JPS6010716A - 半導体ウエ−ハ試験方法 - Google Patents
半導体ウエ−ハ試験方法Info
- Publication number
- JPS6010716A JPS6010716A JP11959583A JP11959583A JPS6010716A JP S6010716 A JPS6010716 A JP S6010716A JP 11959583 A JP11959583 A JP 11959583A JP 11959583 A JP11959583 A JP 11959583A JP S6010716 A JPS6010716 A JP S6010716A
- Authority
- JP
- Japan
- Prior art keywords
- row
- defective
- wafer
- point
- column
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 title claims description 28
- 238000000034 method Methods 0.000 title claims description 5
- 238000012360 testing method Methods 0.000 title claims 2
- 230000002950 deficient Effects 0.000 claims abstract description 41
- 238000009826 distribution Methods 0.000 claims abstract description 20
- 238000001514 detection method Methods 0.000 claims 1
- 235000012431 wafers Nutrition 0.000 abstract description 37
- 238000005259 measurement Methods 0.000 abstract description 7
- 238000012545 processing Methods 0.000 abstract description 4
- 238000010586 diagram Methods 0.000 description 4
- 238000000691 measurement method Methods 0.000 description 4
- 230000007547 defect Effects 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/26—Bombardment with radiation
- H01L21/263—Bombardment with radiation with high-energy radiation
- H01L21/265—Bombardment with radiation with high-energy radiation producing ion implantation
Landscapes
- Physics & Mathematics (AREA)
- High Energy & Nuclear Physics (AREA)
- Engineering & Computer Science (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11959583A JPS6010716A (ja) | 1983-06-30 | 1983-06-30 | 半導体ウエ−ハ試験方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11959583A JPS6010716A (ja) | 1983-06-30 | 1983-06-30 | 半導体ウエ−ハ試験方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6010716A true JPS6010716A (ja) | 1985-01-19 |
JPS6321345B2 JPS6321345B2 (enrdf_load_stackoverflow) | 1988-05-06 |
Family
ID=14765271
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP11959583A Granted JPS6010716A (ja) | 1983-06-30 | 1983-06-30 | 半導体ウエ−ハ試験方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6010716A (enrdf_load_stackoverflow) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6425430A (en) * | 1987-07-21 | 1989-01-27 | Tokyo Electron Ltd | Probe device |
US7282427B1 (en) | 2006-05-04 | 2007-10-16 | Applied Materials, Inc. | Method of implanting a substrate and an ion implanter for performing the method |
US7679737B2 (en) | 2007-01-10 | 2010-03-16 | Fujitsu Microelectronics Limited | Method, system and apparatus of inspection |
-
1983
- 1983-06-30 JP JP11959583A patent/JPS6010716A/ja active Granted
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6425430A (en) * | 1987-07-21 | 1989-01-27 | Tokyo Electron Ltd | Probe device |
US7282427B1 (en) | 2006-05-04 | 2007-10-16 | Applied Materials, Inc. | Method of implanting a substrate and an ion implanter for performing the method |
US7679737B2 (en) | 2007-01-10 | 2010-03-16 | Fujitsu Microelectronics Limited | Method, system and apparatus of inspection |
Also Published As
Publication number | Publication date |
---|---|
JPS6321345B2 (enrdf_load_stackoverflow) | 1988-05-06 |
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