JPS63250188A - Insulating substrate for printed wiring board - Google Patents
Insulating substrate for printed wiring boardInfo
- Publication number
- JPS63250188A JPS63250188A JP8504187A JP8504187A JPS63250188A JP S63250188 A JPS63250188 A JP S63250188A JP 8504187 A JP8504187 A JP 8504187A JP 8504187 A JP8504187 A JP 8504187A JP S63250188 A JPS63250188 A JP S63250188A
- Authority
- JP
- Japan
- Prior art keywords
- printed wiring
- insulating base
- base material
- wiring board
- glass cloth
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 title description 2
- 239000000463 material Substances 0.000 claims description 24
- 239000004744 fabric Substances 0.000 claims description 15
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 13
- 239000000945 filler Substances 0.000 claims description 9
- 229920005992 thermoplastic resin Polymers 0.000 claims description 9
- 239000000919 ceramic Substances 0.000 claims description 6
- 239000000843 powder Substances 0.000 claims description 6
- 229920005989 resin Polymers 0.000 description 13
- 239000011347 resin Substances 0.000 description 13
- 238000000034 method Methods 0.000 description 11
- 239000011521 glass Substances 0.000 description 9
- 239000000835 fiber Substances 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 239000002245 particle Substances 0.000 description 4
- 238000007747 plating Methods 0.000 description 4
- 239000011888 foil Substances 0.000 description 3
- 229920001187 thermosetting polymer Polymers 0.000 description 3
- 229910052582 BN Inorganic materials 0.000 description 2
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 2
- 239000004697 Polyetherimide Substances 0.000 description 2
- 239000004734 Polyphenylene sulfide Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 239000005350 fused silica glass Substances 0.000 description 2
- 230000005484 gravity Effects 0.000 description 2
- 238000003780 insertion Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 229920002492 poly(sulfone) Polymers 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 229920001601 polyetherimide Polymers 0.000 description 2
- 229920000069 polyphenylene sulfide Polymers 0.000 description 2
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 description 1
- 239000004696 Poly ether ether ketone Substances 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- JUPQTSLXMOCDHR-UHFFFAOYSA-N benzene-1,4-diol;bis(4-fluorophenyl)methanone Chemical compound OC1=CC=C(O)C=C1.C1=CC(F)=CC=C1C(=O)C1=CC=C(F)C=C1 JUPQTSLXMOCDHR-UHFFFAOYSA-N 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- NBVXSUQYWXRMNV-UHFFFAOYSA-N fluoromethane Chemical compound FC NBVXSUQYWXRMNV-UHFFFAOYSA-N 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229920002312 polyamide-imide Polymers 0.000 description 1
- 229920002530 polyetherether ketone Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 229920006380 polyphenylene oxide Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 229920002545 silicone oil Polymers 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000012086 standard solution Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Reinforced Plastic Materials (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は、プリント配線板に使用する絶縁基材に係り、
特に線膨張率が低く、熱による影響の少ない絶縁基材に
関する。Detailed Description of the Invention (Field of Industrial Application) The present invention relates to an insulating base material used for printed wiring boards,
In particular, it relates to an insulating base material that has a low coefficient of linear expansion and is less affected by heat.
（従来の技術）
プリント配線板は回路形成や電子部品を実装する目的で
、種々の電子機器等に供給されている。(Prior Art) Printed wiring boards are supplied to various electronic devices for the purpose of forming circuits and mounting electronic components.
通常、プリント配線板は絶縁基材の片面又は両面に導電
パターンを形成することにより得られている。上記プリ
ント配線板上に電子部品を実装する方法として、次の方
法がなされている。Usually, printed wiring boards are obtained by forming conductive patterns on one or both sides of an insulating base material. The following method is used to mount electronic components on the printed wiring board.
