JPS63187695A - 多層プリント配線板の製造方法 - Google Patents
多層プリント配線板の製造方法Info
- Publication number
- JPS63187695A JPS63187695A JP1873687A JP1873687A JPS63187695A JP S63187695 A JPS63187695 A JP S63187695A JP 1873687 A JP1873687 A JP 1873687A JP 1873687 A JP1873687 A JP 1873687A JP S63187695 A JPS63187695 A JP S63187695A
- Authority
- JP
- Japan
- Prior art keywords
- layer
- printed wiring
- insulating
- conductive
- base material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 10
- 239000010410 layer Substances 0.000 claims description 60
- 239000004020 conductor Substances 0.000 claims description 35
- 239000000463 material Substances 0.000 claims description 26
- 238000000034 method Methods 0.000 claims description 17
- 239000012790 adhesive layer Substances 0.000 claims description 10
- 238000005323 electroforming Methods 0.000 claims description 6
- 238000010438 heat treatment Methods 0.000 claims description 5
- 238000010030 laminating Methods 0.000 claims description 5
- 238000000151 deposition Methods 0.000 claims description 4
- 230000000379 polymerizing effect Effects 0.000 claims description 3
- 239000002184 metal Substances 0.000 description 9
- 229910052751 metal Inorganic materials 0.000 description 9
- 238000005530 etching Methods 0.000 description 6
- 239000000758 substrate Substances 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 239000004744 fabric Substances 0.000 description 4
- 239000003795 chemical substances by application Substances 0.000 description 3
- 238000007796 conventional method Methods 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 239000011810 insulating material Substances 0.000 description 3
- 238000007747 plating Methods 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 230000003746 surface roughness Effects 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 1
- 239000010953 base metal Substances 0.000 description 1
- ZCDOYSPFYFSLEW-UHFFFAOYSA-N chromate(2-) Chemical compound [O-][Cr]([O-])(=O)=O ZCDOYSPFYFSLEW-UHFFFAOYSA-N 0.000 description 1
- 239000006258 conductive agent Substances 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 210000004907 gland Anatomy 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000005488 sandblasting Methods 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- 239000011593 sulfur Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1873687A JPS63187695A (ja) | 1987-01-30 | 1987-01-30 | 多層プリント配線板の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1873687A JPS63187695A (ja) | 1987-01-30 | 1987-01-30 | 多層プリント配線板の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63187695A true JPS63187695A (ja) | 1988-08-03 |
| JPH0154877B2 JPH0154877B2 (enrdf_load_stackoverflow) | 1989-11-21 |
Family
ID=11979955
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1873687A Granted JPS63187695A (ja) | 1987-01-30 | 1987-01-30 | 多層プリント配線板の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63187695A (enrdf_load_stackoverflow) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002076577A (ja) * | 2000-08-23 | 2002-03-15 | Ibiden Co Ltd | プリント配線板及びその製造方法 |
| JP2002076578A (ja) * | 2000-08-25 | 2002-03-15 | Ibiden Co Ltd | プリント配線板及びその製造方法 |
-
1987
- 1987-01-30 JP JP1873687A patent/JPS63187695A/ja active Granted
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002076577A (ja) * | 2000-08-23 | 2002-03-15 | Ibiden Co Ltd | プリント配線板及びその製造方法 |
| JP2002076578A (ja) * | 2000-08-25 | 2002-03-15 | Ibiden Co Ltd | プリント配線板及びその製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0154877B2 (enrdf_load_stackoverflow) | 1989-11-21 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| EXPY | Cancellation because of completion of term |