JPS6341215B2 - - Google Patents

Info

Publication number
JPS6341215B2
JPS6341215B2 JP54049027A JP4902779A JPS6341215B2 JP S6341215 B2 JPS6341215 B2 JP S6341215B2 JP 54049027 A JP54049027 A JP 54049027A JP 4902779 A JP4902779 A JP 4902779A JP S6341215 B2 JPS6341215 B2 JP S6341215B2
Authority
JP
Japan
Prior art keywords
wedge
bonding
wire
speed
tool
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP54049027A
Other languages
English (en)
Japanese (ja)
Other versions
JPS55141736A (en
Inventor
Kazuhisa Takashima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP4902779A priority Critical patent/JPS55141736A/ja
Priority to GB8013084A priority patent/GB2047596A/en
Priority to DE19803015683 priority patent/DE3015683A1/de
Publication of JPS55141736A publication Critical patent/JPS55141736A/ja
Publication of JPS6341215B2 publication Critical patent/JPS6341215B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
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    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
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    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/0555—Shape
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    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45117—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950°C
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    • H01L2224/859—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector involving monitoring, e.g. feedback loop
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    • H01L24/42—Wire connectors; Manufacturing methods related thereto
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    • H01L2924/15165—Monolayer substrate

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Wire Bonding (AREA)
JP4902779A 1979-04-23 1979-04-23 Method for wirebonding and wirebonder Granted JPS55141736A (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP4902779A JPS55141736A (en) 1979-04-23 1979-04-23 Method for wirebonding and wirebonder
GB8013084A GB2047596A (en) 1979-04-23 1980-04-21 Method of wire-bonding and wire-bonder
DE19803015683 DE3015683A1 (de) 1979-04-23 1980-04-23 Mikroschweissverfahren und -vorrichtung

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4902779A JPS55141736A (en) 1979-04-23 1979-04-23 Method for wirebonding and wirebonder

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP60212495A Division JPS6193638A (ja) 1985-09-27 1985-09-27 ワイヤホンダ

Publications (2)

Publication Number Publication Date
JPS55141736A JPS55141736A (en) 1980-11-05
JPS6341215B2 true JPS6341215B2 (enrdf_load_stackoverflow) 1988-08-16

Family

ID=12819608

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4902779A Granted JPS55141736A (en) 1979-04-23 1979-04-23 Method for wirebonding and wirebonder

Country Status (3)

Country Link
JP (1) JPS55141736A (enrdf_load_stackoverflow)
DE (1) DE3015683A1 (enrdf_load_stackoverflow)
GB (1) GB2047596A (enrdf_load_stackoverflow)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2125720B (en) * 1982-08-24 1986-11-05 Asm Assembly Automation Ltd Wire bonding apparatus
US4603803A (en) * 1982-08-24 1986-08-05 Asm Assembly Automation, Ltd. Wire bonding apparatus
KR880701152A (ko) * 1986-05-16 1988-07-25 파라사트 파하드 수동와이어 본딩장치
JP2755667B2 (ja) * 1989-03-27 1998-05-20 株式会社東芝 モータ駆動回路及びワイヤボンディング装置
JP2549191B2 (ja) * 1990-09-10 1996-10-30 株式会社日立製作所 ワイヤボンディング方法、およびその装置
US5443200A (en) * 1993-10-13 1995-08-22 Matsushita Electric Industrial Co., Ltd. Bonding apparatus and bonding method
DE102020007235A1 (de) * 2020-11-26 2022-06-02 Mühlbauer Gmbh & Co. Kg Thermokompressionsvorrichtung und Verfahren zum Verbinden von elektrischen Bauteilen mit einem Substrat

Also Published As

Publication number Publication date
GB2047596A (en) 1980-12-03
DE3015683A1 (de) 1980-11-13
JPS55141736A (en) 1980-11-05

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