JPH0558665B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a leadless hybrid integrated chip module for high density hybrid integrated circuits.

2. Description of the Related Art A conventional leadless hybrid integrated circuit module has a plurality of electrical lead-out electrodes formed by conductive members fitted onto the side surface of a single substrate or a multilayer integrated substrate. Moreover, an electrode terminal for external connection is formed on the side surface using a conductive ink material.

Problems to be Solved by the Invention However, in the above-mentioned conventional method, the process of printing the side surfaces of the circuit-formed circuit board is complicated, resulting in high operational costs, and the printing pitch of the side electrodes varies, and errors occur in the printing process. The disadvantage is that the loss costs due to such factors are high. Also, in terms of performance, it has the disadvantage that the mechanical strength of the side electrodes is not sufficient.
Further, it is an object of the present invention to solve these problems and to facilitate manufacturing.

Means for Solving the Problems In order to eliminate the conventional drawbacks, the present invention provides a printed circuit board having a wiring circuit structure, in which electrodes for internal extraction of input/output signals are provided along the outer periphery of the bottom surface of the multilayer laminated board. on a chip carrier made of ceramic or molded resin, which is provided with a plurality of electrodes connected to the internal electrode, and a plurality of external electrodes connected to the internal electrode.
The above-mentioned substrate is arranged.

Function The present invention provides a printed circuit board configured with a wiring circuit,
Alternatively, a multilayer board and a chip carrier having multiple externally-extracted electrodes are made separately, and after loading, the internal and externally-extracted electrodes are made to correspond to each other, and then soldered.
Because it is an integrated board, there is no need to provide a lead-out electrode on the side of the board, and the internal lead-out electrode can be easily provided only on the bottom of the board.
Printing work is easy, and there is no adverse effect of deterioration in conduction quality of the edge electrode portion of the substrate.

Embodiment An embodiment of the present invention will be described with reference to FIGS. 1 to 3. First, as shown in FIG. 2, the printed wiring circuit board 1 consists of a single-layer or multi-layer wiring circuit, and each layer is electrically connected through a through hole 2 or a via hole.
Chip components (active/passive components) 7 are mounted or wire bonded on the top layer and the bottom, and a plurality of internal extraction electrodes 3 for input/output signals are formed along the outer periphery of the bottom. .
Note that 9 is a glass protective film.

On the other hand, the chip carrier 4 on which the printed wiring board 1 is loaded has a groove 5 along the peripheral wall of the package corresponding to the internal lead-out electrode 3 as shown in FIG. This is a configuration in which a plurality of electrodes 6 are provided at equal pitches. The internal lead-out electrode 3 and the external lead-out electrode 6 of the printed wiring board 1 loaded on this chip carrier 4
is soldered. Further, in order to protect the chip components 7 protruding from the bottom surface of the printed wiring board 1 from moisture and to bond the printed wiring board 1 and the chip carrier 4, resin is poured into the opening 8 at the center of the chip carrier. Note that a glass protective film 9 and a synthetic resin protective film are formed on the printed wiring board 1 in order to improve moisture resistance and insulation.

Effects of the Invention As described above, according to the present invention, the degree of freedom in designing the printed circuit boards to be loaded is increased by individually configuring the printed circuit boards and the chip carriers having the external lead-out electrodes that are electrically connected to the printed circuit boards. For example, the internal lead-out electrodes of a printed circuit board can be configured by printing once on the bottom surface, so whether it is a single-layer or multi-layer board, it is possible to mount hybrid integrated circuits such as those with chip components mounted or wire bonded on both sides of the board. are wide-ranging. In addition, since the external lead-out electrodes of the chip carrier can be formed individually, it is possible to use an inexpensive synthetic resin molded substrate, and also to use metallized conductor electrodes with strong solder bonding strength.
Furthermore, by constructing the chip carrier from a material with high mechanical strength such as an alumina substrate, the applied chip module becomes a highly reliable mounting component. On the other hand, the mechanical connection between the printed circuit board and the chip carrier is achieved by, in addition to soldering the internal lead-out electrodes, by pouring an adhesive resin that also serves as a moisture-resistant protective film from the open bottom of the chip carrier. It is also possible to make the adhesion stronger.

[Brief explanation of the drawing]

FIG. 1 is a sectional view of a hybrid integrated chip module according to an embodiment of the present invention, FIG. 2 is a sectional view of a multilayer printed hybrid integrated board as an embodiment of a printed circuit board,
FIG. 3 is a perspective view of the loaded chip carrier. DESCRIPTION OF SYMBOLS 1... Printed wiring circuit board, 3... Internal lead-out electrode, 4... Chip carrier, 5... Groove, 6... External lead-out electrode, 7... Chip component, 8... Opening.

Claims (1)

[Scope of Claims] 1. A printed wiring circuit board having internal lead-out electrodes provided on the bottom surface corresponding to the external lead-out electrodes is disposed on a chip carrier having a plurality of external lead-out electrodes on the peripheral wall, and A hybrid integrated chip module in which an internal lead-out electrode is electrically connected to an external lead-out electrode of the chip carrier. 2. The hybrid integrated chip module according to claim 1, wherein the printed wiring board is a hybrid integrated circuit formed by arranging chip components on the top or bottom surface of a single-layer or multilayer ceramic substrate. 3. The chip carrier is a hybrid device according to claim 1, wherein a plurality of grooves are provided in the peripheral wall corresponding to the internal lead-out electrodes, and conductive electrodes for external lead-out to which solder can be applied are provided in the grooves. Integrated chip module. 4. The hybrid integrated chip module according to claim 1, wherein the chip carrier is made of a ceramic or resin molded base material and has a penetrating space in the center.