第２図の１Ｉｒｉ￥ｉ概略図に示した方法では、プリン
ト配線板の所定位置に設けたスルーホールに電子部品３
のリード３１を挿入後、ハンダ付けを行い接合されてい
る（以下「挿入実装法」という）。In the method shown in the schematic diagram of FIG. 2, electronic components 3
After the leads 31 are inserted, they are joined by soldering (hereinafter referred to as "insertion mounting method").
また、第３図の断面概略図に示した方法では、リードの
ないチップ形電子部品５を直接プリント配線板上の所定
回路位置６に直接ハンダっけを行い接合されている（以
下「表面実装法」という）。In addition, in the method shown in the cross-sectional schematic diagram of FIG. 3, a chip-type electronic component 5 without leads is directly soldered and bonded to a predetermined circuit position 6 on a printed wiring board (hereinafter referred to as "surface mounting"). law).
上記プリント配線板に用いる絶縁基材には、通常、エポ
キシ樹脂、ポリイミド樹脂及びこれらの樹脂を通常のガ
ラスクロスや紙等に含浸した熱硬化性樹脂から製造され
ている。The insulating base material used in the printed wiring board is usually manufactured from epoxy resin, polyimide resin, or a thermosetting resin obtained by impregnating ordinary glass cloth, paper, or the like with these resins.
（発明が解決しようとする問題点）
上記の挿入実装法では、スルーホールの内周部及びその
周辺部にスルーホールメッキが施される。(Problems to be Solved by the Invention) In the above-mentioned insertion mounting method, through-hole plating is applied to the inner periphery of the through-hole and its surrounding area.
このスルーホールメッキにおいて、上記熱硬化性樹脂か
らなる絶縁基材を使用した場合、メッキする金属との線
膨張率に差がありすぎるため、メツキ部分に熱衝示によ
って歪みが起こり、図中に示したバレルクラックａやコ
ーナークラックｂが発生しやすいという問題かある。In this through-hole plating, when an insulating base material made of the above-mentioned thermosetting resin is used, there is a large difference in linear expansion coefficient from the metal to be plated, so the plating part is distorted due to thermal impact, and as shown in the figure. There is a problem in that barrel cracks a and corner cracks b as shown are likely to occur.
また表面実装法においても、チップ形電子部品が繰返し
発熱した場合、電子部品と絶縁基材との線膨張率に差が
ありすぎるために、ハンダ付けした部分にクラックが発
生しやすいという問題がある。Also, in the surface mounting method, if a chip-shaped electronic component repeatedly generates heat, there is a problem that cracks are likely to occur in the soldered part because there is a large difference in linear expansion coefficient between the electronic component and the insulating base material. .
（問題点を解決するための手段）
本発明は上記問題点を解消できるプリント配線板用絶縁
基材を見出したものであって、その要旨とするところは
、
セラミック系粉末充填剤を添加した耐熱性熱可塑性樹脂
を、Ｓ Ｉ Ｏ２の含有率が９９重置火以上の石英ガラ
スクロスに含浸してなることを特徴とするプリント配線
板用絶縁基材に存する。(Means for Solving the Problems) The present invention has discovered an insulating base material for printed wiring boards that can solve the above problems, and its gist is as follows: The present invention relates to an insulating base material for a printed wiring board, characterized in that it is made by impregnating a quartz glass cloth with a SIO2 content of 99 times higher or higher with a thermoplastic resin.
以下本発明を図面を参照して具体的に説明する。The present invention will be specifically described below with reference to the drawings.
第１図は本発明絶縁基材を用いたプリント基板の一実施
例を示す断面概略図である。絶縁基材１の両面に導電回
路を設け、さらにスルーホール内壁にスルーホールメッ
キ２を施して一１回路相互間を導通可能としなものであ
る。FIG. 1 is a schematic cross-sectional view showing an embodiment of a printed circuit board using the insulating base material of the present invention. Conductive circuits are provided on both sides of an insulating base material 1, and through-hole plating 2 is applied to the inner wall of the through-hole to enable conduction between the 11 circuits.
