JPS5563833A - Wire bonding device - Google Patents

Wire bonding device

Info

Publication number
JPS5563833A
JPS5563833A JP13681778A JP13681778A JPS5563833A JP S5563833 A JPS5563833 A JP S5563833A JP 13681778 A JP13681778 A JP 13681778A JP 13681778 A JP13681778 A JP 13681778A JP S5563833 A JPS5563833 A JP S5563833A
Authority
JP
Japan
Prior art keywords
time
bonding
movement
plane
wire bonding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP13681778A
Other languages
Japanese (ja)
Other versions
JPS6313344B2 (en
Inventor
Nobuhiro Takasugi
Ryuichi Kyomasu
Kazuhisa Takashima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP13681778A priority Critical patent/JPS5563833A/en
Publication of JPS5563833A publication Critical patent/JPS5563833A/en
Publication of JPS6313344B2 publication Critical patent/JPS6313344B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements

Landscapes

  • Wire Bonding (AREA)

Abstract

PURPOSE: To operate the bonding tool efficiently and reduce operational cost, by specifying the speed of up-and-down movement of the bonding tool with respect to its plane displacement at the time of wire bonding.
CONSTITUTION: The bonding tool at the time of wire bonding waits for the completion of its plane movement in time T0WT1, and operates the bonding of pellet 1 to electrode 2 in time T1WT4, waits for the completion of its movement to lead 3 in time T4WT5 and operates bonding specified position 4 on lead 3 in time T5W T8. The time during which the bonding tool remains at a high position, namely, the time of its plane movement, is lengthened or shortened in accordance with the magnitude of its plane displacement l. To accomplish this, the rotation of a motor, which makes up-and-down movement, is made into two stages, and by calculating from the information on the bonding position, the high and low rotations are determined, or the switching to the low speed is done with the start of its plane movement. By this, a series of wire bonding operations can be done efficiently, and thereby operational cost can be reduced.
COPYRIGHT: (C)1980,JPO&Japio
JP13681778A 1978-11-08 1978-11-08 Wire bonding device Granted JPS5563833A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13681778A JPS5563833A (en) 1978-11-08 1978-11-08 Wire bonding device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13681778A JPS5563833A (en) 1978-11-08 1978-11-08 Wire bonding device

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP63323310A Division JPH01199442A (en) 1988-12-23 1988-12-23 Wire bonding

Publications (2)

Publication Number Publication Date
JPS5563833A true JPS5563833A (en) 1980-05-14
JPS6313344B2 JPS6313344B2 (en) 1988-03-25

Family

ID=15184191

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13681778A Granted JPS5563833A (en) 1978-11-08 1978-11-08 Wire bonding device

Country Status (1)

Country Link
JP (1) JPS5563833A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6230341A (en) * 1985-07-31 1987-02-09 Fujitsu Ltd Wire bonding method
JPH0388344A (en) * 1989-08-31 1991-04-12 Seiko Epson Corp Bonding method of inner lead

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6230341A (en) * 1985-07-31 1987-02-09 Fujitsu Ltd Wire bonding method
JPH0457100B2 (en) * 1985-07-31 1992-09-10 Fujitsu Kk
JPH0388344A (en) * 1989-08-31 1991-04-12 Seiko Epson Corp Bonding method of inner lead
JPH0574223B2 (en) * 1989-08-31 1993-10-18 Seiko Epson Corp

Also Published As

Publication number Publication date
JPS6313344B2 (en) 1988-03-25

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