
Priority to JP372979A priority Critical patent/JPS5596664A/en
Publication of JPS5596664A publication Critical patent/JPS5596664A/en
Publication of JPS6218614B2 publication Critical patent/JPS6218614B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49579—Lead-frames or other flat leads characterised by the materials of the lead frames or layers thereon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Conductive Materials (AREA)

Abstract

PURPOSE:To improve the strength and heat resistance of the lead frame of a semiconducor element by providing the lead frame composition used for the semiconductor element containing Cu alloy consisting of 0.5-3.5wt% of Fe, 0.3-20wt% of Zn and the residue of Cu and normal impurities. CONSTITUTION:An alloy containing Cu alloy consisting of 0.5-3.5wt% of Fe, 0.3-30wt% of Zn and the residue of Cu and normal impurities is molded in a low frequency melting furnace. The billet thus obtained is hot extruded and cut at its surface. The billet is then cold rolled, intermediately annealed, and cold rolled repeatedly, and finally cold rolled at 55% to thereby form a plate having a thickness of 0.5mm. The plate is then heat treated at 650 deg.C for 30min. Since this plate contains Zn which incorporates dissolving property and strong deoxidizing capacity, it does not produce an oxide detrimental for plating process. Since the plate also contains Fe higher than solid solution limit to thereby deposit iron particles, its strength and heat resistance are increased.
JP372979A 1979-01-16 1979-01-16 Copper alloy for lead frame of semiconductor element Granted JPS5596664A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP372979A JPS5596664A (en) 1979-01-16 1979-01-16 Copper alloy for lead frame of semiconductor element

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP372979A JPS5596664A (en) 1979-01-16 1979-01-16 Copper alloy for lead frame of semiconductor element

Publications (2)

Publication Number Publication Date
JPS5596664A true JPS5596664A (en) 1980-07-23
JPS6218614B2 JPS6218614B2 (en) 1987-04-23

Family

ID=11565349

Family Applications (1)

Application Number Title Priority Date Filing Date
JP372979A Granted JPS5596664A (en) 1979-01-16 1979-01-16 Copper alloy for lead frame of semiconductor element

Country Status (1)

Country Link
JP (1) JPS5596664A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5748639U (en) * 1980-09-05 1982-03-18
JPS59177949A (en) * 1983-03-29 1984-10-08 Toshiba Corp Element for consumer appliances
JPS6232631A (en) * 1985-08-05 1987-02-12 Hitachi Ltd Integrated circuit package
JP2014019907A (en) * 2012-07-18 2014-02-03 Sh Copper Products Corp Copper alloy for electric-electronic component

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5748639U (en) * 1980-09-05 1982-03-18
JPS59177949A (en) * 1983-03-29 1984-10-08 Toshiba Corp Element for consumer appliances
JPH0151063B2 (en) * 1983-03-29 1989-11-01 Tokyo Shibaura Electric Co
JPS6232631A (en) * 1985-08-05 1987-02-12 Hitachi Ltd Integrated circuit package
JPH0431187B2 (en) * 1985-08-05 1992-05-25
JP2014019907A (en) * 2012-07-18 2014-02-03 Sh Copper Products Corp Copper alloy for electric-electronic component

Also Published As

Publication number Publication date
JPS6218614B2 (en) 1987-04-23

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