本発明の絶縁基材に使用する耐熱性熱可塑性樹脂１１と
して、具体的樹脂としては、ポリサルフォン（ＰＳＦ）
、ポリフェニレンサルファイド（ＰＰＳ）、ポリエーテ
ルエーテルゲトン（ＰＥＥＫ） 、熱可塑性フッ累樹脂
、ポリエーテルイミド（ＰＥＩ）、ポリエーテルサル７
オン（ＰＥＳ）、ポリアミドイミド（ＰＡＩ）、ポリフ
ェニレンオキサイド（ｐｐｏ＞等が挙げられる。As the heat-resistant thermoplastic resin 11 used for the insulating base material of the present invention, a specific resin is polysulfone (PSF).
, polyphenylene sulfide (PPS), polyetherethergetone (PEEK), thermoplastic fluorocarbon resin, polyetherimide (PEI), polyethersal 7
(PES), polyamideimide (PAI), polyphenylene oxide (ppo), and the like.
これらの樹脂の使用は高周波領域での誘電特性（高周波
特性）に優れており、電気回路の高速作動化に追随でき
るという利点がある。The use of these resins has the advantage that they have excellent dielectric properties (high frequency properties) in a high frequency region and can keep up with the high speed operation of electric circuits.
上記耐熱性熱可塑性樹脂１１には、セラミック系粉末充
填剤７を添加する必要があり、低線膨張率を有し、高周
波特性に優れた、溶°融シリカ（Ｓ１０２＞や窒化硼素
＜ＥＮ）等が好適に使用できる。上記充填剤の粒径範囲
は平均粒径１〜う０μｍの範囲、含有率としては、５〜
７０重景％重量の範囲がよい。含有率が５重量％未満で
は、上記効果が発現しにくく、７０重量％を越える使用
量では、成形性や成形後のプリント基板の加工性が悪く
なる。このセラミック系粉末充填剤を樹脂中に均一に添
加・分肢させることにより、特に絶縁基材の線膨張率の
方向性を無くすことができるという効果がある。 充填
剤が混合された樹脂は５１０２含有率が９９重量％以上
の石英ガラスクロス８に含浸する必要がある。この石英
ガラスクロスは、通常のガラスクロス＜ＳｉＯ、ＣａＯ
１Ａｌ 、ｏ 、及びＢ ２０３を主成分とするＥ−ガ
ラスから製造されている。）と異なり、線膨張率が極め
て低く、また高周波特性も極めて優れている。It is necessary to add a ceramic powder filler 7 to the heat-resistant thermoplastic resin 11, which is made of fused silica (S102> or boron nitride <EN), which has a low coefficient of linear expansion and excellent high frequency characteristics. etc. can be suitably used. The particle size range of the filler is an average particle size of 1 to 0 μm, and the content is 5 to 0 μm.
A range of 70% weight is good. If the content is less than 5% by weight, it is difficult to achieve the above effects, and if the content exceeds 70% by weight, the moldability and processability of the printed circuit board after molding will deteriorate. By uniformly adding and distributing this ceramic powder filler into the resin, there is an effect that the directionality of the coefficient of linear expansion of the insulating base material can be eliminated. It is necessary to impregnate the silica glass cloth 8 with a 5102 content of 99% by weight or more with the resin mixed with the filler. This quartz glass cloth is similar to ordinary glass cloth <SiO, CaO
It is manufactured from E-glass with main components of 1Al, O, and B203. ), it has an extremely low coefficient of linear expansion and excellent high frequency characteristics.
石英ガラスクロスに使用する繊維太さは２〜２０ｕｍ程
度、繊維密度４５本／ｍｍ程度のものか好適に使用でき
る。石英ガラスクロスの使用量は絶縁基材中５〜５０重
量％程度が好ましく、５重量％未満では線膨張率に対す
る効果が不十分であり、５０重量％を越えるものでは成
形後の加工性が悪くなりやすいという問題がある。The quartz glass cloth preferably has a fiber thickness of about 2 to 20 um and a fiber density of about 45 fibers/mm. The amount of quartz glass cloth used is preferably about 5 to 50% by weight in the insulating base material; if it is less than 5% by weight, the effect on the coefficient of linear expansion will be insufficient, and if it exceeds 50% by weight, the processability after molding will be poor. The problem is that it is easy to do so.
