JPS6347265B2 - - Google Patents
Info
- Publication number
- JPS6347265B2 JPS6347265B2 JP57020917A JP2091782A JPS6347265B2 JP S6347265 B2 JPS6347265 B2 JP S6347265B2 JP 57020917 A JP57020917 A JP 57020917A JP 2091782 A JP2091782 A JP 2091782A JP S6347265 B2 JPS6347265 B2 JP S6347265B2
- Authority
- JP
- Japan
- Prior art keywords
- card
- module
- chip
- view
- cards
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07745—Mounting details of integrated circuit chips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Credit Cards Or The Like (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP57020917A JPS58138057A (ja) | 1982-02-12 | 1982-02-12 | Icカ−ド |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP57020917A JPS58138057A (ja) | 1982-02-12 | 1982-02-12 | Icカ−ド |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS58138057A JPS58138057A (ja) | 1983-08-16 |
JPS6347265B2 true JPS6347265B2 (en, 2012) | 1988-09-21 |
Family
ID=12040571
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP57020917A Granted JPS58138057A (ja) | 1982-02-12 | 1982-02-12 | Icカ−ド |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS58138057A (en, 2012) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0380359U (en, 2012) * | 1989-12-07 | 1991-08-16 |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5914084A (ja) * | 1982-07-15 | 1984-01-24 | Toppan Printing Co Ltd | Ic等を内蔵するカ−ドの製造方法 |
DE3235650A1 (de) * | 1982-09-27 | 1984-03-29 | Philips Patentverwaltung Gmbh, 2000 Hamburg | Informationskarte und verfahren zu ihrer herstellung |
DE3248385A1 (de) * | 1982-12-28 | 1984-06-28 | GAO Gesellschaft für Automation und Organisation mbH, 8000 München | Ausweiskarte mit integriertem schaltkreis |
JPS60126864U (ja) * | 1984-01-30 | 1985-08-26 | 共同印刷株式会社 | Icカ−ド |
JPS60126863U (ja) * | 1984-01-30 | 1985-08-26 | 共同印刷株式会社 | Icカ−ド |
JPS6121097U (ja) * | 1984-03-09 | 1986-02-06 | ソニー株式会社 | 回路装置 |
JPS611850U (ja) * | 1984-06-08 | 1986-01-08 | 松島工業株式会社 | 半導体素子 |
FR2599893B1 (fr) * | 1986-05-23 | 1996-08-02 | Ricoh Kk | Procede de montage d'un module electronique sur un substrat et carte a circuit integre |
JPS63132460A (ja) * | 1986-11-21 | 1988-06-04 | Mitsubishi Electric Corp | 薄型半導体モジユ−ル基板 |
JPH03114789A (ja) * | 1989-09-29 | 1991-05-15 | Mitsubishi Electric Corp | 半導体装置カード |
US5736781A (en) * | 1993-10-18 | 1998-04-07 | Oki Electric Industry Co., Ltd. | IC module and a data carrier employing the same |
FR2838850B1 (fr) * | 2002-04-18 | 2005-08-05 | Framatome Connectors Int | Procede de conditionnement de microcircuits electroniques pour carte a puce et microcircuit electronique ainsi obtenu |
-
1982
- 1982-02-12 JP JP57020917A patent/JPS58138057A/ja active Granted
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0380359U (en, 2012) * | 1989-12-07 | 1991-08-16 |
Also Published As
Publication number | Publication date |
---|---|
JPS58138057A (ja) | 1983-08-16 |
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