JPS6325500B2 - - Google Patents

Info

Publication number
JPS6325500B2
JPS6325500B2 JP56159281A JP15928181A JPS6325500B2 JP S6325500 B2 JPS6325500 B2 JP S6325500B2 JP 56159281 A JP56159281 A JP 56159281A JP 15928181 A JP15928181 A JP 15928181A JP S6325500 B2 JPS6325500 B2 JP S6325500B2
Authority
JP
Japan
Prior art keywords
wafer
wafer holder
wafers
holder
main body
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP56159281A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5860552A (ja
Inventor
Akira Uehara
Isamu Hijikata
Hisashi Nakane
Muneo Nakayama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Ohka Kogyo Co Ltd
Original Assignee
Tokyo Ohka Kogyo Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Ohka Kogyo Co Ltd filed Critical Tokyo Ohka Kogyo Co Ltd
Priority to JP15928181A priority Critical patent/JPS5860552A/ja
Priority to US06/424,503 priority patent/US4550239A/en
Publication of JPS5860552A publication Critical patent/JPS5860552A/ja
Publication of JPS6325500B2 publication Critical patent/JPS6325500B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/02—Details
    • H01J37/20—Means for supporting or positioning the object or the material; Means for adjusting diaphragms or lenses associated with the support

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Analytical Chemistry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Drying Of Semiconductors (AREA)
  • Physical Vapour Deposition (AREA)
  • ing And Chemical Polishing (AREA)
JP15928181A 1981-10-05 1981-10-05 縦型自動プラズマ処理装置 Granted JPS5860552A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP15928181A JPS5860552A (ja) 1981-10-05 1981-10-05 縦型自動プラズマ処理装置
US06/424,503 US4550239A (en) 1981-10-05 1982-09-27 Automatic plasma processing device and heat treatment device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15928181A JPS5860552A (ja) 1981-10-05 1981-10-05 縦型自動プラズマ処理装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP62125192A Division JPS63260047A (ja) 1987-05-22 1987-05-22 ウエハ−保持体

Publications (2)

Publication Number Publication Date
JPS5860552A JPS5860552A (ja) 1983-04-11
JPS6325500B2 true JPS6325500B2 (enrdf_load_stackoverflow) 1988-05-25

Family

ID=15690362

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15928181A Granted JPS5860552A (ja) 1981-10-05 1981-10-05 縦型自動プラズマ処理装置

Country Status (1)

Country Link
JP (1) JPS5860552A (enrdf_load_stackoverflow)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60258459A (ja) * 1984-06-04 1985-12-20 Deisuko Saiyaa Japan:Kk 縦型熱処理装置
JPS63260047A (ja) * 1987-05-22 1988-10-27 Tokyo Ohka Kogyo Co Ltd ウエハ−保持体
KR960001161B1 (ko) * 1987-09-29 1996-01-19 도오교오 에레구토론 사가미 가부시끼가이샤 열처리장치
JPH0195730U (enrdf_load_stackoverflow) * 1987-12-18 1989-06-26
KR0139816B1 (ko) * 1988-02-26 1998-07-15 노보루 후세 열처리 장치 및 열처리 방법
JPH0268923A (ja) * 1988-09-02 1990-03-08 Tel Sagami Ltd 縦形熱処理装置
JPH0825151B2 (ja) * 1988-09-16 1996-03-13 東京応化工業株式会社 ハンドリングユニット
JPH0754999Y2 (ja) * 1989-05-17 1995-12-18 エム・シー・エレクトロニクス株式会社 縦型プラズマ処理機のリアクター
JPH0735393Y2 (ja) * 1989-07-25 1995-08-09 ラムコ株式会社 縦型プラズマ処理機のウエハー搬送装置
JP3530986B2 (ja) * 1995-06-22 2004-05-24 東京エレクトロン株式会社 移載アームのティーチング方法及び熱処理装置

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3889355A (en) * 1973-02-05 1975-06-17 Ibm Continuous processing system
JPS50126175A (enrdf_load_stackoverflow) * 1974-03-22 1975-10-03
JPS513743U (enrdf_load_stackoverflow) * 1974-06-25 1976-01-12
JPS5633149Y2 (enrdf_load_stackoverflow) * 1976-12-16 1981-08-06
JPS5691417A (en) * 1979-12-26 1981-07-24 Fujitsu Ltd Heating treatment device for wafer

Also Published As

Publication number Publication date
JPS5860552A (ja) 1983-04-11

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