JPS6321346B2 - - Google Patents
Info
- Publication number
- JPS6321346B2 JPS6321346B2 JP11959883A JP11959883A JPS6321346B2 JP S6321346 B2 JPS6321346 B2 JP S6321346B2 JP 11959883 A JP11959883 A JP 11959883A JP 11959883 A JP11959883 A JP 11959883A JP S6321346 B2 JPS6321346 B2 JP S6321346B2
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- semiconductor
- elements
- point
- boundary line
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004065 semiconductor Substances 0.000 claims description 32
- 238000005259 measurement Methods 0.000 claims description 20
- 230000002950 deficient Effects 0.000 claims description 19
- 238000004904 shortening Methods 0.000 claims description 2
- 238000012360 testing method Methods 0.000 claims description 2
- 235000012431 wafers Nutrition 0.000 description 37
- 239000000047 product Substances 0.000 description 11
- 238000000034 method Methods 0.000 description 8
- 238000010586 diagram Methods 0.000 description 4
- 238000000691 measurement method Methods 0.000 description 4
- 230000002093 peripheral effect Effects 0.000 description 2
- 239000000523 sample Substances 0.000 description 2
- 238000010998 test method Methods 0.000 description 2
- 239000013078 crystal Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000013067 intermediate product Substances 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11959883A JPS6010744A (ja) | 1983-06-30 | 1983-06-30 | 半導体ウエ−ハ試験方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11959883A JPS6010744A (ja) | 1983-06-30 | 1983-06-30 | 半導体ウエ−ハ試験方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6010744A JPS6010744A (ja) | 1985-01-19 |
JPS6321346B2 true JPS6321346B2 (enrdf_load_stackoverflow) | 1988-05-06 |
Family
ID=14765349
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP11959883A Granted JPS6010744A (ja) | 1983-06-30 | 1983-06-30 | 半導体ウエ−ハ試験方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6010744A (enrdf_load_stackoverflow) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07109837B2 (ja) * | 1986-08-07 | 1995-11-22 | 東京エレクトロン株式会社 | プロ−ブ装置 |
-
1983
- 1983-06-30 JP JP11959883A patent/JPS6010744A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS6010744A (ja) | 1985-01-19 |
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