なお、上記石英ガラスクロスに前述した充填剤を添加し
た熱可塑性樹脂を含浸させる方法には種々の方法がある
が、必要枚数の石英ガラスクロスと充填剤ご添加した樹
脂を適宜積層し、最外層には導電パターンを形成するた
めの金属箔を載ヱした後、熱プレスすることにより容易
に得ることかできる。熱プレス条件は、使用する耐熱性
熱可塑性樹脂の種類等により異なるが、プレス温度を使
用する樹脂の流動開始温度以上、プレス圧力を面圧力１
０〜１００Ｋｇ／ｃｄの範囲で、減圧度（常圧と残存圧
との差）が７３０ｍｍＨｇ程度の減圧下で行なうと、ボ
イドの発生が防止でき好ましい。There are various methods for impregnating the quartz glass cloth with the filler-added thermoplastic resin, but the required number of quartz glass cloths and the filler-added resin are laminated as appropriate, and the outermost layer is It can be easily obtained by placing a metal foil for forming a conductive pattern on the substrate and then hot pressing it. Heat press conditions vary depending on the type of heat-resistant thermoplastic resin used, but the press temperature is equal to or higher than the flow start temperature of the resin used, and the press pressure is set to 1.
It is preferable to carry out the process under a reduced pressure in the range of 0 to 100 kg/cd, with a degree of reduced pressure (difference between normal pressure and residual pressure) of about 730 mmHg, since generation of voids can be prevented.
得られた積層板は、後続のプリント配線板製造工程に送
られ、金属箔へのパターン印刷、エツチング、水洗、必
要であればスルーホールの形成などの処理が行なわれ、
最終的なプリント基板が得られる。The obtained laminate is sent to the subsequent printed wiring board manufacturing process, where processing such as pattern printing on metal foil, etching, washing with water, and forming through holes if necessary, are performed.
The final printed circuit board is obtained.
本発明絶縁基材は、単層または多層のプリント配線板用
素材として極めて好適に利用できる。また、特に放熱性
を必要とするプリント配線板では絶縁基材の間に低線膨
張率の金属芯、例えば、鉄−ニッケル合金からなるもの
を埋設させてもよい。The insulating base material of the present invention can be very suitably used as a material for single-layer or multilayer printed wiring boards. Furthermore, in printed wiring boards that particularly require heat dissipation, a metal core with a low coefficient of linear expansion, for example, made of an iron-nickel alloy, may be embedded between the insulating base materials.
以下、本発明を実施例にて説明する。The present invention will be explained below with reference to Examples.
（実 施 例 ）
実施例１
耐熱性熱可塑性樹脂として、ＰＥＥＫ７０重量セラミッ
ク系粉末充填剤として、溶融シリカ（平均粒径４０〜５
０ｕｍ、比重２．２）を３０重量％添加。(Example) Example 1 As a heat-resistant thermoplastic resin, fused silica (average particle size 40-5
0um, specific gravity 2.2) was added at 30% by weight.
上記の充填剤を添加した樹脂と石英ガラスクロス（繊維
太さ０．８μｍφ、繊維密度＝纒４８本／２５ｍｍ、横
４２本／ ２５ ｍ ｍ、重量１２０ｇ／イ）を、充填
剤添加樹脂１００重量％に対しガラスクロス３０重景％
の割合で積層し、両社外層に金属箔（電解鋼溶、厚み１
８μｍ）を載置した後、熱プレスを行ない、厚み１．０
ｍｍの積層板を得な。The above filler-added resin and quartz glass cloth (fiber thickness: 0.8 μmφ, fiber density = 48 threads/25 mm, width: 42 threads/25 mm, weight: 120 g/a) were mixed with 100 weight of the filler-added resin. % vs. glass cloth 30%
Metal foil (electrolytic steel melted, thickness 1
8 μm), heat press is performed to obtain a thickness of 1.0 μm.
