GB2047596A - Method of wire-bonding and wire-bonder - Google Patents

Method of wire-bonding and wire-bonder Download PDF

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Publication number
GB2047596A
GB2047596A GB8013084A GB8013084A GB2047596A GB 2047596 A GB2047596 A GB 2047596A GB 8013084 A GB8013084 A GB 8013084A GB 8013084 A GB8013084 A GB 8013084A GB 2047596 A GB2047596 A GB 2047596A
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GB
United Kingdom
Prior art keywords
bonding
wire
tool
distance
electrodes
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
GB8013084A
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English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Publication of GB2047596A publication Critical patent/GB2047596A/en
Withdrawn legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H—ELECTRICITY
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    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
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    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/0555—Shape
    • H01L2224/05552—Shape in top view
    • H01L2224/05554—Shape in top view being square
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    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45117—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950°C
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    • H01L2224/92—Specific sequence of method steps
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    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
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    • H01L2924/15165—Monolayer substrate

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Wire Bonding (AREA)
GB8013084A 1979-04-23 1980-04-21 Method of wire-bonding and wire-bonder Withdrawn GB2047596A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4902779A JPS55141736A (en) 1979-04-23 1979-04-23 Method for wirebonding and wirebonder

Publications (1)

Publication Number Publication Date
GB2047596A true GB2047596A (en) 1980-12-03

Family

ID=12819608

Family Applications (1)

Application Number Title Priority Date Filing Date
GB8013084A Withdrawn GB2047596A (en) 1979-04-23 1980-04-21 Method of wire-bonding and wire-bonder

Country Status (3)

Country Link
JP (1) JPS55141736A (enrdf_load_stackoverflow)
DE (1) DE3015683A1 (enrdf_load_stackoverflow)
GB (1) GB2047596A (enrdf_load_stackoverflow)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2125720A (en) * 1982-08-24 1984-03-14 Asm Assembly Automation Ltd Wire bonding apparatus
US4603803A (en) * 1982-08-24 1986-08-05 Asm Assembly Automation, Ltd. Wire bonding apparatus
WO1987006864A3 (fr) * 1986-05-16 1988-02-25 Farassat Farhad Dispositif pour la connexion manuelle de conducteurs
EP0390036A1 (en) * 1989-03-27 1990-10-03 Kabushiki Kaisha Toshiba Motor-driving circuit and wire-bonding apparatus
US12308340B2 (en) * 2020-11-26 2025-05-20 Mb Automation Gmbh & Co. Kg Thermocompression apparatus and method for bonding electrical components to a substrate

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2549191B2 (ja) * 1990-09-10 1996-10-30 株式会社日立製作所 ワイヤボンディング方法、およびその装置
US5443200A (en) * 1993-10-13 1995-08-22 Matsushita Electric Industrial Co., Ltd. Bonding apparatus and bonding method

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2125720A (en) * 1982-08-24 1984-03-14 Asm Assembly Automation Ltd Wire bonding apparatus
US4603803A (en) * 1982-08-24 1986-08-05 Asm Assembly Automation, Ltd. Wire bonding apparatus
WO1987006864A3 (fr) * 1986-05-16 1988-02-25 Farassat Farhad Dispositif pour la connexion manuelle de conducteurs
US4878609A (en) * 1986-05-16 1989-11-07 Emhart Industries Inc. Apparatus for manual wire bonding
EP0390036A1 (en) * 1989-03-27 1990-10-03 Kabushiki Kaisha Toshiba Motor-driving circuit and wire-bonding apparatus
US5080276A (en) * 1989-03-27 1992-01-14 Kabushiki Kaisha Toshiba Motor-driving circuit and wire-bonding apparatus
US5317242A (en) * 1989-03-27 1994-05-31 Kabushiki Kaisha Toshiba Motor-driving circuit and wire-bonding apparatus
US12308340B2 (en) * 2020-11-26 2025-05-20 Mb Automation Gmbh & Co. Kg Thermocompression apparatus and method for bonding electrical components to a substrate

Also Published As

Publication number Publication date
DE3015683A1 (de) 1980-11-13
JPS6341215B2 (enrdf_load_stackoverflow) 1988-08-16
JPS55141736A (en) 1980-11-05

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