JPS5432599A - Epoxy resin composition - Google Patents
Epoxy resin compositionInfo
- Publication number
- JPS5432599A JPS5432599A JP9905577A JP9905577A JPS5432599A JP S5432599 A JPS5432599 A JP S5432599A JP 9905577 A JP9905577 A JP 9905577A JP 9905577 A JP9905577 A JP 9905577A JP S5432599 A JPS5432599 A JP S5432599A
- Authority
- JP
- Japan
- Prior art keywords
- resin composition
- epoxy resin
- high temperature
- resin
- compounding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Epoxy Resins (AREA)
- Paints Or Removers (AREA)
Abstract
PURPOSE: To prepare an epoxy resin composition for high temperature use by compounding the resin with a specific amount of a photopolymerizable resin and a photopolymerization initiator, thereby suppressing the lowering of the viscosity at high temperature.
COPYRIGHT: (C)1979,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9905577A JPS5432599A (en) | 1977-08-17 | 1977-08-17 | Epoxy resin composition |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9905577A JPS5432599A (en) | 1977-08-17 | 1977-08-17 | Epoxy resin composition |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5432599A true JPS5432599A (en) | 1979-03-09 |
JPS627233B2 JPS627233B2 (en) | 1987-02-16 |
Family
ID=14236952
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP9905577A Granted JPS5432599A (en) | 1977-08-17 | 1977-08-17 | Epoxy resin composition |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5432599A (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6055024A (en) * | 1983-09-07 | 1985-03-29 | Toyobo Co Ltd | Electroconductive resin composition |
JPS6088027A (en) * | 1983-10-20 | 1985-05-17 | Toyobo Co Ltd | Electroconductive resin composition |
JPS6160720A (en) * | 1984-09-03 | 1986-03-28 | Suriibondo:Kk | Resin composition |
JPS63170410A (en) * | 1987-01-07 | 1988-07-14 | Koei Chem Co Ltd | Curable resin composition |
JPH01500865A (en) * | 1986-07-07 | 1989-03-23 | ロクタイト・コーポレーシヨン | Potted electrical/mechanical devices and potting methods |
-
1977
- 1977-08-17 JP JP9905577A patent/JPS5432599A/en active Granted
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6055024A (en) * | 1983-09-07 | 1985-03-29 | Toyobo Co Ltd | Electroconductive resin composition |
JPS6088027A (en) * | 1983-10-20 | 1985-05-17 | Toyobo Co Ltd | Electroconductive resin composition |
JPS6320446B2 (en) * | 1983-10-20 | 1988-04-27 | Toyo Boseki | |
JPS6160720A (en) * | 1984-09-03 | 1986-03-28 | Suriibondo:Kk | Resin composition |
JPH0363568B2 (en) * | 1984-09-03 | 1991-10-01 | Three Bond Co Ltd | |
JPH01500865A (en) * | 1986-07-07 | 1989-03-23 | ロクタイト・コーポレーシヨン | Potted electrical/mechanical devices and potting methods |
JP2622392B2 (en) * | 1986-07-07 | 1997-06-18 | ロクタイト・コーポレーシヨン | Sealed electrical / mechanical device and method for sealing the same |
JPS63170410A (en) * | 1987-01-07 | 1988-07-14 | Koei Chem Co Ltd | Curable resin composition |
Also Published As
Publication number | Publication date |
---|---|
JPS627233B2 (en) | 1987-02-16 |
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