Obtain a laminate of mm.
［熱プレス条件］ 加熱温度：２９０°Ｃ×５分間減圧
度；７３０ｍｍＨｇ
面圧力；４０Ｋｇ／ａＪ
実施例２
下記の項目が相違する以外は実施例１と同一内容で積層
し積層板を得た。[Hot press conditions] Heating temperature: 290°C x 5 minutes Degree of vacuum: 730 mmHg Surface pressure: 40 Kg/aJ Example 2 A laminate was obtained by laminating in the same manner as in Example 1 except for the following differences.
耐熱性熱可塑性樹脂：６０重量％
セラミック系粉末充填剤：窒化硼素（平均粒径１〜５μ
ｍ、比重２．５＞４０重重量添加。Heat-resistant thermoplastic resin: 60% by weight Ceramic powder filler: Boron nitride (average particle size 1-5μ
m, specific gravity 2.5>40 weight addition.
プレス温度 ３００°Ｃ
比較例１
下記項目が相違する以外は実施例１と同一内容で積層し
積層板を得た。Pressing temperature: 300°C Comparative Example 1 A laminate was obtained by laminating in the same manner as in Example 1 except for the following differences.
セラミック系粉末充填剤；使用せず。Ceramic powder filler; not used.
ガラスクロス；Ｅ−ガラスからなるガラスクロス
比較例２
絶縁基材がＥ−ガラスからなるガラスクロスに含浸した
エポキシ樹脂（熱硬化性樹脂）である市販のプリント配
線板。Glass cloth: Comparative example 2 of glass cloth made of E-glass A commercially available printed wiring board whose insulating base material is an epoxy resin (thermosetting resin) impregnated into a glass cloth made of E-glass.
・上記各構成の積層板を使用し、ｒ線膨張率Ｊ、ｒ誘電
率Ｊ及びｒ誘電正接Ｊを測定し、その結果を表１に示し
た。- The r-linear expansion coefficient J, r dielectric constant J, and r dielectric loss tangent J were measured using the laminates having each of the above configurations, and the results are shown in Table 1.
表１
ここで「線膨張率Ｊの測定方法はＡＳＴＭ Ｄ−６９
６に準拠し、絶縁基材の平面方向（Ｘ−Ｙ方向）及び基
材平面の垂直方向（Ｚ方向）で測定した値である。Table 1 Here, the method for measuring linear expansion coefficient J is ASTM D-69.
6, and is a value measured in the plane direction of the insulating base material (X-Y direction) and in the direction perpendicular to the base material plane (Z direction).
誘電率及び誘電正接の測定方法は、液漫間隙変化法（標
準液；シリコンオイル）で、周波数１００Ｍ ＨＺ、測
定温度２６°Ｃ１及び測定湿度５８％にて測定しな。The dielectric constant and dielectric loss tangent were measured using the liquid gap change method (standard solution; silicone oil) at a frequency of 100 MHz, a measurement temperature of 26°C, and a measurement humidity of 58%.
表１から本発明の絶縁基材及びプリント配線板である実
施例１及び実施例２はすべての方向に対して線、膨張率
が低く、また高周波特性に優れていることが判る。From Table 1, it can be seen that Examples 1 and 2, which are the insulating base materials and printed wiring boards of the present invention, have low linear expansion coefficients in all directions and are excellent in high frequency characteristics.
これに対して、比較例１では高周波特性は畏好であるが
、充填剤が添加されていないためにＺ方向での線膨張率
が高いことが判る。また比較例２では高周波特性が劣り
、また線膨張率が高いことが判る。On the other hand, Comparative Example 1 has excellent high frequency characteristics, but it can be seen that the coefficient of linear expansion in the Z direction is high because no filler is added. Furthermore, it can be seen that Comparative Example 2 has poor high frequency characteristics and a high coefficient of linear expansion.
