JPS6320446B2 - - Google Patents
Info
- Publication number
- JPS6320446B2 JPS6320446B2 JP58197162A JP19716283A JPS6320446B2 JP S6320446 B2 JPS6320446 B2 JP S6320446B2 JP 58197162 A JP58197162 A JP 58197162A JP 19716283 A JP19716283 A JP 19716283A JP S6320446 B2 JPS6320446 B2 JP S6320446B2
- Authority
- JP
- Japan
- Prior art keywords
- meth
- titanate
- compound
- epoxy
- acrylate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Conductive Materials (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19716283A JPS6088027A (ja) | 1983-10-20 | 1983-10-20 | 導電性樹脂組成物 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19716283A JPS6088027A (ja) | 1983-10-20 | 1983-10-20 | 導電性樹脂組成物 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6088027A JPS6088027A (ja) | 1985-05-17 |
| JPS6320446B2 true JPS6320446B2 (enrdf_load_stackoverflow) | 1988-04-27 |
Family
ID=16369803
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19716283A Granted JPS6088027A (ja) | 1983-10-20 | 1983-10-20 | 導電性樹脂組成物 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6088027A (enrdf_load_stackoverflow) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4780371A (en) * | 1986-02-24 | 1988-10-25 | International Business Machines Corporation | Electrically conductive composition and use thereof |
| TWI251018B (en) * | 2002-04-10 | 2006-03-11 | Fujikura Ltd | Electroconductive composition, electroconductive coating and method of producing the electroconductive coating |
| JP6031882B2 (ja) * | 2012-08-07 | 2016-11-24 | Dic株式会社 | 導電性インキ組成物、導電性パターンの製造方法及び導電性回路 |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5545592B2 (enrdf_load_stackoverflow) * | 1973-11-20 | 1980-11-18 | ||
| JPS5432599A (en) * | 1977-08-17 | 1979-03-09 | Matsushita Electric Ind Co Ltd | Epoxy resin composition |
| US4305847A (en) * | 1979-07-26 | 1981-12-15 | Acheson Industries, Inc. | Copper coating composition for shielding electronic equipment and the like |
-
1983
- 1983-10-20 JP JP19716283A patent/JPS6088027A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6088027A (ja) | 1985-05-17 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN100482752C (zh) | 一种感光防焊油墨组合物、其应用及含有其的线路板 | |
| JP5352340B2 (ja) | 感光性樹脂組成物、プリント配線板用のソルダーレジスト組成物およびプリント配線板 | |
| WO2012039379A1 (ja) | インクジェット用硬化性組成物及び電子部品の製造方法 | |
| JPWO2006109890A1 (ja) | 感光性樹脂組成物、プリント配線板、および半導体パッケージ基板 | |
| CN105549324A (zh) | 光固化和热固化树脂组合物和干膜型阻焊剂 | |
| KR100830810B1 (ko) | 연성 기판용 솔더 레지스트 조성물, 연성 기판 및 연성기판의 제조 방법 | |
| TWI700552B (zh) | 感光性樹脂組成物、乾膜及印刷線路板 | |
| TW201902973A (zh) | 感光性樹脂組成物、乾膜、及印刷線路板 | |
| TW201942242A (zh) | 硬化性樹脂組成物、乾膜、硬化物及印刷配線板 | |
| WO2002051905A1 (fr) | Generateurs de photobase, compositions durcissables preparees au moyen de ces generateurs et procede de durcissement | |
| WO2015016360A1 (ja) | 感光性樹脂組成物 | |
| JP2792298B2 (ja) | フォトソルダーレジスト組成物 | |
| JPS6320446B2 (enrdf_load_stackoverflow) | ||
| JP2012167268A (ja) | インクジェット用硬化性組成物及び電子部品の製造方法 | |
| JP2897272B2 (ja) | 電子部品封止用硬化型樹脂組成物 | |
| JPH0943846A (ja) | フォトソルダーレジスト組成物 | |
| JPH0424802B2 (enrdf_load_stackoverflow) | ||
| JPH09114096A (ja) | ソルダーレジスト組成物 | |
| JP4534313B2 (ja) | 感光性樹脂組成物、これを用いた感光性エレメント、レジストパターンの製造法、レジストパターン及びレジストパターン積層基板 | |
| JPS61171721A (ja) | 積層体 | |
| JPS643905B2 (enrdf_load_stackoverflow) | ||
| JPS61276394A (ja) | プリント回路板の製造法 | |
| JPH0223351A (ja) | フォトソルダーレジスト組成物 | |
| JP2022050081A (ja) | 感光性樹脂組成物 | |
| JP7405803B2 (ja) | 感光性樹脂組成物、感光性樹脂組成物の光硬化物及び感光性樹脂組成物を塗布したプリント配線板 |