JPS63312934A - 半導体用リ−ドフレ−ム材 - Google Patents

半導体用リ−ドフレ−ム材

Info

Publication number
JPS63312934A
JPS63312934A JP62150009A JP15000987A JPS63312934A JP S63312934 A JPS63312934 A JP S63312934A JP 62150009 A JP62150009 A JP 62150009A JP 15000987 A JP15000987 A JP 15000987A JP S63312934 A JPS63312934 A JP S63312934A
Authority
JP
Japan
Prior art keywords
lead frame
frame material
semiconductor
lead
oxygen content
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP62150009A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0524216B2 (enExample
Inventor
Hajime Abe
元 阿部
Hajime Sasaki
元 佐々木
Kuniaki Seki
関　邦彰
Hiroshi Kato
博史 加藤
Toru Matsui
透 松井
Norio Otani
大谷　憲夫
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Cable Ltd
Original Assignee
Hitachi Cable Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Cable Ltd filed Critical Hitachi Cable Ltd
Priority to JP62150009A priority Critical patent/JPS63312934A/ja
Publication of JPS63312934A publication Critical patent/JPS63312934A/ja
Publication of JPH0524216B2 publication Critical patent/JPH0524216B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
JP62150009A 1987-06-16 1987-06-16 半導体用リ−ドフレ−ム材 Granted JPS63312934A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62150009A JPS63312934A (ja) 1987-06-16 1987-06-16 半導体用リ−ドフレ−ム材

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62150009A JPS63312934A (ja) 1987-06-16 1987-06-16 半導体用リ−ドフレ−ム材

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP4278367A Division JPH05255777A (ja) 1992-10-16 1992-10-16 半導体用リードフレーム材

Publications (2)

Publication Number Publication Date
JPS63312934A true JPS63312934A (ja) 1988-12-21
JPH0524216B2 JPH0524216B2 (enExample) 1993-04-07

Family

ID=15487481

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62150009A Granted JPS63312934A (ja) 1987-06-16 1987-06-16 半導体用リ−ドフレ−ム材

Country Status (1)

Country Link
JP (1) JPS63312934A (enExample)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02170932A (ja) * 1988-12-24 1990-07-02 Nippon Mining Co Ltd ダイレクトボンディング性の良好な銅合金
JPH02263941A (ja) * 1989-04-04 1990-10-26 Hitachi Cable Ltd メタルガスケット
JPH04165055A (ja) * 1990-10-29 1992-06-10 Hitachi Cable Ltd 半導体装置用リードフレーム材
EP0688879A1 (en) * 1994-06-20 1995-12-27 Mitsubishi Materials Corporation High vacuum apparatus member and vacuum apparatus

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012170930A1 (en) 2011-06-08 2012-12-13 Shire Human Genetic Therapies, Inc Lipid nanoparticle compositions and methods for mrna delivery

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54104597A (en) * 1978-02-03 1979-08-16 Nippon Mining Co Copper alloy for lead frame
JPS54114078A (en) * 1978-02-24 1979-09-05 Hitachi Cable Ltd Lead material for semiconductor apparatus
JPS58141544A (ja) * 1982-02-17 1983-08-22 Toshiba Corp 電子部品
JPS59193233A (ja) * 1983-04-15 1984-11-01 Toshiba Corp 銅合金

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54104597A (en) * 1978-02-03 1979-08-16 Nippon Mining Co Copper alloy for lead frame
JPS54114078A (en) * 1978-02-24 1979-09-05 Hitachi Cable Ltd Lead material for semiconductor apparatus
JPS58141544A (ja) * 1982-02-17 1983-08-22 Toshiba Corp 電子部品
JPS59193233A (ja) * 1983-04-15 1984-11-01 Toshiba Corp 銅合金

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02170932A (ja) * 1988-12-24 1990-07-02 Nippon Mining Co Ltd ダイレクトボンディング性の良好な銅合金
JPH02263941A (ja) * 1989-04-04 1990-10-26 Hitachi Cable Ltd メタルガスケット
JPH04165055A (ja) * 1990-10-29 1992-06-10 Hitachi Cable Ltd 半導体装置用リードフレーム材
EP0688879A1 (en) * 1994-06-20 1995-12-27 Mitsubishi Materials Corporation High vacuum apparatus member and vacuum apparatus

Also Published As

Publication number Publication date
JPH0524216B2 (enExample) 1993-04-07

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