（発明の効果）
上述したように、本発明の絶縁基材によれば、回路の高
速化に必要とされる高周波特性を満足でき、また低線膨
張率のために従来困°難であった表面実装への利用性が
大である。(Effects of the Invention) As described above, the insulating base material of the present invention can satisfy the high frequency characteristics required for increasing the speed of circuits, and also has a low coefficient of linear expansion, which was difficult to achieve in the past. It is highly usable for surface mounting.
第１図は本発明絶縁基材を用いたプリント配線板の一実
施例を示す断面概略図、第２．３図はプリント配線板の
実施装：方法を説明する断面概略図である。
１・・・絶縁基材
７・・・セラミック系粉末充填剤
８・・・石英ガラスクロス
１１・・・重態性熱可塑性樹脂
第１ 図
第２凪
第３図
べFIG. 1 is a schematic cross-sectional view showing one embodiment of a printed wiring board using the insulating base material of the present invention, and FIGS. 2 and 3 are schematic cross-sectional views illustrating a method for mounting the printed wiring board. 1... Insulating base material 7... Ceramic powder filler 8... Quartz glass cloth 11... Critical thermoplastic resin 1 Figure 2 Calm Figure 3
Claims (1)
を、ＳｉＯ＿２の含有率が９９重量％以上の石英ガラス
クロスに含浸してなることを特徴とするプリント配線板
用絶縁基材。An insulating base material for a printed wiring board, characterized in that a quartz glass cloth containing 99% by weight or more of SiO_2 is impregnated with a heat-resistant thermoplastic resin containing a ceramic powder filler.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8504187A JPS63250188A (en) | 1987-04-07 | 1987-04-07 | Insulating substrate for printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8504187A JPS63250188A (en) | 1987-04-07 | 1987-04-07 | Insulating substrate for printed wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63250188A true JPS63250188A (en) | 1988-10-18 |
Family
ID=13847602
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8504187A Pending JPS63250188A (en) | 1987-04-07 | 1987-04-07 | Insulating substrate for printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63250188A (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02110125A (en) * | 1988-10-19 | 1990-04-23 | Mitsubishi Plastics Ind Ltd | Resin composition with high thermal conductivity |
| EP0390038A2 (en) * | 1989-03-27 | 1990-10-03 | Matsushita Electric Industrial Co., Ltd. | Fine Pattern forming method |
| JPH04168786A (en) * | 1990-10-31 | 1992-06-16 | Mitsubishi Electric Corp | Copper-clad epoxy resin laminate with glass cloth base |
| JP2009263569A (en) * | 2008-04-28 | 2009-11-12 | Hitachi Chem Co Ltd | Prepreg comprising thin layer quartz glass cloth, and wiring plate using the same |
| JP2010275404A (en) * | 2009-05-28 | 2010-12-09 | Mitsubishi Plastics Inc | Glass cloth-containing white film, metal laminate and substrate for led loading |
| JP2013544941A (en) * | 2010-12-09 | 2013-12-19 | クイックステップ、テクノロジーズ、プロプライエタリ、リミテッド | Fabrication and repair of fiber reinforced composite parts with enhanced surface and adhesive properties |
| WO2014171957A1 (en) * | 2013-04-18 | 2014-10-23 | Brook One Corporation | Burnthrough resistant laminate film |
| JP2018127747A (en) * | 2017-02-10 | 2018-08-16 | 旭化成株式会社 | Glass cloth, prepreg and printed wiring board |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54156076A (en) * | 1978-05-31 | 1979-12-08 | Shin Kobe Electric Machinery | Production of thermoplastic resin laminate |
| JPS59109349A (en) * | 1982-12-15 | 1984-06-25 | 松下電工株式会社 | Laminated board |
| JPS6236891A (en) * | 1985-08-09 | 1987-02-17 | 住友化学工業株式会社 | Circuit board |
