JPS6318864B2 - - Google Patents
Info
- Publication number
- JPS6318864B2 JPS6318864B2 JP2138480A JP2138480A JPS6318864B2 JP S6318864 B2 JPS6318864 B2 JP S6318864B2 JP 2138480 A JP2138480 A JP 2138480A JP 2138480 A JP2138480 A JP 2138480A JP S6318864 B2 JPS6318864 B2 JP S6318864B2
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- voltage
- floating gate
- drain
- writing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000758 substrate Substances 0.000 claims description 48
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 12
- 229910052814 silicon oxide Inorganic materials 0.000 claims description 12
- 230000015654 memory Effects 0.000 claims description 11
- 238000002347 injection Methods 0.000 claims description 10
- 239000007924 injection Substances 0.000 claims description 10
- 230000015556 catabolic process Effects 0.000 claims description 9
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 8
- 229910052710 silicon Inorganic materials 0.000 claims description 8
- 239000010703 silicon Substances 0.000 claims description 8
- 239000004065 semiconductor Substances 0.000 claims description 7
- 239000002784 hot electron Substances 0.000 claims description 5
- XUFQPHANEAPEMJ-UHFFFAOYSA-N famotidine Chemical compound NC(N)=NC1=NC(CSCCC(N)=NS(N)(=O)=O)=CS1 XUFQPHANEAPEMJ-UHFFFAOYSA-N 0.000 description 11
- 239000000969 carrier Substances 0.000 description 6
- 230000008859 change Effects 0.000 description 5
- 238000010586 diagram Methods 0.000 description 5
- 150000004767 nitrides Chemical class 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 238000002474 experimental method Methods 0.000 description 3
- 229910052581 Si3N4 Inorganic materials 0.000 description 2
- 230000001590 oxidative effect Effects 0.000 description 2
- 229920006395 saturated elastomer Polymers 0.000 description 2
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 2
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 230000008030 elimination Effects 0.000 description 1
- 238000003379 elimination reaction Methods 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 238000005036 potential barrier Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 230000002195 synergetic effect Effects 0.000 description 1
- 230000005641 tunneling Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/788—Field effect transistors with field effect produced by an insulated gate with floating gate
- H01L29/7881—Programmable transistors with only two possible levels of programmation
- H01L29/7884—Programmable transistors with only two possible levels of programmation charging by hot carrier injection
- H01L29/7886—Hot carrier produced by avalanche breakdown of a PN junction, e.g. FAMOS
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Ceramic Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Semiconductor Memories (AREA)
- Non-Volatile Memory (AREA)
- Read Only Memory (AREA)
- Semiconductor Integrated Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2138480A JPS56129374A (en) | 1980-02-22 | 1980-02-22 | Writing and cancelling methods of fixed memory |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2138480A JPS56129374A (en) | 1980-02-22 | 1980-02-22 | Writing and cancelling methods of fixed memory |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS56129374A JPS56129374A (en) | 1981-10-09 |
JPS6318864B2 true JPS6318864B2 (ko) | 1988-04-20 |
Family
ID=12053586
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2138480A Granted JPS56129374A (en) | 1980-02-22 | 1980-02-22 | Writing and cancelling methods of fixed memory |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS56129374A (ko) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6045999A (ja) * | 1983-08-24 | 1985-03-12 | Hitachi Ltd | 半導体不揮発性記憶装置 |
JPH01123454A (ja) * | 1987-11-07 | 1989-05-16 | Mitsubishi Electric Corp | 不揮発性半導体記憶装置 |
JP2848223B2 (ja) * | 1993-12-01 | 1999-01-20 | 日本電気株式会社 | 不揮発性半導体記憶装置の消去方法及び製造方法 |
US7796442B2 (en) | 2007-04-02 | 2010-09-14 | Denso Corporation | Nonvolatile semiconductor memory device and method of erasing and programming the same |
-
1980
- 1980-02-22 JP JP2138480A patent/JPS56129374A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS56129374A (en) | 1981-10-09 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR101004213B1 (ko) | 반도체 장치 | |
JP2009537932A (ja) | Sonosメモリデバイス及びsonosメモリデバイスの作動方法 | |
JPS649741B2 (ko) | ||
JP3070531B2 (ja) | 不揮発性半導体記憶装置 | |
JP4329293B2 (ja) | 不揮発性半導体メモリ装置および電荷注入方法 | |
KR20040031655A (ko) | 단일비트 비휘발성 메모리셀 및 그것의 프로그래밍 및삭제방법 | |
KR100324191B1 (ko) | 비휘발성반도체기억장치내에서의데이터소거방법 | |
JPH04105368A (ja) | 不揮発性半導体記憶装置及びその書き込み・消去方法 | |
JPH031574A (ja) | 不揮発性半導体記憶装置およびその製造方法 | |
JPH06302828A (ja) | 半導体不揮発性記憶装置 | |
JPH05251669A (ja) | 半導体記憶装置およびその書き換え方法 | |
JPS6318864B2 (ko) | ||
JP3375087B2 (ja) | 半導体記憶装置およびその記憶情報読出方法 | |
JPH05304301A (ja) | 不揮発性半導体メモリセルの書き換え方式 | |
JP3069607B2 (ja) | 半導体不揮発性メモリの動作方法 | |
JP2004158614A (ja) | 不揮発性半導体メモリ装置およびそのデータ書き込み方法 | |
JP2672688B2 (ja) | 不揮発性半導体記憶装置の駆動方法 | |
JP2006339554A (ja) | 不揮発性半導体記憶装置及びその動作方法 | |
JPS62183161A (ja) | 半導体集積回路装置 | |
JP3069358B2 (ja) | 半導体集積回路装置 | |
JP3186209B2 (ja) | 半導体装置の使用方法 | |
KR19990029181A (ko) | 불휘발성 반도체 기억장치 및 그 제조방법 | |
JPH07112018B2 (ja) | 半導体記憶装置 | |
JP3073725B2 (ja) | 半導体集積回路装置 | |
JPH0451072B2 (ko) |