JPS6336340B2 - - Google Patents

Info

Publication number
JPS6336340B2
JPS6336340B2 JP57029274A JP2927482A JPS6336340B2 JP S6336340 B2 JPS6336340 B2 JP S6336340B2 JP 57029274 A JP57029274 A JP 57029274A JP 2927482 A JP2927482 A JP 2927482A JP S6336340 B2 JPS6336340 B2 JP S6336340B2
Authority
JP
Japan
Prior art keywords
phenolic resin
paper
weight
laminates
copper
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP57029274A
Other languages
English (en)
Japanese (ja)
Other versions
JPS58145732A (ja
Inventor
Mitsuo Yokota
Kenji Sotogi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Priority to JP57029274A priority Critical patent/JPS58145732A/ja
Publication of JPS58145732A publication Critical patent/JPS58145732A/ja
Publication of JPS6336340B2 publication Critical patent/JPS6336340B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02W—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO WASTEWATER TREATMENT OR WASTE MANAGEMENT
    • Y02W30/00—Technologies for solid waste management
    • Y02W30/50—Reuse, recycling or recovery technologies
    • Y02W30/62—Plastics recycling; Rubber recycling

Landscapes

  • Separation, Recovery Or Treatment Of Waste Materials Containing Plastics (AREA)
  • Reinforced Plastic Materials (AREA)
  • Laminated Bodies (AREA)
  • Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
JP57029274A 1982-02-24 1982-02-24 紙フエノ−ル樹脂積層板の製造法 Granted JPS58145732A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57029274A JPS58145732A (ja) 1982-02-24 1982-02-24 紙フエノ−ル樹脂積層板の製造法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57029274A JPS58145732A (ja) 1982-02-24 1982-02-24 紙フエノ−ル樹脂積層板の製造法

Publications (2)

Publication Number Publication Date
JPS58145732A JPS58145732A (ja) 1983-08-30
JPS6336340B2 true JPS6336340B2 (enrdf_load_stackoverflow) 1988-07-20

Family

ID=12271697

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57029274A Granted JPS58145732A (ja) 1982-02-24 1982-02-24 紙フエノ−ル樹脂積層板の製造法

Country Status (1)

Country Link
JP (1) JPS58145732A (enrdf_load_stackoverflow)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1721928A1 (en) * 2005-05-13 2006-11-15 Coveright Surfaces Holding GmbH Resin composition comprising waste of resin impregnated material

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51106146A (ja) * 1975-03-15 1976-09-20 Matsushita Electric Works Ltd Tainetsuseidannetsuseikeihin
JPS5542868A (en) * 1978-09-22 1980-03-26 Matsushita Electric Works Ltd Method of reusing copper lined laminated plate waste material

Also Published As

Publication number Publication date
JPS58145732A (ja) 1983-08-30

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