JPS6321345B2 - - Google Patents

Info

Publication number
JPS6321345B2
JPS6321345B2 JP11959583A JP11959583A JPS6321345B2 JP S6321345 B2 JPS6321345 B2 JP S6321345B2 JP 11959583 A JP11959583 A JP 11959583A JP 11959583 A JP11959583 A JP 11959583A JP S6321345 B2 JPS6321345 B2 JP S6321345B2
Authority
JP
Japan
Prior art keywords
column
wafer
defective
search
elements
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP11959583A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6010716A (ja
Inventor
Yasunori Hirose
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Home Electronics Ltd
Original Assignee
NEC Home Electronics Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Home Electronics Ltd filed Critical NEC Home Electronics Ltd
Priority to JP11959583A priority Critical patent/JPS6010716A/ja
Publication of JPS6010716A publication Critical patent/JPS6010716A/ja
Publication of JPS6321345B2 publication Critical patent/JPS6321345B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/26Bombardment with radiation
    • H01L21/263Bombardment with radiation with high-energy radiation
    • H01L21/265Bombardment with radiation with high-energy radiation producing ion implantation

Landscapes

  • Physics & Mathematics (AREA)
  • High Energy & Nuclear Physics (AREA)
  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
JP11959583A 1983-06-30 1983-06-30 半導体ウエ−ハ試験方法 Granted JPS6010716A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11959583A JPS6010716A (ja) 1983-06-30 1983-06-30 半導体ウエ−ハ試験方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11959583A JPS6010716A (ja) 1983-06-30 1983-06-30 半導体ウエ−ハ試験方法

Publications (2)

Publication Number Publication Date
JPS6010716A JPS6010716A (ja) 1985-01-19
JPS6321345B2 true JPS6321345B2 (enrdf_load_stackoverflow) 1988-05-06

Family

ID=14765271

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11959583A Granted JPS6010716A (ja) 1983-06-30 1983-06-30 半導体ウエ−ハ試験方法

Country Status (1)

Country Link
JP (1) JPS6010716A (enrdf_load_stackoverflow)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6425430A (en) * 1987-07-21 1989-01-27 Tokyo Electron Ltd Probe device
US7282427B1 (en) 2006-05-04 2007-10-16 Applied Materials, Inc. Method of implanting a substrate and an ion implanter for performing the method
JP5040315B2 (ja) 2007-01-10 2012-10-03 富士通セミコンダクター株式会社 検査方法、検査システムおよび検査装置

Also Published As

Publication number Publication date
JPS6010716A (ja) 1985-01-19

Similar Documents

Publication Publication Date Title
CA1264868A (en) Semiconductor defect monitor for diagnosing processing-induced defects
US20020121915A1 (en) Automated pattern clustering detection for wafer probe maps
CN102623368A (zh) 一种晶圆缺陷检测方法
JPH06168991A (ja) マルチプロービング半導体検査方法
US6920596B2 (en) Method and apparatus for determining fault sources for device failures
JPS6321345B2 (enrdf_load_stackoverflow)
US20030158679A1 (en) Anomaly detection system
JP2007208046A (ja) 半導体装置の試験方法
Mital et al. Computer based wafer inspection system
JP3802283B2 (ja) 検査結果表示方法、検査結果表示装置及び記録媒体
JPH11219997A (ja) 電子デバイス検査システム及び電子デバイスの製造方法
US11714106B2 (en) Test apparatus, test method and recording medium
JPS6321346B2 (enrdf_load_stackoverflow)
JP3152737B2 (ja) ウェハープロービング装置におけるステージ移動方法
EP1056127A2 (en) Method and apparatus for correlating data from a semiconductor wafer process
JPH079379Y2 (ja) Icウエハ試験用自動プローバ
JPH10242224A (ja) 半導体ウエハの特性テスト方法
JPS6021536A (ja) 半導体ウエ−ハ試験方法
JP2005057029A (ja) 欠陥解析方法、半導体装置の製造方法および欠陥解析システム
JP2984155B2 (ja) ウエハのicチップ検査方法
JP2007109872A (ja) 半導体ウエハの検査に用いるプローブカードの針立て領域の設定方法。
JPH06163649A (ja) 半導体ウェーハ及び半導体素子識別方法
KR0127639B1 (ko) 프로우빙 시험 방법 및 그 장치
KR100502405B1 (ko) 반도체장치이디에스방법
TW494456B (en) Analysis method and apparatus for wafer processing