JPS54156076A - Production of thermoplastic resin laminate - Google Patents

Production of thermoplastic resin laminate

Info

Publication number
JPS54156076A
JPS54156076A JP6554878A JP6554878A JPS54156076A JP S54156076 A JPS54156076 A JP S54156076A JP 6554878 A JP6554878 A JP 6554878A JP 6554878 A JP6554878 A JP 6554878A JP S54156076 A JPS54156076 A JP S54156076A
Authority
JP
Japan
Prior art keywords
production
thermoplastic resin
resin laminate
laminate
thermoplastic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP6554878A
Other languages
Japanese (ja)
Other versions
JPS6221626B2 (en
Inventor
Kenichi Kariya
Masaru Ogata
Yoshiharu Take
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Shin Kobe Electric Machinery Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shin Kobe Electric Machinery Co Ltd filed Critical Shin Kobe Electric Machinery Co Ltd
Priority to JP6554878A priority Critical patent/JPS54156076A/en
Publication of JPS54156076A publication Critical patent/JPS54156076A/en
Publication of JPS6221626B2 publication Critical patent/JPS6221626B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Moulding By Coating Moulds (AREA)
  • Laminated Bodies (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
JP6554878A 1978-05-31 1978-05-31 Production of thermoplastic resin laminate Granted JPS54156076A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6554878A JPS54156076A (en) 1978-05-31 1978-05-31 Production of thermoplastic resin laminate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6554878A JPS54156076A (en) 1978-05-31 1978-05-31 Production of thermoplastic resin laminate

Publications (2)

Publication Number Publication Date
JPS54156076A true JPS54156076A (en) 1979-12-08
JPS6221626B2 JPS6221626B2 (en) 1987-05-13

Family

ID=13290168

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6554878A Granted JPS54156076A (en) 1978-05-31 1978-05-31 Production of thermoplastic resin laminate

Country Status (1)

Country Link
JP (1) JPS54156076A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59208799A (en) * 1983-05-05 1984-11-27 デイナミ−ト・ノ−ベル・アクチエンゲゼルシヤフト Laminated board for printed circuit with epoxy resin as base
JPS63250188A (en) * 1987-04-07 1988-10-18 三菱樹脂株式会社 Insulating substrate for printed wiring board
US5834565A (en) * 1996-11-12 1998-11-10 General Electric Company Curable polyphenylene ether-thermosetting resin composition and process
US6197898B1 (en) 1997-11-18 2001-03-06 General Electric Company Melt-mixing thermoplastic and epoxy resin above Tg or Tm of thermoplastic with curing agent
WO2019216292A1 (en) * 2018-05-10 2019-11-14 株式会社村田製作所 Resin multilayer substrate, package for electronic components, and package for optical components

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4851971A (en) * 1971-11-02 1973-07-21

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4851971A (en) * 1971-11-02 1973-07-21

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59208799A (en) * 1983-05-05 1984-11-27 デイナミ−ト・ノ−ベル・アクチエンゲゼルシヤフト Laminated board for printed circuit with epoxy resin as base
JPS63250188A (en) * 1987-04-07 1988-10-18 三菱樹脂株式会社 Insulating substrate for printed wiring board
US5834565A (en) * 1996-11-12 1998-11-10 General Electric Company Curable polyphenylene ether-thermosetting resin composition and process
US6197898B1 (en) 1997-11-18 2001-03-06 General Electric Company Melt-mixing thermoplastic and epoxy resin above Tg or Tm of thermoplastic with curing agent
WO2019216292A1 (en) * 2018-05-10 2019-11-14 株式会社村田製作所 Resin multilayer substrate, package for electronic components, and package for optical components

Also Published As

Publication number Publication date
JPS6221626B2 (en) 1987-05-13

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