JPS6348427B2 - - Google Patents

Info

Publication number
JPS6348427B2
JPS6348427B2 JP58022310A JP2231083A JPS6348427B2 JP S6348427 B2 JPS6348427 B2 JP S6348427B2 JP 58022310 A JP58022310 A JP 58022310A JP 2231083 A JP2231083 A JP 2231083A JP S6348427 B2 JPS6348427 B2 JP S6348427B2
Authority
JP
Japan
Prior art keywords
solder
transparent heat
resistant substrate
electrode
base metal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP58022310A
Other languages
English (en)
Japanese (ja)
Other versions
JPS59148352A (ja
Inventor
Hisao Ehata
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Instruments Inc
Original Assignee
Seiko Instruments Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Instruments Inc filed Critical Seiko Instruments Inc
Priority to JP58022310A priority Critical patent/JPS59148352A/ja
Publication of JPS59148352A publication Critical patent/JPS59148352A/ja
Publication of JPS6348427B2 publication Critical patent/JPS6348427B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/11—Manufacturing methods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods
    • H01L2224/113—Manufacturing methods by local deposition of the material of the bump connector
    • H01L2224/1133—Manufacturing methods by local deposition of the material of the bump connector in solid form
    • H01L2224/11334—Manufacturing methods by local deposition of the material of the bump connector in solid form using preformed bumps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
    • H01L2224/13001—Core members of the bump connector
    • H01L2224/13099—Material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Wire Bonding (AREA)
JP58022310A 1983-02-14 1983-02-14 半導体装置の電極形成方法 Granted JPS59148352A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58022310A JPS59148352A (ja) 1983-02-14 1983-02-14 半導体装置の電極形成方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58022310A JPS59148352A (ja) 1983-02-14 1983-02-14 半導体装置の電極形成方法

Publications (2)

Publication Number Publication Date
JPS59148352A JPS59148352A (ja) 1984-08-25
JPS6348427B2 true JPS6348427B2 (enExample) 1988-09-29

Family

ID=12079160

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58022310A Granted JPS59148352A (ja) 1983-02-14 1983-02-14 半導体装置の電極形成方法

Country Status (1)

Country Link
JP (1) JPS59148352A (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0254932A (ja) * 1988-08-20 1990-02-23 Fujitsu Ltd はんだバンプの形成方法
JP2650499B2 (ja) * 1991-02-19 1997-09-03 松下電器産業株式会社 電気的接続接点の形成方法および電子部品の実装方法
US5677566A (en) * 1995-05-08 1997-10-14 Micron Technology, Inc. Semiconductor chip package
MY130223A (en) 1996-08-27 2007-06-29 Nippon Steel Corp Semiconductor device provided with low melting point metal bumps and process for producing same
JP2008159948A (ja) * 2006-12-25 2008-07-10 Rohm Co Ltd 半導体装置

Also Published As

Publication number Publication date
JPS59148352A (ja) 1984-08-25

Similar Documents

Publication Publication Date Title
USRE49286E1 (en) Method of making flip chip
US6639314B2 (en) Solder bump structure and a method of forming the same
JP2622156B2 (ja) 集積回路パッド用の接触方法とその構造
JPS6348427B2 (enExample)
USRE48422E1 (en) Method of making flip chip
JPH02253628A (ja) 半導体装置の製造方法
JP2730492B2 (ja) 半導体装置
JP3506686B2 (ja) 半導体装置の製造方法
JPH03101234A (ja) 半導体装置の製造方法
JPH03101233A (ja) 電極構造及びその製造方法
JP2644079B2 (ja) 半導体集積回路
JPS61251152A (ja) バンプ形成方法
JPS61141158A (ja) バンプ電極形成方法
JPH09232321A (ja) バンプ電極及びその製造方法
JPS63119551A (ja) パタ−ニングされた金属膜の形成方法
JPH0715909B2 (ja) 半導体装置の製造方法
JPS63305533A (ja) 半導体装置の製造方法
JPS62136857A (ja) 半導体装置の製造方法
JPS6055643A (ja) 半導体装置の電極形成方法
JPH09172019A (ja) 下地電極の形成方法
JPH04278543A (ja) 半導体装置及びその製造方法
JP3036300B2 (ja) Ｔａｂテープの製造方法と半導体装置の製造方法
JPS639662B2 (enExample)
JPS61260648A (ja) 半導体装置の実装方法
JPH04250628A (ja) 半導体装置の製造方法