JPS5860552A - 縦型自動プラズマ処理装置 - Google Patents

縦型自動プラズマ処理装置

Info

Publication number
JPS5860552A
JPS5860552A JP15928181A JP15928181A JPS5860552A JP S5860552 A JPS5860552 A JP S5860552A JP 15928181 A JP15928181 A JP 15928181A JP 15928181 A JP15928181 A JP 15928181A JP S5860552 A JPS5860552 A JP S5860552A
Authority
JP
Japan
Prior art keywords
wafer
chamber
wafers
plasma
holder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP15928181A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6325500B2 (enrdf_load_stackoverflow
Inventor
Akira Uehara
植原　晃
Isamu Hijikata
土方　勇
Hisashi Nakane
中根　久
Muneo Nakayama
中山　宗雄
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TOKYO DENSHI KAGAKU KABUSHIKI
Tokyo Denshi Kagaku KK
Original Assignee
TOKYO DENSHI KAGAKU KABUSHIKI
Tokyo Denshi Kagaku KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by TOKYO DENSHI KAGAKU KABUSHIKI, Tokyo Denshi Kagaku KK filed Critical TOKYO DENSHI KAGAKU KABUSHIKI
Priority to JP15928181A priority Critical patent/JPS5860552A/ja
Priority to US06/424,503 priority patent/US4550239A/en
Publication of JPS5860552A publication Critical patent/JPS5860552A/ja
Publication of JPS6325500B2 publication Critical patent/JPS6325500B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/02—Details
    • H01J37/20—Means for supporting or positioning the object or the material; Means for adjusting diaphragms or lenses associated with the support

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Drying Of Semiconductors (AREA)
  • Physical Vapour Deposition (AREA)
  • ing And Chemical Polishing (AREA)
JP15928181A 1981-10-05 1981-10-05 縦型自動プラズマ処理装置 Granted JPS5860552A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP15928181A JPS5860552A (ja) 1981-10-05 1981-10-05 縦型自動プラズマ処理装置
US06/424,503 US4550239A (en) 1981-10-05 1982-09-27 Automatic plasma processing device and heat treatment device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15928181A JPS5860552A (ja) 1981-10-05 1981-10-05 縦型自動プラズマ処理装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP62125192A Division JPS63260047A (ja) 1987-05-22 1987-05-22 ウエハ−保持体

Publications (2)

Publication Number Publication Date
JPS5860552A true JPS5860552A (ja) 1983-04-11
JPS6325500B2 JPS6325500B2 (enrdf_load_stackoverflow) 1988-05-25

Family

ID=15690362

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15928181A Granted JPS5860552A (ja) 1981-10-05 1981-10-05 縦型自動プラズマ処理装置

Country Status (1)

Country Link
JP (1) JPS5860552A (enrdf_load_stackoverflow)

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60258459A (ja) * 1984-06-04 1985-12-20 Deisuko Saiyaa Japan:Kk 縦型熱処理装置
JPS63260047A (ja) * 1987-05-22 1988-10-27 Tokyo Ohka Kogyo Co Ltd ウエハ−保持体
JPH0195730U (enrdf_load_stackoverflow) * 1987-12-18 1989-06-26
JPH0268923A (ja) * 1988-09-02 1990-03-08 Tel Sagami Ltd 縦形熱処理装置
US4954684A (en) * 1988-02-26 1990-09-04 Tel Sagami Limited Vertical type heat-treating apparatus and heat-treating method
US4976613A (en) * 1987-09-29 1990-12-11 Tel Sagani Limited Heat treatment apparatus
JPH02146426U (enrdf_load_stackoverflow) * 1989-05-17 1990-12-12
JPH0327049U (enrdf_load_stackoverflow) * 1989-07-25 1991-03-19
US5083896A (en) * 1988-09-16 1992-01-28 Tokyo Ohka Kogyo Co., Ltd. Object handling device
US5822498A (en) * 1995-06-22 1998-10-13 Tokyo Electron Limited Teaching method for loading arm for objects to be processed

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS49107678A (enrdf_load_stackoverflow) * 1973-02-05 1974-10-12
JPS50126175A (enrdf_load_stackoverflow) * 1974-03-22 1975-10-03
JPS513743U (enrdf_load_stackoverflow) * 1974-06-25 1976-01-12
JPS5342575U (enrdf_load_stackoverflow) * 1976-12-16 1978-04-12
JPS5691417A (en) * 1979-12-26 1981-07-24 Fujitsu Ltd Heating treatment device for wafer

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS49107678A (enrdf_load_stackoverflow) * 1973-02-05 1974-10-12
JPS50126175A (enrdf_load_stackoverflow) * 1974-03-22 1975-10-03
JPS513743U (enrdf_load_stackoverflow) * 1974-06-25 1976-01-12
JPS5342575U (enrdf_load_stackoverflow) * 1976-12-16 1978-04-12
JPS5691417A (en) * 1979-12-26 1981-07-24 Fujitsu Ltd Heating treatment device for wafer

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60258459A (ja) * 1984-06-04 1985-12-20 Deisuko Saiyaa Japan:Kk 縦型熱処理装置
JPS63260047A (ja) * 1987-05-22 1988-10-27 Tokyo Ohka Kogyo Co Ltd ウエハ−保持体
US4976613A (en) * 1987-09-29 1990-12-11 Tel Sagani Limited Heat treatment apparatus
JPH0195730U (enrdf_load_stackoverflow) * 1987-12-18 1989-06-26
US4954684A (en) * 1988-02-26 1990-09-04 Tel Sagami Limited Vertical type heat-treating apparatus and heat-treating method
JPH0268923A (ja) * 1988-09-02 1990-03-08 Tel Sagami Ltd 縦形熱処理装置
US5083896A (en) * 1988-09-16 1992-01-28 Tokyo Ohka Kogyo Co., Ltd. Object handling device
US5584647A (en) * 1988-09-16 1996-12-17 Tokyo Ohka Kogyo Co., Ltd. Object handling devices
JPH02146426U (enrdf_load_stackoverflow) * 1989-05-17 1990-12-12
JPH0327049U (enrdf_load_stackoverflow) * 1989-07-25 1991-03-19
US5822498A (en) * 1995-06-22 1998-10-13 Tokyo Electron Limited Teaching method for loading arm for objects to be processed

Also Published As

Publication number Publication date
JPS6325500B2 (enrdf_load_stackoverflow) 1988-05-25

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