JPS5649526A - Manufacture of semiconductor device - Google Patents

Manufacture of semiconductor device

Info

Publication number
JPS5649526A
JPS5649526A JP12544179A JP12544179A JPS5649526A JP S5649526 A JPS5649526 A JP S5649526A JP 12544179 A JP12544179 A JP 12544179A JP 12544179 A JP12544179 A JP 12544179A JP S5649526 A JPS5649526 A JP S5649526A
Authority
JP
Japan
Prior art keywords
film
semiconductor substrate
soaked
dissolved
organic solvent
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP12544179A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6327850B2 (OSRAM
Inventor
Chiharu Kato
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP12544179A priority Critical patent/JPS5649526A/ja
Publication of JPS5649526A publication Critical patent/JPS5649526A/ja
Publication of JPS6327850B2 publication Critical patent/JPS6327850B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10P95/00

Landscapes

  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Weting (AREA)
JP12544179A 1979-09-29 1979-09-29 Manufacture of semiconductor device Granted JPS5649526A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12544179A JPS5649526A (en) 1979-09-29 1979-09-29 Manufacture of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12544179A JPS5649526A (en) 1979-09-29 1979-09-29 Manufacture of semiconductor device

Publications (2)

Publication Number Publication Date
JPS5649526A true JPS5649526A (en) 1981-05-06
JPS6327850B2 JPS6327850B2 (OSRAM) 1988-06-06

Family

ID=14910158

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12544179A Granted JPS5649526A (en) 1979-09-29 1979-09-29 Manufacture of semiconductor device

Country Status (1)

Country Link
JP (1) JPS5649526A (OSRAM)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5768834A (en) * 1980-10-17 1982-04-27 Matsushita Electric Ind Co Ltd Photographic etching method
JPS5844715A (ja) * 1981-09-11 1983-03-15 Fujitsu Ltd 微細パタ−ン形成方法
JPS59136935A (ja) * 1983-01-27 1984-08-06 Nec Corp 半導体装置の製造方法
KR20020006735A (ko) * 2000-07-13 2002-01-26 이형도 미세 디바이스의 표면처리물질 및 표면처리방법
US20100075262A1 (en) * 2008-09-22 2010-03-25 Robert Koefer Post arrays and methods of making the same
US9244358B2 (en) 2008-10-21 2016-01-26 Tokyo Ohka Kogyo Co., Ltd. Surface treatment liquid, surface treatment method, hydrophobilization method, and hydrophobilized substrate

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5434769A (en) * 1977-08-24 1979-03-14 Fuji Electric Co Ltd Photoetching method for silicon semiconductor wafer

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5434769A (en) * 1977-08-24 1979-03-14 Fuji Electric Co Ltd Photoetching method for silicon semiconductor wafer

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5768834A (en) * 1980-10-17 1982-04-27 Matsushita Electric Ind Co Ltd Photographic etching method
JPS5844715A (ja) * 1981-09-11 1983-03-15 Fujitsu Ltd 微細パタ−ン形成方法
JPS59136935A (ja) * 1983-01-27 1984-08-06 Nec Corp 半導体装置の製造方法
KR20020006735A (ko) * 2000-07-13 2002-01-26 이형도 미세 디바이스의 표면처리물질 및 표면처리방법
US20100075262A1 (en) * 2008-09-22 2010-03-25 Robert Koefer Post arrays and methods of making the same
US8617799B2 (en) * 2008-09-22 2013-12-31 Api Technologies Corp. Post arrays and methods of making the same
US9244358B2 (en) 2008-10-21 2016-01-26 Tokyo Ohka Kogyo Co., Ltd. Surface treatment liquid, surface treatment method, hydrophobilization method, and hydrophobilized substrate

Also Published As

Publication number Publication date
JPS6327850B2 (OSRAM) 1988-06-06

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