-
1987
- 1987-04-07 JP JP8504187A patent/JPS63250188A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54156076A (en) * | 1978-05-31 | 1979-12-08 | Shin Kobe Electric Machinery | Production of thermoplastic resin laminate |
| JPS59109349A (en) * | 1982-12-15 | 1984-06-25 | 松下電工株式会社 | Laminated board |
| JPS6236891A (en) * | 1985-08-09 | 1987-02-17 | 住友化学工業株式会社 | Circuit board |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02110125A (en) * | 1988-10-19 | 1990-04-23 | Mitsubishi Plastics Ind Ltd | Resin composition with high thermal conductivity |
| EP0390038A2 (en) * | 1989-03-27 | 1990-10-03 | Matsushita Electric Industrial Co., Ltd. | Fine Pattern forming method |
| JPH04168786A (en) * | 1990-10-31 | 1992-06-16 | Mitsubishi Electric Corp | Copper-clad epoxy resin laminate with glass cloth base |
| JP2009263569A (en) * | 2008-04-28 | 2009-11-12 | Hitachi Chem Co Ltd | Prepreg comprising thin layer quartz glass cloth, and wiring plate using the same |
| JP4613977B2 (en) * | 2008-04-28 | 2011-01-19 | 日立化成工業株式会社 | Prepreg including thin-layer quartz glass cloth and wiring board using the same |
| JP2010275404A (en) * | 2009-05-28 | 2010-12-09 | Mitsubishi Plastics Inc | Glass cloth-containing white film, metal laminate and substrate for led loading |
| JP2013544941A (en) * | 2010-12-09 | 2013-12-19 | クイックステップ、テクノロジーズ、プロプライエタリ、リミテッド | Fabrication and repair of fiber reinforced composite parts with enhanced surface and adhesive properties |
| WO2014171957A1 (en) * | 2013-04-18 | 2014-10-23 | Brook One Corporation | Burnthrough resistant laminate film |
| JP2018127747A (en) * | 2017-02-10 | 2018-08-16 | 旭化成株式会社 | Glass cloth, prepreg and printed wiring board |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US5073840A (en) | Circuit board with coated metal support structure and method for making same | |
| JP2004512667A (en) | Multilayer printed circuit board | |
| JPS63250188A (en) | Insulating substrate for printed wiring board | |
| JP2956370B2 (en) | Copper clad laminate and method for producing the same | |
| JPH05261861A (en) | Laminated sheet | |
| JPS60236279A (en) | Plate for circuit | |
| JPH01194491A (en) | Manufacture of copper-pressed metallic base substrate | |
| JP2508737B2 (en) | Metal composite laminate | |
| JP2576138B2 (en) | Wiring board | |
| JP3227874B2 (en) | Manufacturing method of laminated board | |
| JPS60236278A (en) | Plate for circuit | |
| JPH01118539A (en) | Preparation of copper-clad laminate | |
| JPH06188531A (en) | Low expansion metal foil and laminate for printed circuit | |
| JPH0655477B2 (en) | Method for manufacturing ceramic coat laminate | |
| JPS61216391A (en) | Manufacture of multilayer circuit board | |
| JPH05327148A (en) | Laminated plate for printed circuit | |
| JPS63219562A (en) | Manufacture of ceramic coat laminated sheet | |
| JP2917645B2 (en) | Manufacturing method of copper clad laminate | |
| JPS60236280A (en) | Plate for circuit | |
| JPH01115627A (en) | Copper plated laminated sheet | |
| JP2005136043A (en) | Wiring board and electric apparatus | |
| JPH01117086A (en) | Substrate device with mounted electronic component | |
| JPS62187035A (en) | Manufacture of ceramic-coated lamianted board | |
| JPH01157589A (en) | Manufacture of metal base substrate | |
| JPH0655478B2 (en) | Method for manufacturing ceramic coat laminate |