JPS63226053A - Hybrid integrated chip module - Google Patents

Abstract

PURPOSE:To facilitate a printing process and prevent a substrate edge electrode section from degrading in conductivity by a method wherein a plurality of internal leadout electrodes are provided along the bottom circumference of a substrate mounted with a wiring circuit and the substrate is placed on a chip carrier provided with a plurality of external leadout electrodes to be connected to said internal leadout electrodes. CONSTITUTION:A printed wiring circuit substrate 1 includes a single-layer or multilayer wiring circuit, and is provided with a plurality of internal leadout electrodes 3 along its bottom circumference for input/output signals. A glass- made protecting film 9 is provided. In a chip carrier 4, along the peripheral walls of a package, grooves 5 are provided, which correspond to the internal leadout electrodes 3. Along the circumference of the chip carrier 4, a plurality of solderable external leadout electrodes 6 are built at equal intervals. The internal leadout electrodes 3 of the printed wiring circuit substrate 1 to be installed thereon are soldered to said external leadout electrodes 6. Resin is caused to flow into an opening 8 provided at the middle of the chip carrier 4 for the protection of chip parts 7 against moisture. The resin also establishes adhesion between the printed wiring circuit substrate 1 and chip carrier 4.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to leadless hybrid integrated chip modules of high density hybrid integrated circuits.

BACKGROUND OF THE INVENTION A conventional leadless hybrid integrated circuit module has a plurality of electrical lead-out electrodes formed by conductive members fitted onto the side surface of a single substrate or a multilayer laminated substrate.

Moreover, an electrode terminal for external connection is formed on the side surface using a conductive ink material.

Problems to be Solved by the Invention However, in the above-mentioned conventional method, the process of printing the side surfaces of the circuit-formed circuit board is complicated, resulting in high operational costs, and the printing pitch of the side electrodes varies, and errors occur in the printing process. The disadvantage is that the loss costs due to such factors are high. Also, in terms of performance, it has the disadvantage that the mechanical strength of the side electrodes is not sufficient.

Further, it is an object of the present invention to solve these problems and to facilitate manufacturing.

Means for Solving the Problems In order to eliminate the drawbacks of the prior art, the present invention has a printed circuit board configured with a wiring circuit, and a multi-layer laminated board that is equipped with a printed circuit board, in which the outer periphery of the bottom surface is cleaned for internal extraction of input/output signals. The substrate is placed on a chip carrier made of ceramic or molded resin and provided with a plurality of electrodes and a plurality of external electrodes connected to the internal electrodes.

Effects of the present invention The printed circuit board or multilayer board configured with a wiring circuit and the chip carrier having a plurality of external lead-out electrodes are individually manufactured, and after being loaded, the internal and external lead-out electrodes are made to correspond to each other, and then soldered. Therefore, the board does not need to provide lead-out electrodes on the side of the board, and only the internal lead-out electrodes are provided on the bottom of the board, which makes printing work easy, and there is no need to provide lead-out electrodes on the board edge electrodes. There is no adverse effect of deterioration in conduction quality.

Example An embodiment of the present invention will be described using FIGS. 1 to 3.

First, as shown in FIG. 2, the printed wiring circuit board 1 consists of a single-layer or multi-layer wiring circuit, and there are through holes 2 between each layer. Alternatively, it is electrically connected through a peer hole, and chip components (active/passive components) 7 are mounted or wire bonded on the top layer and the bottom surface, and internal extraction electrodes 3 for input/output signals are formed on the outer periphery of the bottom surface. It forms multiple pieces.

Note that 9 is a glass protective film.

On the other hand, a chip carrier 4 on which the printed wiring board 1 is loaded
As shown in Fig. 3, a groove 5 is provided on the peripheral wall of the package to correspond to the internal lead-out electrode 3, and a plurality of external lead-out electrodes 6 to which solder can be applied are provided around the groove 5 at equal pitches. be. The internal lead-out electrode 3 and the external lead-out electrode 6 of the printed wiring board 1 mounted on the chip carrier 4 are soldered. Further, in order to protect the chip component γ protruding from the bottom surface of the printed wiring board 1 from moisture and to bond the printed wiring board 1 and the chip carrier 4, resin gold is poured into the opening 8 at the center of the chip carrier. Note that a glass protective film 9 and a synthetic resin protective film are formed on the printed wiring board 1 in order to improve moisture resistance and insulation.

Effects of the Invention As described above, the present invention increases the degree of freedom in designing the printed circuit board to be loaded by separately configuring a printed circuit board and a chip carrier having external lead-out electrodes that are electrically connected to the printed circuit board. . For example, the internal lead-out electrodes of a printed circuit board can be configured by printing once on the bottom surface, so regardless of whether it is a single-layer or multi-layer board, it is possible to mount hybrid integrated circuits such as those with chip components mounted or wire bonded on both sides of the board. is wide-ranging. Furthermore, since the external lead electrodes of the chip carrier can be formed individually, an inexpensive synthetic resin molded substrate can be used, and metallized conductor electrodes with strong solder bonding strength can also be used.

Furthermore, by constructing the chip carrier from a material with high mechanical strength such as an alumina substrate, the applied chip module becomes a highly reliable mounting component.

On the other hand, the mechanical connection between the printed circuit board and the chip carrier is achieved by not only soldering the internal lead-out electrodes, but also by pouring an adhesive resin that also serves as a moisture-resistant protective film from the open bottom of the chip carrier. It is also possible to make the adhesion of the chip carrier stronger.

[Brief explanation of drawings]

FIG. 1 is a cross-sectional view of a hybrid integrated chip module according to an embodiment of the present invention, FIG. 2 is a cross-sectional view of a multilayer printed hybrid integrated board as an embodiment of the printed circuit board, and FIG. 3 is a cross-sectional view of a chip carrier to be loaded. FIG. 1... Printed wiring circuit board, 3... Internal lead-out electrode, 4... Chip carrier, 6... Mark/groove, 6... External lead-out electrode, A... ...Chip parts, 8.Old...Opening.

Claims (4)

[Claims] (1) A printed circuit board with internal lead-out electrodes provided on the bottom surface corresponding to the external lead-out electrodes is arranged on a chip carrier having a plurality of external lead-out electrodes on the peripheral wall, and the internal lead-out electrodes of the printed wiring board are A hybrid integrated chip module, which is electrically connected to an external lead-out electrode of the chip carrier. (2) The hybrid integrated chip module according to claim 1, wherein the printed wiring board is a hybrid integrated circuit formed by arranging chip components on the top or bottom surface of a single-layer or multilayer ceramic substrate. (3) The chip carrier is provided with a plurality of grooves in the peripheral wall corresponding to the internal lead-out electrodes, and a conductor electrode for external lead-out to which solder can be applied is provided in the groove. The hybrid integrated chip module described. (4) The hybrid integrated chip module according to claim 1, wherein the chip carrier is made of a ceramic or resin molded base material, and has a penetrating space in the center.