JPS6348625B2 - - Google Patents
Info
- Publication number
- JPS6348625B2 JPS6348625B2 JP56173044A JP17304481A JPS6348625B2 JP S6348625 B2 JPS6348625 B2 JP S6348625B2 JP 56173044 A JP56173044 A JP 56173044A JP 17304481 A JP17304481 A JP 17304481A JP S6348625 B2 JPS6348625 B2 JP S6348625B2
- Authority
- JP
- Japan
- Prior art keywords
- heating
- chip
- heating chip
- terminals
- block
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/04—Heating appliances
- B23K3/047—Heating appliances electric
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP17304481A JPS5877769A (ja) | 1981-10-30 | 1981-10-30 | はんだ付け方法及び装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP17304481A JPS5877769A (ja) | 1981-10-30 | 1981-10-30 | はんだ付け方法及び装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5877769A JPS5877769A (ja) | 1983-05-11 |
JPS6348625B2 true JPS6348625B2 (enrdf_load_stackoverflow) | 1988-09-29 |
Family
ID=15953159
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP17304481A Granted JPS5877769A (ja) | 1981-10-30 | 1981-10-30 | はんだ付け方法及び装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5877769A (enrdf_load_stackoverflow) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61119374A (ja) * | 1984-11-16 | 1986-06-06 | Toshiba Corp | はんだ付け装置 |
JPH0489175A (ja) * | 1990-08-01 | 1992-03-23 | Nippondenso Co Ltd | はんだこて |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5653581Y2 (enrdf_load_stackoverflow) * | 1978-08-29 | 1981-12-14 |
-
1981
- 1981-10-30 JP JP17304481A patent/JPS5877769A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS5877769A (ja) | 1983-05-11 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
EP0453559A1 (en) | PROCESS FOR PRODUCING A WELDED ARTICLE. | |
JP3054056B2 (ja) | はんだ付け方法 | |
EP0998175B1 (en) | Method for soldering Dpak-type electronic components to circuit boards | |
JPH03198975A (ja) | ハンダ付け装置 | |
CN106612592A (zh) | 预镀锡成型系统及其方法 | |
US6726087B2 (en) | Process and device for soldering electrical components on a plastic sheet | |
CN100405532C (zh) | 半导体部件的钎焊方法及半导体部件的安装构造 | |
JPS6348625B2 (enrdf_load_stackoverflow) | ||
JP2001185841A (ja) | 電子部品取付用加熱溶融装置 | |
JPH08172114A (ja) | 基板接続方法 | |
JPH10215064A (ja) | 弱耐熱性電子部品の実装方法 | |
JPH11307918A (ja) | ボンディング装置 | |
JPH0456028A (ja) | 温度ヒューズおよびその形成方法 | |
JPH10117065A (ja) | バンプ付きワークの半田付け方法 | |
JPS6222278B2 (enrdf_load_stackoverflow) | ||
JP2597695Y2 (ja) | リフロー炉 | |
JPH04315494A (ja) | 回路部品へのワイヤ接続方法 | |
JPS61208291A (ja) | 面実装型lsiの半田付け装置 | |
JPH0227833B2 (enrdf_load_stackoverflow) | ||
JPS5932913B2 (ja) | 部品を両面配線基板に強固にはんだ付けする方法 | |
JPH0621646A (ja) | 薄板配線板の半田付け方法およびその半田付け装置 | |
JPH088530A (ja) | 半導体チップの装着装置 | |
JPH0415414Y2 (enrdf_load_stackoverflow) | ||
JPS63121281A (ja) | 半田付け用圧着加熱体 | |
JPS58108681A (ja) | 半田付装置 |