JPS63183143A - 半導体装置用Ｃｕ合金製リ−ドフレ−ム材 - Google Patents

半導体装置用Ｃｕ合金製リ−ドフレ−ム材

Info

Publication number
JPS63183143A
JPS63183143A JP1308087A JP1308087A JPS63183143A JP S63183143 A JPS63183143 A JP S63183143A JP 1308087 A JP1308087 A JP 1308087A JP 1308087 A JP1308087 A JP 1308087A JP S63183143 A JPS63183143 A JP S63183143A
Authority
JP
Japan
Prior art keywords
lead frame
semiconductor devices
solder
frame material
materials
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1308087A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0422978B2 (enrdf_load_stackoverflow
Inventor
Rensei Futatsuka
二塚　錬成
Shunichi Chiba
俊一 千葉
Tadao Sakakibara
直男 榊原
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Shindoh Co Ltd
Original Assignee
Mitsubishi Shindoh Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Shindoh Co Ltd filed Critical Mitsubishi Shindoh Co Ltd
Priority to JP1308087A priority Critical patent/JPS63183143A/ja
Publication of JPS63183143A publication Critical patent/JPS63183143A/ja
Publication of JPH0422978B2 publication Critical patent/JPH0422978B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
JP1308087A 1987-01-22 1987-01-22 半導体装置用Ｃｕ合金製リ−ドフレ−ム材 Granted JPS63183143A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1308087A JPS63183143A (ja) 1987-01-22 1987-01-22 半導体装置用Ｃｕ合金製リ−ドフレ−ム材

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1308087A JPS63183143A (ja) 1987-01-22 1987-01-22 半導体装置用Ｃｕ合金製リ−ドフレ−ム材

Publications (2)

Publication Number Publication Date
JPS63183143A true JPS63183143A (ja) 1988-07-28
JPH0422978B2 JPH0422978B2 (enrdf_load_stackoverflow) 1992-04-21

Family

ID=11823187

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1308087A Granted JPS63183143A (ja) 1987-01-22 1987-01-22 半導体装置用Ｃｕ合金製リ−ドフレ−ム材

Country Status (1)

Country Link
JP (1) JPS63183143A (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02209442A (ja) * 1989-02-10 1990-08-20 Mitsubishi Shindoh Co Ltd 高強度Ｃｕ合金

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63109133A (ja) * 1986-10-23 1988-05-13 Furukawa Electric Co Ltd:The 電子機器用銅合金とその製造法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63109133A (ja) * 1986-10-23 1988-05-13 Furukawa Electric Co Ltd:The 電子機器用銅合金とその製造法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02209442A (ja) * 1989-02-10 1990-08-20 Mitsubishi Shindoh Co Ltd 高強度Ｃｕ合金

Also Published As

Publication number Publication date
JPH0422978B2 (enrdf_load_stackoverflow) 1992-04-21

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