JPS6327850B2 - - Google Patents
Info
- Publication number
- JPS6327850B2 JPS6327850B2 JP54125441A JP12544179A JPS6327850B2 JP S6327850 B2 JPS6327850 B2 JP S6327850B2 JP 54125441 A JP54125441 A JP 54125441A JP 12544179 A JP12544179 A JP 12544179A JP S6327850 B2 JPS6327850 B2 JP S6327850B2
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- hydrophilicity
- film
- degree
- silane compound
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H10P95/00—
Landscapes
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Weting (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12544179A JPS5649526A (en) | 1979-09-29 | 1979-09-29 | Manufacture of semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12544179A JPS5649526A (en) | 1979-09-29 | 1979-09-29 | Manufacture of semiconductor device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5649526A JPS5649526A (en) | 1981-05-06 |
| JPS6327850B2 true JPS6327850B2 (OSRAM) | 1988-06-06 |
Family
ID=14910158
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12544179A Granted JPS5649526A (en) | 1979-09-29 | 1979-09-29 | Manufacture of semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5649526A (OSRAM) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5768834A (en) * | 1980-10-17 | 1982-04-27 | Matsushita Electric Ind Co Ltd | Photographic etching method |
| JPS5844715A (ja) * | 1981-09-11 | 1983-03-15 | Fujitsu Ltd | 微細パタ−ン形成方法 |
| JPS59136935A (ja) * | 1983-01-27 | 1984-08-06 | Nec Corp | 半導体装置の製造方法 |
| KR20020006735A (ko) * | 2000-07-13 | 2002-01-26 | 이형도 | 미세 디바이스의 표면처리물질 및 표면처리방법 |
| US8617799B2 (en) * | 2008-09-22 | 2013-12-31 | Api Technologies Corp. | Post arrays and methods of making the same |
| KR102189379B1 (ko) | 2008-10-21 | 2020-12-11 | 도오꾜오까고오교 가부시끼가이샤 | 표면 처리액 및 표면 처리 방법, 그리고 소수화 처리 방법 및 소수화된 기판 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5434769A (en) * | 1977-08-24 | 1979-03-14 | Fuji Electric Co Ltd | Photoetching method for silicon semiconductor wafer |
-
1979
- 1979-09-29 JP JP12544179A patent/JPS5649526A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5649526A (en) | 1981-05-06 |
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