JPS63226053A - 混成集積チツプモジユ−ル - Google Patents

混成集積チツプモジユ−ル

Info

Publication number
JPS63226053A
JPS63226053A JP62059358A JP5935887A JPS63226053A JP S63226053 A JPS63226053 A JP S63226053A JP 62059358 A JP62059358 A JP 62059358A JP 5935887 A JP5935887 A JP 5935887A JP S63226053 A JPS63226053 A JP S63226053A
Authority
JP
Japan
Prior art keywords
hybrid integrated
chip carrier
chip module
lead
electrodes
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP62059358A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0558665B2 (enrdf_load_stackoverflow
Inventor
Koji Nishida
孝治 西田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP62059358A priority Critical patent/JPS63226053A/ja
Publication of JPS63226053A publication Critical patent/JPS63226053A/ja
Publication of JPH0558665B2 publication Critical patent/JPH0558665B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Production Of Multi-Layered Print Wiring Board (AREA)
JP62059358A 1987-03-13 1987-03-13 混成集積チツプモジユ−ル Granted JPS63226053A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62059358A JPS63226053A (ja) 1987-03-13 1987-03-13 混成集積チツプモジユ−ル

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62059358A JPS63226053A (ja) 1987-03-13 1987-03-13 混成集積チツプモジユ−ル

Publications (2)

Publication Number Publication Date
JPS63226053A true JPS63226053A (ja) 1988-09-20
JPH0558665B2 JPH0558665B2 (enrdf_load_stackoverflow) 1993-08-27

Family

ID=13110962

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62059358A Granted JPS63226053A (ja) 1987-03-13 1987-03-13 混成集積チツプモジユ−ル

Country Status (1)

Country Link
JP (1) JPS63226053A (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6774500B1 (en) * 1999-07-28 2004-08-10 Seiko Epson Corporation Substrate for semiconductor device, semiconductor chip mounting substrate, semiconductor device and method of fabrication thereof, and circuit board, together with electronic equipment

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6774500B1 (en) * 1999-07-28 2004-08-10 Seiko Epson Corporation Substrate for semiconductor device, semiconductor chip mounting substrate, semiconductor device and method of fabrication thereof, and circuit board, together with electronic equipment

Also Published As

Publication number Publication date
JPH0558665B2 (enrdf_load_stackoverflow) 1993-08-27

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