JPS54156076A - Production of thermoplastic resin laminate - Google Patents
Production of thermoplastic resin laminateInfo
- Publication number
- JPS54156076A JPS54156076A JP6554878A JP6554878A JPS54156076A JP S54156076 A JPS54156076 A JP S54156076A JP 6554878 A JP6554878 A JP 6554878A JP 6554878 A JP6554878 A JP 6554878A JP S54156076 A JPS54156076 A JP S54156076A
- Authority
- JP
- Japan
- Prior art keywords
- production
- thermoplastic resin
- resin laminate
- laminate
- thermoplastic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Moulding By Coating Moulds (AREA)
- Laminated Bodies (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6554878A JPS54156076A (en) | 1978-05-31 | 1978-05-31 | Production of thermoplastic resin laminate |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6554878A JPS54156076A (en) | 1978-05-31 | 1978-05-31 | Production of thermoplastic resin laminate |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS54156076A true JPS54156076A (en) | 1979-12-08 |
JPS6221626B2 JPS6221626B2 (en) | 1987-05-13 |
Family
ID=13290168
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP6554878A Granted JPS54156076A (en) | 1978-05-31 | 1978-05-31 | Production of thermoplastic resin laminate |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS54156076A (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59208799A (en) * | 1983-05-05 | 1984-11-27 | デイナミ−ト・ノ−ベル・アクチエンゲゼルシヤフト | Laminated board for printed circuit with epoxy resin as base |
JPS63250188A (en) * | 1987-04-07 | 1988-10-18 | 三菱樹脂株式会社 | Insulating substrate for printed wiring board |
US5834565A (en) * | 1996-11-12 | 1998-11-10 | General Electric Company | Curable polyphenylene ether-thermosetting resin composition and process |
US6197898B1 (en) | 1997-11-18 | 2001-03-06 | General Electric Company | Melt-mixing thermoplastic and epoxy resin above Tg or Tm of thermoplastic with curing agent |
WO2019216292A1 (en) * | 2018-05-10 | 2019-11-14 | 株式会社村田製作所 | Resin multilayer substrate, package for electronic components, and package for optical components |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4851971A (en) * | 1971-11-02 | 1973-07-21 |
-
1978
- 1978-05-31 JP JP6554878A patent/JPS54156076A/en active Granted
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4851971A (en) * | 1971-11-02 | 1973-07-21 |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59208799A (en) * | 1983-05-05 | 1984-11-27 | デイナミ−ト・ノ−ベル・アクチエンゲゼルシヤフト | Laminated board for printed circuit with epoxy resin as base |
JPS63250188A (en) * | 1987-04-07 | 1988-10-18 | 三菱樹脂株式会社 | Insulating substrate for printed wiring board |
US5834565A (en) * | 1996-11-12 | 1998-11-10 | General Electric Company | Curable polyphenylene ether-thermosetting resin composition and process |
US6197898B1 (en) | 1997-11-18 | 2001-03-06 | General Electric Company | Melt-mixing thermoplastic and epoxy resin above Tg or Tm of thermoplastic with curing agent |
WO2019216292A1 (en) * | 2018-05-10 | 2019-11-14 | 株式会社村田製作所 | Resin multilayer substrate, package for electronic components, and package for optical components |
Also Published As
Publication number | Publication date |
---|---|
JPS6221626B2 (en) | 1987-05-13 |
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