JPS6313344B2 - - Google Patents

Info

Publication number
JPS6313344B2
JPS6313344B2 JP13681778A JP13681778A JPS6313344B2 JP S6313344 B2 JPS6313344 B2 JP S6313344B2 JP 13681778 A JP13681778 A JP 13681778A JP 13681778 A JP13681778 A JP 13681778A JP S6313344 B2 JPS6313344 B2 JP S6313344B2
Authority
JP
Japan
Prior art keywords
bonding
wire
bonding tool
time
tool
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP13681778A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5563833A (en
Inventor
Nobuhiro Takasugi
Ryuichi Kyomasu
Kazuhisa Takashima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP13681778A priority Critical patent/JPS5563833A/ja
Publication of JPS5563833A publication Critical patent/JPS5563833A/ja
Publication of JPS6313344B2 publication Critical patent/JPS6313344B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements

Landscapes

  • Wire Bonding (AREA)
JP13681778A 1978-11-08 1978-11-08 Wire bonding device Granted JPS5563833A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13681778A JPS5563833A (en) 1978-11-08 1978-11-08 Wire bonding device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13681778A JPS5563833A (en) 1978-11-08 1978-11-08 Wire bonding device

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP63323310A Division JPH01199442A (ja) 1988-12-23 1988-12-23 ワイヤボンディング方法

Publications (2)

Publication Number Publication Date
JPS5563833A JPS5563833A (en) 1980-05-14
JPS6313344B2 true JPS6313344B2 (enrdf_load_stackoverflow) 1988-03-25

Family

ID=15184191

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13681778A Granted JPS5563833A (en) 1978-11-08 1978-11-08 Wire bonding device

Country Status (1)

Country Link
JP (1) JPS5563833A (enrdf_load_stackoverflow)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6230341A (ja) * 1985-07-31 1987-02-09 Fujitsu Ltd ワイヤボンデイング方法
JPH0388344A (ja) * 1989-08-31 1991-04-12 Seiko Epson Corp インナーリードのボンディング方法

Also Published As

Publication number Publication date
JPS5563833A (en) 1980-05-14

Similar Documents

Publication Publication Date Title
JP3329623B2 (ja) ワイヤボンディング装置およびワイヤボンディング方法
US5176311A (en) High yield clampless wire bonding method
US20030098333A1 (en) Wire bonding device and wire bonding method
JP2506958B2 (ja) ワイヤボンディング装置
JPS6313344B2 (enrdf_load_stackoverflow)
JPS6341215B2 (enrdf_load_stackoverflow)
JPH01199442A (ja) ワイヤボンディング方法
JPH06132347A (ja) ワイヤボンダ−
JP2524363B2 (ja) ワイヤボンディング装置
JP2003332363A (ja) ボンディング装置および半導体装置の製造方法
JP3567644B2 (ja) ワイヤボンダーの座標検出順序決定装置
JP6973831B2 (ja) ワイヤボンディング装置
JP2676446B2 (ja) ワイヤボンディング方法
JP2789395B2 (ja) ワイヤボンデイング方法
JPH0513517A (ja) ワイヤボンデイング装置及びワイヤボンデイング方法
JPS6193638A (ja) ワイヤホンダ
JP2880832B2 (ja) ワイヤボンディング方法
JPH07161752A (ja) ボンディング装置及びボンディング方法
JPS61105852A (ja) ワイヤボンダ
JPH04324942A (ja) ワイヤボンディング方法
JPH039525A (ja) バンプ形成方法及びその形成装置
JPH07235562A (ja) ウエッジボンディング装置
JPH0563011A (ja) ダイボンダー・ヘツドの構造
JP2000058582A (ja) ワイヤボンディング装置
JPS6256658B2 (enrdf_load_stackoverflow)